LNG07R085H
Lonten N-channel 70V, 70A, 8.5mΩ Power MOSFET
Description
Product Summary
These N-Channel enhancement mode power field
VDSS
effect
transistors
are
trench
using
DMOS
technology. This advanced technology has been
70V
RDS(on).max@ VGS=10V
8.5mΩ
ID
70A
especially tailored to minimize on-state resistance,
provide superior switching performance, and with
Pin Configuration
stand high energy pulse in the avalanche and
commutation mode. These devices are well suited
for high efficiency fast switching applications.
Features
70V,70A,RDS(on).max=8.5mΩ@VGS = 10V
Improved dv/dt capability
Fast switching
100% EAS Guaranteed
Green device available
TO-252
D
Applications
Motor Drives
UPS
DC-DC Converter
G
Pb
S
N-Channel MOSFET
Absolute Maximum Ratings
TC = 25°C unless otherwise noted
Parameter
Symbol
Value
Unit
70
V
70
A
44
A
IDM
280
A
Gate-Source voltage
VGSS
±20
V
Avalanche energy
EAS
144
mJ
Power Dissipation
PD
78
W
Storage Temperature Range
TSTG
-55 to +150
°C
Operating Junction Temperature Range
TJ
-55 to +150
°C
Drain-Source Voltage
Continuous drain current
VDSS
( TC = 25°C )
( TC = 100°C )
Pulsed drain current
1)
2)
ID
Thermal Characteristics
Value
Unit
Thermal Resistance, Junction-to-Case
Parameter
RθJC
Symbol
1.6
°C/W
Thermal Resistance, Junction-to-Ambient3)
RθJA
125
°C/W
Package Marking and Ordering Information
Device
Device Package
Marking
Units/Reel
LNG07R085H
TO- 252
LNG07R085H
2500
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Electrical Characteristics
Parameter
LNG07R085H
TJ = 25°C unless otherwise noted
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Static characteristics
Drain-source breakdown voltage
BVDSS
VGS=0 V, ID=250uA
70
---
---
V
Gate threshold voltage
VGS(th)
VDS=VGS, ID=250uA
2.0
3.0
4.0
V
Drain-source leakage current
IDSS
VDS=70 V, VGS=0 V, TJ = 25°C
---
---
1
μA
VDS=56 V, VGS=0 V, TJ = 125°C
---
---
30
μA
Gate leakage current, Forward
IGSSF
VGS=20 V, VDS=0 V
---
---
100
nA
Gate leakage current, Reverse
IGSSR
VGS=-20 V, VDS=0 V
---
---
-100
nA
Drain-source on-state resistance
RDS(on)
VGS=10 V, ID=30 A,TJ = 25°C
---
7.2
8.5
mΩ
Forward transconductance
gfs
VDS =5 V , ID=30A
---
63
---
S
---
3570
---
---
248
---
---
197
---
---
17.8
---
---
27.6
---
---
102
---
---
28.6
---
---
3.25
---
---
21.2
---
Dynamic characteristics
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Gate resistance
Rg
VDS = 25 V, VGS = 0 V,
f= 1MHz
VDD = 30V,VGS=10V, ID =30 A
VGS=0V, VDS=0V, f=1MHz
pF
ns
Ω
Gate charge characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
VDS=30 V, ID=30A,
---
17.9
---
Gate charge total
Qg
VGS= 10 V
---
65.4
---
Gate plateau voltage
Vplateau
---
5
---
V
nC
Drain-Source diode characteristics and Maximum Ratings
Continuous Source Current
IS
---
---
65
A
Pulsed Source Current4)
ISM
---
---
260
A
Diode Forward Voltage
VSD
VGS=0V, IS=30A, TJ=25℃
---
---
1.2
V
Reverse Recovery Time
trr
IS=25A, di/dt=100A/us,
---
28.4
---
ns
Reverse Recovery Charge
Qrr
TJ=25℃
---
21.3
---
nC
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature.
2: VDD=35V, VGS=10V, L=0.5mH, IAS=24A, RG=25Ω, Starting TJ=25℃.
3: The value of RthJA is measured by placing the device in a still air box which is one cubic foot.
4. Pulse Test:Pulse Width ≤300μs, Duty Cycle≤2%.
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LNG07R085H
Electrical Characteristics Diagrams
Figure 1. Typ. Output Characteristics
VGS=4.5V,6V,8V,10V
Figure 2. Transfer Characteristics
Common Source
VDS=5 V
Pulse test
Common Source
Tc = 25°C
Pulse test
From Bottom to Top
125°C
VGS=4V
25°C
VGS=3.5V
Drain−source voltage VDS (V)
Gate−source voltage VGS (V)
Figure 3. On-Resistance vs.Drain Current
Figure 4.On-Resistance vs.Temperature
VGS = 10V
ID=30A
VGS = 10V
T -Junction Temperation (°C)
Drain Current ID (A)
J
Figure 5.Body-Diode Characteristics
Figure 6.Capacitance Characteristics
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Ciss
125°C
Notes:
f = 1 MHz
VGS=0 V
25°C
Coss
Crss
Drain-Source Voltage VDS (V)
Source-Drain Voltage VSD (V)
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LNG07R085H
Figure 7.Gate Charge Characteristics
Figure 8.Drain Current Derating
80
Vgs = 10 V
70
Vds = 30 V
60
ID = 25 A
ID(A)
50
40
30
20
10
0
0
20
40
60
80
100
120
140
160
Case temperature(C)
Total Gate Charge QG (nC)
Figure 9.Power Dissipation vs.Temperature
80
PD(W)
60
40
20
0
0
20
40
60
80
100
120
140
160
Case temperature(C)
ZJC(normalized)
Transient Thermal Resistance
Figure 11. Normalized Maximum Transient Thermal Impedance (RthJC)
1
0.7
0.5
0.3
0.1
RθJC =1.6℃/W
0.1
0.05
0.02
0.01
0.01
PD
single pulse
1E-3
1E-6
1E-5
Ton
1E-4
1E-3
0.01
T
0.1
t,Time (s)
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LNG07R085H
Test Circuit & Waveforms
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveform
Unclamped Inductive Switching (UIS) Test Circuit & Waveform
Diode Recovery Test Circuit & Waveform
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LNG07R085H
Mechanical Dimensions for TO-252
DIMENSIONS IN MILLITMETERS
Version 0.1,Nov-2020
DIMENSIONS IN INCHES
SYMBOL
MIN
MAX
MIN
MAX
A
2.18
2.4
0.086
0.094
A1
-
0.2
-
0.008
A2
0.9
1.17
0.035
0.046
b
0.65
0.9
0.026
0.035
b3
4.95
5.5
0.195
0.217
c
0.43
0.89
0.017
0.035
D
5.97
6.22
0.235
0.245
D1
5.21
-
0.205
-
E
6.35
6.8
0.250
0.268
E1
4.32 -
0.170
e
2.286BSC
-
0.09BSC
H
9.4
10.5
0.370
0.413
L
0.38
1.78
0.015
0.070
L1
2.90BSC
0.114BSC
L2
0.51BSC
0.020BSC
L3
0.88
1.28
0.035
0.050
L4
-
1.02
-
0.040
L5
1.65
1.95
0.065
0.077
θ
0°
10°
0°
10°
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LNG07R085H
Version Information____________________________________ __ ____________
LNG07R085H
Revision:2020-11-19,Rev 0.1
Disclaimer
The content specified herein is for the purpose of introducing LONTEN's products (hereinafter "Products").
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into
account when designing circuits for mass production.
LONTEN does not assume any liability for infringement of patents, copyrights, or other intellectual property
rights of third parties by or arising from the use of the Products or technical information described in this
document.
The Products are not designed or manufactured to be used with any equipment, device or system which
requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to
human life or create a risk of human injury (such as a medical instrument, transportation equipment,
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responsibility in any way for use of any of the Products for the above special purposes.
Although LONTEN endeavors to improve the quality and reliability of its products, semiconductor products
have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain
use conditions. Please be sure to implement safety measures to guard them against the possibility of physical
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The content specified herein is subject to change for improvement without notice. When using a LONTEN
product, be sure to obtain the latest specifications.
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