LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Lonten N-channel 700V, 11A, 0.45Ω LonFETTM Power MOSFET
Description
LonFET
TM
Product Summary
Power MOSFET is fabricated using
VDS @ Tj,max
750V
RDS(on),max
0.45Ω
resulting device has extremely low on resistance,
IDM
30A
making it especially suitable for applications which
Qg,typ
23nC
advanced
super
junction
technology.
The
require superior power density and outstanding
efficiency.
Features
Ultra low RDS(on)
Ultra low gate charge (typ. Qg = 23nC)
100% UIS tested
RoHS compliant
TO-220MF
TO-263
TO-262
TO-251
TO-252
D
Applications
G
Power faction correction (PFC).
Switched mode power supplies (SMPS).
Uninterruptible power supply (UPS).
S
N-Channel MOSFET
Pb
Absolute Maximum Ratings
Parameter
Value
Unit
700
V
11
A
7
A
30
A
VGSS
±30
V
EAS
270
mJ
EAR
0.5
mJ
IAR
11
A
33
W
0.26
W/°C
TO-262 ( TC = 25°C )
125
W
- Derate above 25°C
1
W/°C
Drain-Source Voltage
Symbol
VDSS
Continuous drain current
( TC = 25°C )
ID
( TC = 100°C )
1)
Pulsed drain current
IDM
Gate-Source voltage
Avalanche energy, single pulse
2)
Avalanche energy, repetitive 3)
Avalanche current, repetitive
Power Dissipation
3)
TO-220MF ( TC = 25°C )
- Derate above 25°C
PD
Power Dissipation
Mounting torque To-262 ( M3 and M3.5 screws )
60
Mounting torque To-220MF ( M2.5 screws )
50
Ncm
Operating and Storage Temperature Range
TJ, TSTG
Continuous diode forward current
Diode pulse current
Version 2.0
2018
-55 to +150
°C
IS
11
A
IS,pulse
30
A
1
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Thermal Characteristics TO-262/TO-252/ TO-251/TO-263
Parameter
Symbol
Value
Unit
Thermal Resistance, Junction-to-Case
RθJC
2.5
°C/W
Thermal Resistance, Junction-to-Ambient
RθJA
62
°C/W
Tsold
260
°C
Value
Unit
Soldering temperature, wavesoldering only allowed
at leads. (1.6mm from case for 10s)
Thermal Characteristics TO-220MF
Parameter
Symbol
Thermal Resistance, Junction-to-Case
RθJC
3.8
°C/W
Thermal Resistance, Junction-to-Ambient
RθJA
80
°C/W
Tsold
260
°C
Soldering temperature, wavesoldering only allowed
at leads. (1.6mm from case for 10s)
Package Marking and Ordering Information
Device
Device Package
Marking
Units/Tube
LSD70R450GT
TO-220MF
LSD70R450GT
50
LSE70R450GT
TO-263-2L
LSE70R450GT
LSF70R450GT
TO-262
LSF70R450GT
LSG70R450GT
TO-252
LSG70R450GT
LSH70R450GT
TO-251
LSH70R450GT
Electrical Characteristics
Parameter
Units/Real
800
50
2500
4680
2500
Tc = 25°C unless otherwise noted
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Static characteristics
Drain-source breakdown voltage
BVDSS
VGS=0 V, ID=0.25 mA
700
-
-
V
Gate threshold voltage
VGS(th)
VDS=VGS, ID=0.25mA
2.5
3.5
4.5
V
Drain cut-off current
IDSS
VDS=700 V, VGS=0 V,
μA
Tj = 25°C
-
-
1
Tj = 125°C
-
10
-
Gate leakage current, Forward
IGSSF
VGS=30 V, VDS=0 V
-
-
50
nA
Gate leakage current, Reverse
IGSSR
VGS=-30 V, VDS=0 V
-
-
-50
nA
Drain-source on-state resistance
RDS(on)
VGS=10 V, ID=5.5 A
-
Tj = 25°C
-
0.40
0.45
Ω
Tj = 150°C
-
0.94
-
Gate resistance
RG
f=1 MHz, open drain
-
4.6
-
Input capacitance
Ciss
VDS = 25 V, VGS = 0 V,
-
879
-
Output capacitance
Coss
f = 1 MHz
-
460
-
Reverse transfer capacitance
Crss
-
6
-
Turn-on delay time
td(on)
VDD = 380V, ID = 5.5A
-
15
-
Rise time
tr
RG = 4.7Ω, VGS=10V
-
27
-
Turn-off delay time
td(off)
-
69
-
Ω
Dynamic characteristics
Version 2.0
2018
2
pF
ns
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Fall time
tf
-
11
-
Gate charge characteristics
Gate to source charge
Qgs
VDD=480 V, ID=5.5A,
-
6.2
-
Gate to drain charge
Qgd
VGS=0 to 10 V
-
8.5
-
Gate charge total
Qg
-
22.8
-
Vplateau
-
5.5
-
V
nC
Reverse diode characteristics
Diode forward voltage
VSD
VGS=0 V, IF=5.5A
-
1.0
-
V
Reverse recovery time
trr
VR=50 V, IF=11A,
-
345
-
ns
Reverse recovery charge
Qrr
dIF/dt=100 A/μs
-
3.8
-
μC
Peak reverse recovery current
Irrm
-
22
-
A
Notes:
1. Limited by maximum junction temperature, maximum duty cycle is 0.75.
2. IAS = 3A, VDD = 60V, Starting Tj= 25°C.
3. Repetitive Rating: Pulse width limited by maximum junction temperature.
Version 2.0
2018
3
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Electrical Characteristics Diagrams
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
VGS=6.5V
Drain current ID (A)
Drain current ID (A)
Common Source
Tc = 25°C
VDS=20 V
Pulse test
VGS=10V
VGS=7V
Common Source
Tc = 25°C
Pulse test
VGS=6V
VGS=5.5V
Drain−source voltage VDS (V)
Gate−source voltage VGS (V)
Figure 3. On-Resistance Variation vs. Drain Current
Figure 4. Threshold Voltage vs. Temperature
1.3
Vth , (Normalized)
Gate threshold voltage
RDS (on) (Ω)
1.2
VGS = 10V
Tc = 25°C
Pulse test
1.1
1
0.9
0.8
0.7
IDS=0.25 mA
Pulse test
0.6
0.5
-60
Drain current ID (A)
-20
0
20
40
60
80
100
120
140
Junction temperature Tj (°C)
Figure 5. Breakdown Voltage vs. Temperature
Figure 6. On-Resistance vs. Temperature
2.5
RDS(on), (Normalized)
Drain-Source On-Resistance
1.2
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
-40
1.1
1
0.9
VGS=0 V
V =0 V
IDSGS=0.25 mA
IDS=0.25 mA
Pulse
test
Pulse test
0.8
-60
-40
-20
0
20
40
60
80
100 120 140 160
Junction temperature Tj (°C)
Version 2.0
2018
2
1.5
1
VGS=10 V
V =10 V
IDSGS
=3.5 A
IDS=5.5 A
Pulse
test
Pulse test
0.5
0
-60
-40
-20
0
20
40
60
80
100 120 140 160
Junction temperature Tj (°C)
4
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160
LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Figure 7. Capacitance Characteristics
Figure 8. Gate Charge Characterist
Gate-Source Voltage VGS (V)
Capacitance (pF)
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Ciss
Coss
Notes:
f = 1 MHz
VGS=0 V
ID = 5.5A
Crss
Drain-Source Voltage VDS (V)
Total Gate Charge QG (nC)
Figure 9.1 Maximum Safe Operating Area
Figure 9.2 Maximum Safe Operating Area
TO-263-2L/TO-262/TO-252/TO-251
Drain current ID (A)
Drain current ID (A)
TO-220MF
Drain-Source Voltage VDS (V)
Drain-Source Voltage VDS (V)
Figure 10.1 Power Dissipation vs. Temperature
Figure 10.2 Power Dissipation vs. Temperature
TO-263-2L/TO-262/TO-252/TO-251
Drain power dissipation PD (W)
Drain power dissipation PD (W)
TO-220MF
Case temperature Tc (°C)
Case temperature Tc (°C)
Version 2.0
2018
5
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Figure 11.1 Transient Thermal Response Curve
Thermal Resistance
Z
θJC
Normalized Transient
TO-220MF
Pulse Width t (s)
Figure 11.1 Transient Thermal Response Curve
Thermal Resistance
Z
θJC
Normalized Transient
TO-263-2L/TO-262/TO-252/TO-251
Pulse Width t (s)
Version 2.0
2018
6
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Gate Charge Test Circuit & Waveform
Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
Version 2.0
2018
7
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Mechanical Dimensions for TO-263
E
A
L2
H2
A1
θ1
Ø P1
H
D1
DEP
A3
A2
θ1
L1
θ2
c
b
L
b1
e
MM
SYMBOL
L4
θ
2-θ2
E2
INCH
MIN
NOM
MAX
MIN
NOM
MAX
A
4.40
4.57
4.70
0.173
0.180
0.185
A1
1.22
1.27
1.32
0.048
0.050
0.052
A2
2.59
2.69
2.79
0.102
0.106
0.110
A3
0.00
0.10
0.20
0.000
0.004
0.008
b
0.77
0.813
0.90
0.030
0.032
0.035
b1
1.20
1.270
1.36
0.047
0.050
0.054
c
0.34
0.381
0.47
0.013
0.015
0.019
D1
8.60
8.70
8.80
0.339
0.343
0.346
E
10.00
10.16
10.26
0.394
0.400
0.404
E2
10.00
10.10
10.20
0.394
0.398
0.402
e
2.54 BSC
0.100 BSC
H
14.70
15.10
15.50
0.579
0.594
0.610
H2
1.17
1.27
1.40
0.046
0.050
0.055
L
2.00
2.30
2.60
0.079
0.091
0.102
L1
1.45
1.55
1.70
0.057
0.061
0.067
L2
2.50 REF
0.098 REF
L4
0.25 BSC
0.010 BSC
θ
0°
5°
8°
0°
5°
8°
θ1
5°
7°
9°
5°
7°
9°
θ2
1°
3°
5°
1°
3°
5°
ØP1
1.40
1.50
1.60
0.055
0.059
0.063
DEP
0.05
0.10
0.20
0.002
0.004
0.008
TO-263 Part Marking Information
Lonten Logo
Lonten
LSE70R450GT
Part Number
ABYWW99
“AB”
Foundry & Assembly Code
“99”
Manufacturing Code
“YWW”
Date Code
Version 2.0
2018
8
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Mechanical Dimensions for TO-252
E
c
L3
b3
COMMON DIMENSIONS
L5
θ1
mm
D1
SYMBOL
H
D
.1 K
×0 R
.2 MA
Ø 1 EP
TO
E1
A2
MIN
NOM
MAX
A
2.20
2.30
2.38
A1
0.00
—
0.10
A2
0.97
1.07
1.17
θ1
L4
θ1
e
b
θ2
b
0.72
0.78
0.85
b1
0.71
0.76
0.81
b3
5.23
5.33
5.46
c
0.47
0.53
0.58
c1
0.46
0.51
0.56
D
6.00
6.10
6.20
K
A
b
D1
C
A1
L
(L1)
6.70
4.70
4.83
4.92
2.286BSC
H
9.90
10.10
10.30
L
1.40
1.50
1.70
c
c1
b1
6.60
E1
e
PLATING
镀层
b
BASE METAL
基材
6.50
θ
L2
C
5.30REF
E
SECTION C-C
L1
2.90REF
L2
0.51BSC
L3
0.90
—
1.25
L4
0.60
0.80
1.00
L5
1.70
1.80
1.90
θ
0°
—
8°
θ1
5°
7°
9°
θ2
5°
7°
9°
K
0.40REF
TO-252 Part Marking Information
Lonten Logo
Lonten
LSG70R450GT
ABYWW99
Part Number
“AB”
Foundry & Assembly Code
“99”
Manufacturing Code
“YWW”
Date Code
Version 2.0
2018
9
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Mechanical Dimensions for TO-251
COMMON DIMENSIONS
MM
SYMBOL
MIN
NOM
MAX
A
2.20
2.30
2.38
A2
0.97
1.07
1.17
b
0.68
0.78
0.90
b2
0.00
0.04
0.10
b2’
0.00
0.04
0.10
b3
5.20
5.33
5.46
c
0.43
0.53
0.61
D
5.98
6.10
6.22
D1
5.30REF
E
6.40
6.60
6.73
E1
4.63
—
—
e
2.286BSC
H
16.22
16.52
16.82
L1
9.15
9.40
9.65
L3
0.88
1.02
1.28
L5
1.65
1.80
1.95
TO-251 Part Marking Information
Lonten Logo
“AB”
Foundry & Assembly Code
Lonten
LSH70R450GT
ABYWW99
Part Number
“99”
Manufacturing Code
“YWW”
Date Code
Version 2.0
2018
10
www.lonten.cc
LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Mechanical Dimensions for TO-220MF
E
G1
COMMON DIMENSIONS
A
G2
A1
Ø P1
F4
H1
Q
E
A5
A2
Ø P3
F2
D
θ2
ØP
MM
SYMBOL
F1
DEP
F3
F1
Ø P2
DEP
INCH
MIN
NOM
MAX
MIN
NOM
MAX
10.04
10.20
10.36
0.395
0.402
0.408
A
4.50
4.70
4.90
0.177
0.185
0.193
A1
2.34
2.54
2.74
0.092
0.100
0.108
A2
0.70
0.85
1.00
0.028
0.033
0.039
A4
2.65
2.75
2.85
0.104
0.108
0.112
D1
Ø P1
Ø P1
θ1
L1
G3
A4
θ1
b1
A5
1.00REF
0.039REF
C
0.42
0.50
0.58
0.017
0.020
0.023
D
15.67
15.87
16.07
0.617
0.625
0.633
Q
9.20REF
0.362REF
H1
6.70REF
0.264REF
L
b2
C
e
e
2.54BSC
0.1BSC
ØP
3.183REF
0.125REF
L
12.78
12.98
13.18
0.503
0.511
0.519
L1
3.25
3.45
3.65
0.128
0.136
0.144
D1
θ1
9.17REF
ØP1
1.40
1.50
1.60
0.055
0.059
0.063
ØP2
1.15
1.20
1.25
0.045
0.047
0.049
ØP3
K1
E
E1
TO-220MF Part Marking Information
Lonten Logo
0.362REF
3.45REF
0.136REF
θ1
5°
7°
9°
5°
7°
9°
θ2
-
45°
-
-
45°
-
DEP
0.05
0.10
0.15
0.002
0.004
0.006
F1
1.90
2.00
2.10
0.075
0.079
0.083
F2
13.80
13.90
14.00
0.543
0.547
0.551
F3
3.20
3.30
3.40
0.126
0.130
0.134
F4
5.30
5.40
5.50
0.209
0.213
0.217
G1
6.60
6.70
6.80
0.260
0.264
0.268
G2
6.90
7.00
7.10
0.272
0.276
0.280
G3
1.10
1.30
1.50
0.043
0.051
0.059
b1
1.05
1.20
1.35
0.041
0.047
0.053
b2
0.70
0.80
0.85
0.028
0.031
0.033
E1
9.90
10.00
10.10
0.390
0.394
0.398
K1
0.65
0.70
0.75
0.026
0.028
0.030
Lonten
LSD70R450GT
Part Number
ABYWW99
“AB”
Foundry & Assembly Code
“YWW”
Date Code
Version 2.0
2018
“99”
Manufacturing Code
11
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Mechanical Dimensions for TO-262
COMMON DIMENSIONS
A
θ3
Ø .014[0.356] M X Y
H2
D1
D
MIN
NOM
MAX
MIN
NOM
MAX
4.57
4.70
0.175
0.180
0.185
A1
1.22
1.27
1.32
0.048
0.050
0.052
A2
2.29
2.67
2.92
0.090
0.105
0.115
A
DEP
θ2
θ1
L1
A2
INCH
4.45
θ1
L2
PIN #1 ID
1脚标注
Ø P1
L3
MM
SYMBOL
A1
b
0.71
0.813
0.97
0.028
0.032
0.038
b2
1.22
1.270
1.40
0.048
0.050
0.055
c
2
0.38
0.381
0.76
0.015
0.015
0.030
D
23.20
23.61
24.02
0.913
0.930
0.946
D1
8.38
8.70
8.89
0.330
0.343
0.350
E1
10.03
10.16
10.54
0.395
0.400
0.415
b
L
b2
e
c
e
2.54 BSC
H2
-
-
1.31
-
-
0.052
L
13.34
13.73
14.10
0.525
0.541
0.555
L1
3.30
3.56
4.06
0.130
0.140
0.160
L2
θ4
1.49 REF
L3
E1
0.100 BSC
0.059 REF
3.4 REF
0.134 REF
ØP1
1.07
1.20
1.32
0.042
0.047
0.052
θ1
-
7°
-
-
7°
-
θ2
-
3°
-
-
3°
-
θ3
-
-
12°
-
-
12°
θ4
-
-
3°
-
-
3°
DEP
0.10
0.18
0.25
0.004
0.007
0.010
TO-262 Part Marking Information
Lonten Logo
Lonten
LSF70R450GT
Part Number
ABYWW99
“AB”
Foundry & Assembly Code
“99”
Manufacturing Code
“YWW”
Date Code
Version 2.0
2018
12
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LSD70R450GT/LSE70R450GT/LSF70R450GT/LSG70R450GT/LSH70R450GT
LonFET
Disclaimer
The content specified herein is for the purpose of introducing LONTEN's products (hereinafter "Products"). The
information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account when
designing circuits for mass production.
LONTEN does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of the Products or technical information described in this document.
The Products are not designed or manufactured to be used with any equipment, device or system which requires
an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or
create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery,
nuclear-reactor controller, fuel-controller or other safety device). LONTEN shall bear no responsibility in any way
for use of any of the Products for the above special purposes.
Although LONTEN endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard them against the possibility of physical injury,
and injury or damage caused by fire in the event of the failure of a LONTEN product.
The content specified herein is subject to change for improvement without notice. When using a LONTEN product,
be sure to obtain the latest specifications.
Oct. 2018 Revision 2.0
Version 2.0
2018
13
www.lonten.cc