TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
SCHEMATIC
Description
The TD814 series combine two AlGaAs infrared
emitting diodes as the AC input which is optically
coupled to a silicon planar phototransistor
1
4
2
3
detector in a plastic DIP4 package with different
lead forming options.
With the robust coplanar double mold structure,
TD814 series provide the most stable isolation
feature.
Features
High isolation 5000 VRMS
CTR flexibility available see order
information
PIN DEFINITION
1. Anode/Cathod
2. Cathode/Anode
3. Emitter
4. Collector
PACKAGE OUTLINE
DC input with transistor output
Operating temperature range - 55 °C to
110 °C
REACH compliance
Halogen free
MSL class 1
Regulatory Approvals
UL - UL1577
VDE - EN60747-5-5(VDE0884-5)
CQC – GB4943.1, GB8898
Applications
AC line monitor
Programmable controller
Telephone line interface
System appliance
Measurement instrument
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
1
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
UNIT
NOTE
INPUT
Forward Current
IF
±60
mA
Peak Forward Current
IFP
±1
A
Reverse Voltage
VR
6
V
Input Power Dissipation
PI
100
mW
Collector - Emitter Voltage
VCEO
80
V
Emitter - Collector Voltage
VECO
7
V
Collector Current
IC
50
mA
Output Power Dissipation
PO
150
mW
Total Power Dissipation
Ptot
200
mW
Isolation Voltage
Viso
5000
Vrms
Operating Temperature
Topr
-55~110
°C
Storage Temperature
Tstg
-55~125
°C
Soldering Temperature
Tsol
260
°C
1
OUTPUT
COMMON
2
Note 1. 100μs pulse, 100Hz frequency
Note 2. AC For 1 Minute, R.H. = 40 ~ 60%
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
2
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
ELECTRICAL OPTICAL CHARACTERISTICS at Ta=25°C
PARAMETER
SYMBO
MAX
MIN TYP.
L
.
UNIT
TEST CONDITION NOTE
INPUT
Forward Voltage
VF
-
1.24 1.4
Reverse Current
IR
-
-
Input Capacitance
Cin
-
10
V
IF=±10mA
10
μA
VR=6V
-
pF
V=0, f=1kHz
OUTPUT
Collector Dark
Current
ICEO
-
-
100
nA
VCE=20V, IF=0
Collector-Emitter
Breakdown Voltage
BVCEO
35
-
-
V
IC=0.1mA, IF=0
Emitter-Collector
Breakdown Voltage
BVECO
7
-
-
V
IE=0.1mA, IF=0
TRANSFER CHARACTERISTICS
Current
Transfer
Ratio
TD814
TD814A
CTR
TD814B
20
-
300
50
-
150
80
-
400
CTR Symmetry
0.7
-
1.3
Collector-Emitter
Saturation Voltage
VCE(sat)
-
0.06 0.2
Isolation Resistance
RISO
Floating Capacitance
CIO
-
Cut-off Frequency
fc
Response Time
(Rise)
Response Time
(Fall)
%
IF=±1mA, VCE=5V
IF=±1mA, VCE=5V
V
IF=±20mA, IC=1mA
-
Ω
DC500V, 40 ~ 60%
R.H.
0.4
1
pF
V=0, f=1MHz
-
80
-
kHz
VCE=2V, IC=2mA
RL=100Ω,-3dB
tr
-
3
18
μs
tf
-
4
18
μs
10^1 10^1
2
4
VCE=2V, IC=2mA
RL=100Ω
4
3
3
Note 3. Fig.12&13
Note 4. Fig.14
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
3
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
CHARACTERISTIC CURVES
Fig.1 Forward Current
vs. Ambient Temperature
Fig.2 Collector Power Dissipation
vs. Ambient Temperature
Fig.3 Forward Current
vs. Forward Voltage
Fig.4 Collector Dark Current
vs. Ambient Temperature
Fig.5 Collector Current
Fig.6 Collector Current
vs. Collector-emitter Voltage
vs. Collector-emitter Voltage
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
4
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
CHARACTERISTIC CURVES
Fig.7 Normalized Current Transfer Ratio
vs. Forward Current
Fig.8 Normalized Current Transfer Ratio
vs. Ambient Temperature
Fig.9 Collector-emitter Saturation Voltage
vs. Ambient Temperature
Fig.10 Switching Time
vs. Load Resistance
Fig.11 Frequency Response
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
5
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
TEST CIRCUITS
Fig.12 Test Circuits of Response Time
Fig.13 Curves of Response Time
Fig.14 Test Circuits of Frequency Response
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
6
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated)
Standard DIP – Through Hole (DIP Type)
Gullwing (400mil) Lead Forming – Through Hole (M Type)
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
7
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated)
Surface Mount Lead Forming (S Type)
Surface Mount (Low Profile) Lead Forming (SL Type)
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
8
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated)
Surface Mount (Gullwing) Lead Forming (SLM Type)
RECOMMENDED SOLDER MASK (Dimensions in mm unless otherwise stated)
Surface Mount Lead Forming & Surface Mount (Low Profile) Lead Forming
Surface Mount (Gullwing) Lead Forming
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
9
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
TUBE SPECIFICATIONS (Dimensions in mm unless otherwise stated)
Standard DIP
Option M
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
10
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
BOX SPECIFICATIONS (Tube Type)
Inner Box
L x W x H = 52.5cm x 10.7cm x 4.7cm
Outer Box
L x W x H = 53.5cm x 23.5cm x 25.5cm
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
11
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
CARRIER TAPE SPECIFICATIONS (Dimensions in mm unless otherwise stated)
Option S(T1) & SL(T1)
Option S(T2) & SL(T2)
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
12
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
CARRIER TAPE SPECIFICATIONS (Dimensions in mm unless otherwise stated)
Option S(T3) & SL(T3)
Option S(T4) & SL(T4)
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
13
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
CARRIER TAPE SPECIFICATIONS (Dimensions in mm unless otherwise stated)
Option SLM(T1)
Option SLM(T2)
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
14
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
REEL SPECIFICATIONS (Dimensions in mm unless otherwise stated)
Option S & Option SL
Option SLM
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
15
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
BOX SPECIFICATIONS (Reel Type)
Inner Box
L x W x H = 36cm x 36cm x 6.9cm
Outer Box
L x W x H = 45cm x 38cm x 38cm
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
16
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
ORDERING AND MARKING INFORMATION
MARKING INFORMATION
TD
814X
VYAWW
TD
814
X
V
Y
: Company Abbr.
: Part Number
: CTR Rank
: VDE Option
: Fiscal Year
A
WW
: Manufacturing Code
: Work Week
ORDERING INFORMATION
LABEL INFORMATION
TD814X(Y)(Z)-GV
TD – Company Abbr.
814 – Part Number
X – Rank (A/B or None)
Y – Lead Form Option (M/S/SL/SLM/None)
Z – Tape and Reel Option (T1/T2/T3/T4)
G – Green
V – VDE Option (V or None)
Packing Quantity
Option
Quantity
Quantity – Inner box
Quantity – Outer box
None
100 Units/Tube
32 Tubes/Inner box
10 Inner box/Outer box = 32k Units
M
100 Units/Tube
32 Tubes/Inner box
10 Inner box/Outer box = 32k Units
S(T1)
1500 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 22.5k Units
S(T2)
1500 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 22.5k Units
S(T3)
1000 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 15k Units
S(T4)
1000 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 15k Units
SL(T1)
1500 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 22.5k Units
SL(T2)
1500 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 22.5k Units
SL(T3)
1000 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 15k Units
SL(T4)
1000 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 15k Units
SLM(T1)
1500 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 22.5k Units
SLM(T2)
1500 Units/Reel
3 Reels/Inner box
5 Inner box/Outer box = 22.5k Units
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
17
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
REFLOW INFORMATION
REFLOW PROFILE
Profile Feature
Sn-Pb Assembly Profile
Pb-Free Assembly Profile
Temperature Min. (Tsmin)
100
150°C
Temperature Max. (Tsmax)
150
200°C
Time (ts) from (Tsmin to Tsmax)
60-120 seconds
60-120 seconds
Ramp-up Rate (tL to tP)
3°C/second max.
3°C/second max.
Liquidous Temperature (TL)
183°C
217°C
Time (tL) Maintained Above (TL)
60 – 150 seconds
60 – 150 seconds
Peak Body Package Temperature
235°C +0°C / -5°C
260°C +0°C / -5°C
Time (tP) within 5°C of 260°C
20 seconds
30 seconds
Ramp-down Rate (TP to TL)
6°C/second max
6°C/second max
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
18
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
TEMPERATURE PROFILE OF SOLDERING
WAVE SOLDERING (JESD22-A111 COMPLIANT)
HAND SOLDERING BY SOLDERING IRON
Soldering Temperature
380+0/-5°C
Soldering Time
3 sec max.
One time soldering is recommended for all soldering method.
Do not solder more than three times for IR reflow soldering.
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
19
TD814 Series
www.tdled.com
DIP4, AC Input, Photo Transistor Coupler
DISCLAIMER
LIGHTNING is continually improving the quality, reliability, function and design. LIGHTNING
reserves the right to make changes without further notices.
The characteristic curves shown in this datasheet are representing typical performance which are
not guaranteed.
LIGHTNING makes no warranty, representation or guarantee regarding the suitability of the
products for any particular purpose or the continuing production of any product. To the maximum
extent permitted by applicable law, LIGHTNING disclaims (a) any and all liability arising out of the
application or use of any product, (b) any and all liability, including without limitation special,
consequential or incidental damages, and (c) any and all implied warranties, including warranties of
fitness for particular
The products shown in this publication are designed for the general use in electronic applications
such as office automation, equipment, communications devices, audio/visual equipment, electrical
application and instrumentation purpose, non-infringement and merchantability.
This product is not intended to be used for military, aircraft, automotive, medical, life sustaining or
lifesaving applications or any other application which can result in human injury or death.
Please contact LIGHTNING sales agent for special application request.
Immerge unit’s body in solder paste is not recommended.
Parameters provided in datasheets may vary in different applications and performance may vary
over time. All operating parameters, including typical parameters, must be validated in each
customer application by the customer’s technical experts. Product specifications do not expand or
otherwise modify LIGHTNING’s terms and conditions of purchase, including but not limited to the
warranty expressed therein.
Discoloration might be occurred on the package surface after soldering, reflow or long-time use. It
neither impacts the performance nor reliability.
Document No: DWI-022
Rev:A01
Release Date: 2020/1/11
20