HL-PC-2012H322W-L(6000K-7000K) 数据手册
Under Development
Mass production
RoHS
Specification
规 格 书
Customer Name:
客户名称:
Customer P/N:
客户品号:
Factory P/N: HL-PC-2012H322W-L
公司品号:
Sending Date:
送样日期:
Client approval
Hongli approval
客户审核
鸿利智汇审核
Approval
Audit
Approval
Audit
Confirmation
核准
确认
核准
确认
制作
揭秒业
□ Qualified
接受
□ Disqualified
不接受
DATE:
日期:
Adr:No.1,Xianke Yi Road,Huadong Town,Huadu District,Guangzhou,China
地址:中国广州市花都区花东镇先科一路1号
Tel/电话:020-37705135
Fax/传真:020-37705136
Web/网址:www.honglitronic.com
注:1.此规格书以中英文方式书写,若有冲突以中文版本为准文本.
2.此规格书的最终解释权归鸿利智汇集团股份有限公司
3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式
SPEC NO:B-12-A-2245
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DATE: AUG/26/2017
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HL-PC-2012H322W-L
Features( 特征)
Extremely wide viewing angle.(宽的发光角度)
Suitable for all SMT assembly and solder process.(适用于所有的SMT组装和焊接工艺)
Available on tape and reel.(适用于载带及卷轴)
Moisture sensitivity level: Level 4.(防潮等级 Level 4)
Package:4000pcs/reel..(包装每卷4000PCS)
RoHS compliant. (RoHS 认证)
Description(描述)
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
The White LED which was fabricated using a blue chip and the phosphor
白光LED由蓝光芯片与荧光粉激发而成
注意:操作时应注意静电敏感
释放设备装置
Applications(应用)
■ Optical indicator(光学指示)
Package Dimensions(封装尺寸)
■ Indoor display(室内显示)
■ Backlight for LCD, switch and Symbol, display
(LCD背光、转换器,开关和标志,显示器等)
■ General use(一般应用)
Recommended Soldering Pattern
(建议焊盘尺寸图)
3.00 [0.12]
1.20 [0.05]
0.90 [0.04]
Notes:(备注)
1. Mark the size of the unit is mm.marked in brackets(标注尺寸单位为毫米,括号内标注为英寸)
2. All dimensions allow tolerance ±0.1mm(所有尺寸允许公差±0.1mm )
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HL-PC-2012H322W-L
Selection Guide(选择指南)
HL-PC-2012H322W-L
Lens Type
胶体类型
Dice
Part No. 型号
Luminous intensity(mcd)
光强@ 10mA
White(InGaN )
Yellow Diffused
Viewing
Angle
角度
Min
Typ
2θ1/2
--
500
140°
Note:(备注)
The 2θ1/2 measurement error ±10 degrees( 角度测试误差为±10° )
2. the above luminous intensity measurement allowance tolerance ±10%.
上述发光强度的测试允许公差为±10%
Electrical / Optical Characteristics at Ta=25°C
电性与光学特性
Parameter(参数)
Symbol
(符号)
Min.
(最小)
Typ.
(平均)
Max.
(最大)
Units
(单位)
Test Conditions
测试条件
Forward Voltage
正向电压
VF
2.7
--
3.5
V
IF=10mA
X
--
0.3045
--
--
IF=10mA
Y
--
0.308
--
--
IF=10mA
Color Coordinates
色度坐标
Absolute Maximum Ratings at Ta=25°C
绝对最大额定值
Parameter(参数)
Symbol(符号)
Rating(值)
Units(单位)
Power Dissipation(功耗)
Pd
70
mW
Forward Current(正向电流)
IF
20
mA
Peak Forward Current [1](峰值正向电流)
IFP
100
mA
Operating Temperature(操作温度)
Topr
-40 ~ +85
℃
Storage Temperature(保存温度)
Tstg
-40 ~ +100
℃
Note:(备注)
1. 1/10 Duty cycle, 0.1ms pulse width.(脉宽0.1ms,周期1/10)
2. The above forward voltage measurement allowance tolerance is ±
0.1V.(以上所示电压测量误差±0.1V)
3. The above color coordinates measurement allowance tolerance is ±0.003. (以上所示坐标测量误差±0.003)
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Typical optical characteristics curves 典型光学特性曲线
Ambient Temperature vs. Forward Current
Forward Current VS. Relative Intensity
正向电流与相对光强特性曲线
环境温度与正向电流特性曲线
Forward Voltage VS. Forward Current
Ambient Temperature VS. Relative Intensity
环境温度与相对光强特性曲线
正向电压与正向电流特性曲线
Relative Luminous Intensity
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
Ambient Temperature
Relative spectral emission
60
80
Ta(℃)
Radiation diagram
相对光谱分布特性曲线
辐射图特性曲线
Relative luminous intensity
1.0
0.8
0.6
0.4
0.2
0.0
380
460
540
620
700
780
Wavelength(nm)
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Reliability Test Items And Conditions 信赖性测试项目及条件
Test Items
项目
Ref.Standard
参考标准
Test Condition
测试条件
Time
时间
Quantity
数量
Ac/Re
接收/拒收
Reflow
回流焊
JESD22-B106
Temp:260℃max
T=10 sec
3 times.
22Pcs.
0/1
Temperature Cycle
温度循环
JESD22-A104
100℃±5℃ 30 min.
↑↓5 min
-40℃±5℃ 30 min.
100 Cycles
22Pcs.
0/1
High Temperature Storage
高温保存
JESD22-A103
Temp:100℃±5℃
1000Hrs.
22Pcs.
0/1
Low Temperature Storage
低温保存
JESD22-A119
Temp:-40℃±5℃
1000Hrs.
22Pcs.
0/1
Life Test
常温通电
JESD22-A108
Ta=25℃±5℃
IF=10mA
1000Hrs.
22Pcs.
0/1
High Temperature
High Humidity
高温高湿保存
JESD22-A101
85℃±5℃/ 85%RH
1000Hrs.
22Pcs.
0/1
Criteria For Judging Damage 失效判定标准
Test Items
项目
Symbol
符号
Test Condition
测试条件
Criteria For Judgement
判定标准
Min. 最小
Max. 最大
Forward Voltage
正向电压
VF
IF=10mA
--
U.S.L*)x1.1
Luminous Flux
光通量
lm
IF=10mA
L.S.L*)x0.7
--
U.S.L: Upper standard level
规格上限
L.S.L: Lower standard level
规格下限
*The technical information shown in the data sheets are limited to the typical characteristics and
circuit examples of the referenced products. It does not constitute the warranting of industrial
property nor the granting of any license.
数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许
可的授权
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SMT Reflow Soldering Instructions SMT回流焊说明
1.Reflow soldering should not be done more than
two times. 回流焊不可以做两次以上
2.When soldering , do not put stress on the LEDs
during heating
当焊接时,不要在材料受热时用力压胶体表面
Soldering iron 烙铁焊接
1.When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds
当手工焊接时,烙铁的温度必须小于300℃,时间不可超过3秒
2.The hand solder should be done only one times
手工焊接只可焊接一次
Repairing 修补
Repair should not be done after the LEDs have been soldered.
When repairing is unavoidable, a double-head soldering iron should
be used (as below figure). It should be confirmed in advance
whether the characteristics of LEDs will or will not be damaged by
repairing.
LED回流焊后不应该修复,当修复是不可避免时,必须使用双头烙铁(如下
图),但必须事先确认此种方式会或不会损坏LED本身的特性。
Cautions 注意事项
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on
the top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use
the picking up nozzle, the pressure on the silicone resin should be proper.
LED封装为硅胶,故LED胶体表面较软,用力按压胶体表面会影响LED可靠性,因此应有预防措施避免在封装的零件上的
强大压力,当使用吸嘴时,胶体表面的压力应是恰当的。
3.Do not stack together assembled PCBs containing
LEDs. Impact may scratch the silicone lens or damage
the internal circuitry
4.Not suitable to operate in acidic environment, PH
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