CS540A4
R
○
无锡光磊电子科技有限公司
GL Silicon N-Channel Power MOSFET
V DSS
General Description:
The CS540A4 uses advanced trench technology and design
to provide excellent RDS(ON) with low gate charge. It can be
100
V
ID
30
A
PD
85
W
R DS(ON)type
20
mΩ
used in a wide variety of applications. The package form is TO-
TO-252
252, which accords with the RoHS standard.
Features:
Fast Switching
Low Gate Charge and Rdson
Low Reverse transfer capacitances
100% Single Pulse avalanche energy Test
Applications:
Power switching application
Hard switched and high frequency circuits
Uninterruptible power supply
Absolute ( Tc= 25℃ unless otherwise specified):
Symbol
V DSS
Parameter
Rating
Units
100
V
Continuous Drain Current
30
A
Continuous Drain Current T C = 100 °C
21
A
Drain-to-Source Voltage
ID
I DM
Pulsed Drain Current
120
A
V GS
Gate-to-Source Voltage
±20
V
E AS
a2
Single Pulse Avalanche Energy
260
mJ
E AR
a1
Avalanche Energy ,Repetitive
35
mJ
I AR
a1
Avalanche Current
8
A
Peak Diode Recovery dv/dt
5.0
V/ns
Power Dissipation
85
W
175, –55 to 175
℃
300
℃
dv/dt
a3
PD
T J , T stg
TL
Operating Junction and Storage Temperature Range
Maximum Temperature for Soldering
Wux i G u a ng L e i e l e c t ro n i c t e c h n o l og y c o. , LT D
1/5
CS540A4
R
○
无锡光磊电子科技有限公司
GL Silicon N-Channel Power MOSFET
Electrical Characteristics( Tc= 25℃ unless other wise specified):
OFF Characteristics
Symbol
V DSS
Parameter
Test Conditions
Drain to Source Breakdown Voltage V GS =0V, I D =250µA
ΔBV DSS /ΔT J Bvdss Temperature Coefficient
Rating
Min. Typ. Max.
100
--
--
I D =250uA,Reference25℃
--
0.1
--
V DS =100V,V GS =0V,T a =25℃
--
--
1
V DS =80V,V GS = 0V,T a =125℃
--
--
250
Units
V
V/℃
I DSS
Drain to Source Leakage Current
µA
I GSS(F)
Gate to Source Forward Leakage
V GS= +20V
--
--
1
µA
I GSS(R)
Gate to Source Reverse Leakage
V GS =-20V
--
--
-1
µA
ON Characteristics
Symbol
Parameter
Test Conditions
R DS(ON)
Drain-to-Source On-Resistance
V GS =10V,I D =10A
V GS(TH)
Gate Threshold Voltage
V DS = V GS , I D = 250µA
Rating
Min. Typ. Max.
Units
--
20
30
mΩ
1.0
--
3.0
V
Pulse width tp≤380µs,δ≤2%
Dynamic Characteristics
Parameter
Symbol
g fs
Forward Transconductance
C iss
Input Capacitance
C oss
Output Capacitance
C rss
Reverse Transfer Capacitance
Test Conditions
V DS =5V, I D =10.0A
V GS =0V,V DS =50V
f=1.0MHz
Rating
Min. Typ. Max.
8.0
--
--
--
2000
--
--
300
--
--
250
--
Units
S
pF
Resistive Switching Characteristics
Parameter
Symbol
t d(ON)
tr
t d(OFF)
tf
Test Conditions
Turn-on Delay Time
Rating
Min. Typ. Max.
--
10
--
Rise Time
I D =15A,V DD =50V
--
10
--
Turn-Off Delay Time
V GS =10V,R G =3.0Ω
--
38
--
--
14
--
--
45
--
--
12
--
--
18
--
Fall Time
Qg
Total Gate Charge
Q gs
Gate to Source Charge
Q gd
Gate to Drain (“ Miller ” )Charge
I D =15A,V DD =50V
V GS =10V
Wux i G u a ng L e i e l e c t ro n i c t e c h n o l og y c o. , LT D
2/5
Units
ns
nC
CS540A4
R
○
无锡光磊电子科技有限公司
GL Silicon N-Channel Power MOSFET
Source-Drain Diode Characteristics
Rating
Symbol
Parameter
Test Conditions
IS
Continuous Source Current (Body Diode)
--
--
30
A
I SM
Maximum Pulsed Current (Body Diode)
--
--
120
A
V SD
Diode Forward Voltage
I S =30A,V GS =0V
--
--
1.5
V
t rr
Reverse Recovery Time
I S =30A,T j = 25°C
--
66
--
ns
Q rr
Reverse Recovery Charge
dI F /dt=100A/us,V GS =0V
--
130
--
nC
Min. Typ. Max.
Units
Pulse width tp≤380µs,δ≤2%
Parameter
Symbol
R θJc
Junction-to-Case
a1 : Repetitive
a2 : EAS
a3 : I SD
Typ.
1.8
rating; pulse width limited by maximum junction temperature
condition : Tj=25℃ ,VDD=40V,VG=10V,L=0.5mH,Rg=25Ω
=30A,di/dt ≤100A/us,V DD ≤BV DS, Start T J =25℃
Wux i G u a ng L e i e l e c t ro n i c t e c h n o l og y c o. , LT D
3/5
Units
℃ /W
R
○
CS540A4
GL Silicon N-Channel Power MOSFET
Wux i G u a ng L e i e l e c t ro n i c t e c h n o l og y c o. , LT D
4/5
无锡光磊电子科技有限公司
CS540A4
R
○
GL Silicon N-Channel Power MOSFET
TEL:0755-23068119
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5/5
无锡光磊电子科技有限公司
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