HSP4024A
N-Ch 40V Fast Switching MOSFETs
Description
Product Summary
The HSP4024A is the high cell density trenched Nch MOSFETs, which provide excellent RDSON and
gate charge for most of the synchronous buck
VDS
40
V
RDS(ON),max
3.3
mΩ
ID
165
A
converter applications.
The HSP4024A meet the RoHS and Green Product
requirement, 100% EAS guaranteed with full
function reliability approved.
l
l
l
l
l
100% EAS Guaranteed
Green Device Available
Super Low Gate Charge
Excellent CdV/dt effect decline
Advanced high cell density Trench
technology
TO220 Pin Configuration
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
40
V
VGS
Gate-Source Voltage
ID@TC=25℃
ID@TC=100℃
IDM
±20
V
Continuous Drain Current, VGS @ 10V
1,6
165
A
Continuous Drain Current, VGS @ 10V
1,6
100
A
250
A
125
mJ
50
A
Pulsed Drain Current
2
EAS
Single Pulse Avalanche Energy
IAS
Avalanche Current
3
4
PD@TC=25℃
Total Power Dissipation
149
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-Ambient
RθJC
1
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Thermal Resistance Junction-Case
Ver 2.0
1
Max.
Unit
---
62
℃/W
---
0.84
℃/W
1
HSP4024A
N-Ch 40V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
2
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
40
---
---
V
VGS=10V , ID=30A
---
2.6
3.3
mΩ
VGS=VDS , ID =250uA
2
---
4.5
V
VDS=48V , VGS=0V , TJ=25℃
---
---
1
VDS=48V , VGS=0V , TJ=55℃
---
---
5
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=30A
---
53
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
0.8
---
Ω
Qg
Total Gate Charge (10V)
---
65
---
Qgs
Gate-Source Charge
---
24
---
Qgd
Gate-Drain Charge
---
21
---
Turn-On Delay Time
---
26
---
Td(on)
Tr
Td(off)
VDS=32V , VGS=10V , ID=20A
Rise Time
VDD=20V , VGS=10V , RG=3.3Ω,
---
38
---
Turn-Off Delay Time
ID=30A
---
63
---
uA
nC
ns
Fall Time
---
20
---
Ciss
Input Capacitance
---
4711
---
Coss
Output Capacitance
---
869
---
Crss
Reverse Transfer Capacitance
---
367
---
Min.
Typ.
Max.
Unit
VG=VD=0V , Force Current
---
---
165
A
VGS=0V , IS=1A , TJ=25℃
---
---
1.2
V
Tf
VDS=15V , VGS=0V , f=1MHz
pF
Diode Characteristics
Symbol
IS
Parameter
Conditions
1,5
Continuous Source Current
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
IF=30A , dI/dt=100A/µs ,
---
20.3
---
nS
Qrr
Reverse Recovery Charge
TJ=25℃
---
9.5
---
nC
Note :
2
1.The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is V DD=25V,VGS=10V,L=0.1mH,IAS=50A
4.The power dissipation is limited by 150℃ junction temperature
5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
6.Package limitation current is 85A.
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Ver 2.0
2
HSP4024A
N-Ch 40V Fast Switching MOSFETs
Typical Characteristics
Fig.2 On-Resistance vs. Gate-Source
VGS Gate to Source
Voltage (V)
Fig.1 Typical Output Characteristics
VDS=3
2V
ID=20
QG , Total Gate Charge (nC)
Fig.3 Forward Characteristics of Reverse
Fig.4 Gate-Charge Characteristics
Fig.5 Normalized VGS(th) vs. TJ
Fig.6 Normalized R DSON vs. TJ
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Ver 2.0
3
HSP4024A
N-Ch 40V Fast Switching MOSFETs
Capacitance (pF)
Ciss
Co
Crs
F=1.0MHz
VDS , Drain to Source Voltage(V)
Fig.7 Capacitance
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJC)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
P DM
SINGLE
T ON
T
D = TON/T
TJpeak = TC+P DMXRθJC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
EAS=
VDS
90%
Td(on)
Tr
Ton
Td(off)
VDD
IAS
Tf
VGS
Toff
Fig.10 Switching Time Waveform
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BVDSS
BVDSS-VDD
BVDSS
10%
VGS
1
L x IAS2 x
2
Fig.11 Unclamped Inductive Switching
Ver 2.0
4
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