HX8001-AJC

HX1001 HX8001 Synchronous Buck-Boost DC/DC Regulator Features Description
Synchronous rectification: Up to 95% The HX8001 is high efficiency, fixed frequency, efficiency Buck-Boost DC/DC converters which operates Single inductor from input voltages above, below or equal to the Fixed frequency operation with battery output voltage. The devices are suitable for voltages above, below or equal to the single lithium-ion, multicell alkaline or NiMH output applications where the output voltage is within









： Quiescent current 1mA (50uA low power the battery voltage range. mode: mode pin high) The switching frequencies up to 1.5 MHz could Up to 600mA continuous output current be fixed by employing an external resistor, and 1.8V to 5.5V input and output voltage range the oscillator could be synchronized to an Programmable oscillator frequency from external clock. the quiescent current is 1mA, 350kHz to 1.5MHz and this feature maximizing the battery life in No Schottky Diodes required portable applications. VOUT disconnected from VIN during shutdown ＜ Shutdown current: IQ 1µA Package: small thermally enhanced 10-pin MSOP Other features include a 1 µA shutdown, soft-start control, thermal shutdown and current limit. The HX8001 converters are available in the 10-pin thermally enhanced MSOP packages (or upon request). Application



Digital cameras and Wireless handsets Palmtop computers Handheld instruments MP3/MP4 players w w w. h x s e m i . c o m 1 HX8001 Typical Applications Absolute Maximum Ratings






～ +6V VRT,FB,SHDN/SS, SYNC ………………………………………….…………………- 0.3 V ～+ 6 V V ………………………………………….……………………..……….….…..……- 0.3 V ～ + 6 V V ……………………………………...……………………………….….…..….......- 0.3 V ～ + 6 V Operating Temperature Range ………………...………….…………....….…........- 40℃ ～ + 85℃ Lead Temperature (Soldering 10 sec.) ….………………...………...….….…………………+ 300℃ Storage Temperature Range …………………...……………………….….……..- 65℃ ～ + 150℃ VIN ……………………………………………………………………….………….……- 0.3 V SW OUT Pin Assignment PIN NUMBER MSOP-10 PIN NAME 1 RT 2 MS MODE/SYNC 3 SW1 Switch 1 4 SW2 Switch 2 5 GND Ground 6 VOUT Output 7 VIN 8 EN Input ON/OFF Control (High Enable) 9 FB Feedback 10 VC Error Amp Output FUNCTION Program the Oscillator MSOP-10L www.hxsemi.com Frequency 2 HX8001 Electrical Characteristics Operating Conditions: TA=25 ℃, V IN=3.6V PARAMETER unless otherwise specified. CONDITIONS MIN Input Start-Up Voltage TYP MAX UNITS 1.8 1.9 V Input Operating Range 1.8 5.5 V Output Voltage Adjust Range 2.5 5.5 V 1.212 1.220 V 0.1 1 µA Feedback Voltage Quiescent Shutdown 1.200 Current, EN=0V, Not Including Switch Leakage ， SYNC=0V Quiescent Current, Active VC=0V NMOS Switch Leakage Switches B and C PMOS Switch Leakage Switches A and D NMOS Switch Resistance On PMOS Switch Resistance On mA 0.1 5 10 0.19 Ω Switches A and D 0.22 Ω 1 Boost (% Switch C On) 55 Buck (% Switch A On) 100 A 75 % % Minimum Duty Cycle Frequency Accuracy 0.8 SYNC Input High 1 0 % 1.4 MHz 2 SYNC Input Low SYNC Input Current µA µA Switches B and C Input Current Limit Maximum Duty Cycle 1 0.4 VSYNC=5.5V 0.01 1 V µA Error Amp AVOL 90 dB Error Amp Source Current 1.5 µA Error Amp Sink Current 380 A EN Input High EN Input Low When IC is Enabled 1.8 0.4 EN Threshold When EA is at Maximum Boost Duty Cycle 2.2 EN Input Current VEN=5.5V 0.01 www.hxsemi.com V V 1 3 µA HX8001 Typical Performance Characteristics Efficiency vs. Output Current (VOUT=3.2V) 100 90 100 90 VIN =4.2V 80 80 70 Efficiency (%) Efficiency (%) Efficiency vs. Output Current (VOUT=5V) V IN =2.7V 60 VIN =3.6V 50 40 30 70 V IN =4.2V V IN =3V 60 50 40 30 20 20 10 10 0 VIN =2.7V 0 0 200 400 600 800 1000 1200 0 100 200 300 400 500 600 700 Output Current (mA) Output Current (mA) Output Voltage vs. Load Current (VIN=3.6V,VOUT=3.2V) Output Voltage vs. Load Current (VIN=4.2V,VOUT=5V) 3.21 5.24 3.209 5.21 Output Voltage (V) Output Voltage (V) 3.208 3.207 3.206 3.205 3.204 3.203 5.18 5.15 5.12 5.09 5.06 3.202 5.03 3.201 3.2 5 0 200 400 600 Load Current (mA) www.hxsemi.com 800 1000 0 100 200 300 400 500 Load Current (mA) 4 600 700 HX8001 Application Information RT (Pin 1): Timing Resistor to Program the Oscillator Frequency. The programming frequency range is 300kHzto 2MHz. Mode (Pin 2): Synchronization of the internal oscillator. A clock frequency of twice the desired switching frequency and with a pulse width between 100ns and 2µs is applied. The oscillator free running frequency is set slower than the desired synchronized switching frequency to guarantee sync. The oscillator RT component value required is given by: Where fSW = desired synchronized switching frequency. SW1 (Pin 3): Switch Pin Where the Internal Switches A and B are Connected. Connect inductor from SW1 to SW2. An optional Schottky diode can be connected from SW1 to ground. Minimize trace length to keep EMI down. SW2 (Pin 4): Switch Pin Where the Internal Switches C and D are connected. For applications with output voltages over 4.3V, a Schottky diode is required from SW2 to VOUT to ensure the SW pin does not exhibit excess voltage. GND (Pin 5): Signal and Power Ground for the IC. VOUT (Pin 6): Output of the Synchronous Rectifier. A filter capacitor is placed from VOUT to GND. VIN (Pin 7): Input Supply Pin, Internal VCC for the IC. A ceramic bypass capacitor as close to the VIN pin and GND (Pin 5) is required. EN (Pin 8): Combined Soft-Start and Shutdown. Grounding this pin shuts down the IC. Tie to >1.5V to enable the IC and > 1.8V to ensure the error amp is not clamped from soft-start. An RC from the shutdown command signal to this pin will provide a soft-start function by limiting the rise time of the VC pin. FB (Pin 9): Feedback Pin. Connect resistor divider tap here. The output voltage can be adjusted from 2.5V to 5.5V. The feedback reference voltage is typically 1.212V. VC (Pin 10): Error Amp Output. A frequency compensation network is connected from this pin to the FB pin to compensate the loop. www.hxsemi.com 5 HX8001 Packaging Information MSOP-10 Package Outline Dimension Symbol A A1 A2 b c D e E E1 L θ Dimensions in Millimeters Min Max 0.820 1.100 0.020 0.150 0.750 0.950 0.180 0.280 0.090 0.230 2.900 3.100 0.50(BSC) 2.900 3.100 4.750 5.050 0.400 0.800 0° 6° Dimensions in Inches Min Max 0.032 0.043 0.001 0.006 0.030 0.037 0.007 0.011 0.004 0.009 0.114 0.122 0.020(BSC) 0.114 0.122 0.187 0.199 0.016 0.031 0° 6° Subject changes without notice www.hxsemi.com 6 Information furnished by Hexin Semiconductor is believed to be accurate and reliable. However, no responsibility is assumed for its use