VBFB2658
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P-Channel 60 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) ()
ID (A)d
0.053 at VGS = - 10 V
- 25
0.062 at VGS = - 4.5 V
- 20
VDS (V)
- 60
Qg (Typ)
26
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
TO-251
• High Side Switch for Full Bridge Converter
• DC/DC Converter for LCD Display
S
G
G D S
Top View
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise note)
Symbol
Limit
Drain-Source Voltage
VDS
- 60
Gate-Source Voltage
VGS
± 20
Parameter
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 125 °C
Avalanche Current, Single Pulse
Repetitive Avalanche Energy, Single Pulsea
Power Dissipation
L = 0.1 mH
TC = 25 °C
TA = 25 °C
- 20
A
- 100
IAS
- 22
EAS
24.2
38.5
PD
mJ
c
W
2.3b, c
TJ, Tstg
Operating Junction and Storage Temperature Range
V
- 25
ID
IDM
Pulsed Drain Current
Unit
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb
Maximum Junction-to-Case
Notes:
a. Duty cycle 1 %.
b. When mounted on 1" square PCB (FR-4 material).
c. See SOA curve for voltage derating.
d. Based up on TC = 25 °C.
Symbol
t 10 s
Steady State
RthJA
RthJC
Typical
Maximum
Unit
17
45
2.7
21
55
3.25
°C/W
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SPECIFICATIONS (TJ = 25 °C, unless otherwise note)
Symbol
Parameter
Test Conditions
Min .
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
VDS
VGS = 0 V, ID = - 250 µA
- 60
VGS(th)
VDS = VGS, ID = - 250 µA
-1
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
V
-3
V
VDS = 0 V, VGS = ± 20 V
± 100
nA
VDS = - 60 V, VGS = 0 V
-1
VDS = - 60 V, VGS = 0 V, TJ = 125 °C
- 50
VDS = - 60 V, VGS = 0 V, TJ = 150 ° C
Drain-Source On-State Resistancea
a
Forward Transconductance
RDS(on)
VDS - 5 V, VGS = - 10 V
- 125
- 30
A
VGS = - 10 V, ID = - 10 A
0.053
VGS = - 10 V, ID = - 10 A, TJ = 125 °C
0.102
VGS = - 10 V, ID = - 10 A, TJ = 150 °C
0.120
VGS = - 4.5 V, ID = - 5 A
0.062
VDS = - 15 V, ID = - 10 A
22
gfs
µA
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
90
Total Gate Chargec
Qg
26
c
Gate-Source Charge
Qgs
Gate-Drain Chargec
Qgd
c
Rise Timec
Turn-Off Delay
VDS = - 30 V, VGS = - 10 V, ID = - 10 A
Fall Timec
f = 1 MHz
td(on)
tr
Timec
td(off)
1710
130
pF
40
nC
4.5
7
Rg
Gate Resistance
Turn-On Delay Time
1140
VGS = 0 V, VDS = - 25 V, f = 1 MHz
VDD = - 30 V, RL = 3
ID - 19 A, VGEN = - 10 V, Rg = 2.5
tf
Drain-Source Body Diode and Characteristics (TC = 25 °C)
7
8
15
9
15
65
100
30
45
ns
b
IS
- 30
Pulsed Current
ISM
- 30
Forward Voltagea
VSD
IF = - 19 A, VGS = 0 V
-1
- 1.5
V
trr
IF = - 19 A, di/dt = 100 A/µs
41
61
ns
Continuous Current
Reverse Recovery Time
A
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
30
30
VGS = 10 thru 5 V
4V
25
ID - Drain Current (A)
ID - Drain Current (A)
25
20
15
10
3V
5
20
15
10
TC = 125 °C
5
25 °C
- 55 °C
0
0
2
4
6
8
0
0.0
10
0.5
1.0
VDS - Drain-to-Source Voltage (V)
Output Characteristics
2.5
3.0
3.5
4.0
4.5
0.12
TC = - 55 °C
0.10
RDS(on) - On-Resistance (Ω)
30
g fs - Transconductance (S)
2.0
Transfer Characteristics
35
25 °C
25
125 °C
20
15
10
5
0
0.08
VGS = 4.5 V
0.06
VGS = 10 V
0.04
0.02
0.00
0
10
5
15
20
25
30
0
10
5
15
20
25
30
ID - Drain Current (A)
VGS - Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
1800
20
V GS - Gate-to-Source Voltage (V)
1500
C - Capacitance (pF)
1.5
VGS - Gate-to-Source Voltage (V)
Ciss
1200
900
600
300
Coss
Crss
0
0
VDS = 30 V
ID = 10 A
16
12
8
4
0
10
20
30
40
VDS - Drain-to-Source Voltage (V)
Capacitance
50
60
0
10
20
30
40
50
Qg - Total Gate Charge (nC)
Gate Charge
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
40
ID = 10 A
I S - Source Current (A)
RDS(on) - On-Resistance (normalized)
1.9
VGS = 10 V
1.6
1.3
1.0
10
TJ = 150 °C
TJ = 25 °C
0.7
1
0.4
- 50
- 25
0
25
50
75
100
125
150
0.0
0.6
0.3
0.9
1.2
1.5
VSD - Source-to-Drain Voltage (V)
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
THERMAL RATINGS
25
100
Limited by rDS(on)*
100 ms
10
I D - Drain Current (A)
I D - Drain Current (A)
20
15
10
5
1s
DC
0.1
BVDSS Limited
0.01
0
0
25
50
75
100
125
150
10 s
1
TC = 25 °C
Single Pulse
0.001
0.1
TC - Case Temperature (°C)
* VGS
Maximum Drain Current
vs. Case Temperature
1
10
100
1000
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
10- 3
10 - 2
10 - 1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
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THERMAL RATINGS
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10- 2
10 -1
1
10
100
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
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TOĆ251AA
E
A
L2
Dim
A
A1
b
b1
b2
c
c1
D
E
e
L
L1
L2
L3
D
L3
L1
b1
L
b
MILLIMETERS
c1
b2
e
c
A1
INCHES
Min
Max
Min
Max
2.21
2.38
0.087
0.094
0.89
1.14
0.035
0.045
0.71
0.89
0.028
0.035
0.76
1.14
0.030
0.045
5.23
5.43
0.206
0.214
0.46
0.58
0.018
0.023
0.46
0.58
0.018
0.023
5.97
6.22
0.235
0.245
6.48
6.73
0.255
0.265
2.28 BSC
0.090 BSC
3.89
9.53
0.153
0.375
1.91
2.28
0.075
0.090
0.89
1.27
0.035
0.050
1.15
1.52
0.045
0.060
ECN: S-03946—Rev. E, 09-Jul-01
DWG: 5346
Note: Dimension L3 is for reference only.
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