SM6107PSU
®
P-Channel Enhancement Mode MOSFET
Features
•
•
•
Pin Description
Drain 4
-60V/-26A,
RDS(ON)= 40mΩ(max.) @ VGS=-10V
2
RDS(ON)= 54mΩ(max.) @ VGS=-4.5V
1 Gate
3 Source
Reliable and Rugged
Top View of TO-252-3
Lead Free and Green Devices Available
(RoHS Compliant)
•
D
100% UIS Tested
Applications
•
•
•
G
DC/DC Converter.
Power Management.
Load Switch.
S
P-Channel MOSFET
Ordering and Marking Information
Package Code
U : TO-252-3
Operating Junction Temperature Range
C : -55 to 150 oC
Handling Code
TR : Tape & Reel (2500ea/reel)
Assembly Material
G : Halogen and Lead Free Device
SM6107PS
Assembly Material
Handling Code
Temperature Range
Package Code
SM6107PS U :
XXXXX - Lot Code
SM6107PS
XXXXX
Note: SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the lead-free
requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER
defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in
homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
1
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SM6107PSU
®
Absolute Maximum Ratings
Symbol
(TA = 25°C Unless Otherwise Noted)
Parameter
Rating
Unit
Common Ratings
V DSS
Drain-Source Voltage
-60
VGSS
Gate-Source Voltage
±20
Maximum Junction Temperature
150
°C
-55 to 150
°C
-13
A
TJ
TSTG
IS
IAS
Diode Continuous Forward Current
a
a
EAS
I DP
b
Avalanche Current, Single pulse
L=0.5mH
-17
A
Avalanche Energy, Single pulse
L=0.5mH
72
mJ
Pulse Drain Current Tested
ID
Continuous Drain Current
PD
Maximum Power Dissipation
RθJC
TC =25°C
-80
Continuous Drain Current
PD
Maximum Power Dissipation
Thermal Resistance-Junction to Ambient
c
TC =25°C
-26
TC =100°C
-16
TC =25°C
54
TC =100°C
21
Thermal Resistance-Junction to Case
ID
R θJA d
Note
Note
Note
Note
Storage Temperature Range
V
2.3
TA=25°C
-5.3
TA=70°C
-4.2
TA=25°C
2.2
TA=70°C
1.4
Steady State
o
55
A
W
°C/W
A
W
°C/W
o
a:UIS tested and pulse width limited by maximum junction temperature 150 C (initial temperature T j=25 C).
b:Pulse width limited by max. junction temperature.
c:Wire limited.
2
d:R θJA steady state t=999s. RθJA is measured with the device mounted on 1in , FR-4 board with 2oz. Copper.
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
2
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SM6107PSU
®
Electrical Characteristics
Symbol
(TA = 25°C Unless Otherwise Noted)
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
-60
-
-
V
-
-
1
-
-
-30
-1.3
-1.8
-2.3
V
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
I DSS
Zero Gate Voltage Drain Current
VGS(th)
I GSS
RDS(ON)
e
VGS=0V, I DS=-250µA
VDS=-48V, VGS=0V
TJ=85°C
µA
Gate Threshold Voltage
VDS=VGS, IDS=-250µA
Gate Leakage Current
VGS=±20V, VDS=0V
-
-
±100
nA
VGS=-10V, I DS=-20A
-
32
40
mΩ
VGS=-4.5V, IDS=-20A
-
40
54
mΩ
ISD=-1A, VGS=0V
-
-0.7
-1
V
-
23
-
ns
-
22
-
nC
-
8
16
Ω
-
1416
1840
-
142
-
-
85
-
-
10
18
-
9
16
-
88
158
-
42
76
-
32
45
-
3.6
-
-
8.3
-
Drain-Source On-state Resistance
Diode Characteristics
VSD e
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Dynamic Characteristics
f
RG
Gate Resistance
C iss
Input Capacitance
Coss
Output Capacitance
Crs s
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
VGS=0V,VDS=0V,f=1MHz
VGS=0V,
VDS=-30V,
Frequency=1.0MHz
VDD =-30V, R L =30Ω,
IDS =-1A, VGEN =-10V,
RG =6Ω
Turn-off Fall Time
Gate Charge Characteristics
Qg
ISD=-20A, dlSD/dt=100A/µs
pF
ns
f
Total Gate Charge
Qgs
Gate-Source Charge
Q gd
Gate-Drain Charge
VDS=-30V, VGS=-10V,
IDS =-20A
nC
Note e:Pulse test; pulse width≤300µs, duty cycle≤2%.
Note f:Guaranteed by design, not subject to production testing.
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
3
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SM6107PSU
®
Typical Operating Characteristics
Power Dissipation
Drain Current
28
60
24
-ID - Drain Current (A)
Ptot - Power (W)
50
40
30
20
10
20
16
12
8
4
o
0
o
TC=25 C
0
20
40
60
0
80 100 120 140 160
TC=25 C,VG=-10V
0
20
Tj - Junction Temperature (°C)
60
80 100 120 140 160
Tj - Junction Temperature (°C)
Thermal Transient Impedance
Safe Operation Area
300
Normalized Transient Thermal Resistance
3
100
ds
(o
n
)L
im
it
100µs
R
-ID - Drain Current (A)
40
10
1ms
10ms
1
DC
o
TC=25 C
0.1
0.1
1
10
100
300
0.2
0.1
0.1
0.05
0.02
0.01
0.01
1E-3
Single Pulse
o
1E-4
1E-6
RθJC :2.3 C/W
1E-5
1E-4
1E-3
0.01
0.1
Square Wave Pulse Duration (sec)
-VDS - Drain - Source Voltage (V)
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
Duty = 0.5
1
4
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SM6107PSU
®
Typical Operating Characteristics (Cont.)
Output Characteristics
Drain-Source On Resistance
80
70
VGS=-4.5,-5,-6,-7
,-8,-9,-10V
70
RDS(ON) - On - Resistance (mΩ)
60
-ID - Drain Current (A)
-4V
50
40
-3.5V
30
20
-3V
10
60
50
VGS=-4.5V
40
VGS=-10V
30
20
-2.5V
0
0
1
2
3
4
5
10
6
0
10
20
30
40
-VDS - Drain - Source Voltage (V)
-ID - Drain Current (A)
Gate-Source On Resistance
Gate Threshold Voltage
1.6
90
Normalized Threshold Voltage (V)
RDS(ON) - On - Resistance (mΩ)
80
70
60
50
40
30
2
3
4
5
6
7
8
9
-VGS - Gate - Source Voltage (V)
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50 -25
10
60
IDS=-250µA
IDS=-20A
20
50
0
25
50
75
100 125 150
Tj - Junction Temperature (°C)
5
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SM6107PSU
®
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance
Source-Drain Diode Forward
2.5
80
VGS = -10V
-IS - Source Current (A)
Normalized On Resistance
IDS = -20A
2.0
1.5
1.0
10
o
T j=150 C
o
T j=25 C
1
0.5
o
RON@Tj=25 C: 32mΩ
0.0
-50 -25
0
25
50
0.1
0.0
75 100 125 150
0.9
1.2
-VSD - Source - Drain Voltage (V)
Capacitance
Gate Charge
V DS=-30V
9
-VGS - Gate-Source Voltage (V)
1500
Ciss
1200
900
600
300
1.5
10
Frequency=1MHz
1800
C - Capacitance (pF)
0.6
Tj - Junction Temperature (°C)
2100
0
0.3
Coss
I DS=-20A
8
7
6
5
4
3
2
1
Crss
0
8
16
24
32
0
40
-VDS - Drain - Source Voltage (V)
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
0
8
16
24
32
QG - Gate Charge (nC)
6
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SM6107PSU
®
Avalanche Test Circuit and Waveforms
VDS
tAV
L
DUT
EAS
VDD
RG
VDD
IAS
tp
IL
VDS
0.01Ω
tp
VDSX(SUS)
Switching Time Test Circuit and Waveforms
VDS
RD
td(on) tr
DUT
td(off) tf
VGS
10%
VGS
RG
VDD
tp
90%
VDS
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
7
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SM6107PSU
®
Package Information
TO-252-3
E
A
E1
c2
L4
H
D
D1
L3
b3
c
b
e
SEE VIEW A
0
GAUGE PLANE
SEATING PLANE
0.25
A1
L
S
Y
M
B
O
L
A
VIEW A
TO-252-3
RECOMMENDED LAND PATTERN
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
2.18
2.39
0.086
0.094
A1
-
0.13
-
0.005
b
0.50
0.89
0.020
0.035
b3
4.95
5.46
0.195
0.215
c
0.46
0.61
0.018
0.024
c2
0.46
0.89
0.018
0.035
D
5.33
6.22
0.210
0.245
D1
4.57
6.00
0.180
E
6.35
6.73
0.250
0.236
0.265
6.00
0.150
E1
3.81
e
2.29 BSC
6.25 MIN.
6.8 MIN.
6.6
3 MIN.
0.236
0.090 BSC
H
9.40
10.41
0.370
0.410
L
0.90
1.78
0.035
0.070
L3
0.89
2.03
0.035
0.080
L4
-
1.02
-
0.040
0
0°
0°
8°
8°
2.286
1.5 MIN.
4.572
UNIT: mm
Note : Follow JEDEC TO-252 .
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
8
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SM6107PSU
®
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
330.0±2.00 50 MIN.
TO-252-3
T1
C
d
16.4+2.00 13.0+0.50
-0.00
-0.20
1.5 MIN.
P0
P1
P2
D0
D1
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
D
W
E1
F
20.2 MIN. 16.0±0.30 1.75±0.10 7.50±0.05
T
A0
B0
K0
0.6+0.00 6.80±0.20 10.40±0.20 2.50±0.20
-0.40
(mm)
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
9
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SM6107PSU
®
Taping Direction Information
TO-252-3
USER DIRECTION OF FEED
Classification Profile
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
10
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SM6107PSU
®
Disclaimer
Sinopower Semiconductor, Inc. (hereinafter “Sinopower”) has been making
great efforts to development high quality and better performance products to
satisfy all customers’ needs. However, a product may fail to meet customer’s
expectation or malfunction for various situations.
All information which is shown in the datasheet is based on Sinopower’s
research and development result, therefore, Sinopower shall reserve the right
to adjust the content and monitor the production.
In order to unify the quality and performance, Sinopower has been following
JEDEC while defines assembly rule. Notwithstanding all the suppliers
basically follow the rule for each product, different processes may cause
slightly different results.
The technical information specified herein is intended only to show the typical
functions of and examples of application circuits for the products. Sinopower
does not grant customers explicitly or implicitly, any license to use or exercise
intellectual property or other rights held by Sinopower and other parties.
Sinopower shall bear no responsible whatsoever for any dispute arising from
the use of such technical information.
The products are not designed or manufactured to be used with any
equipment, device or system which requires an extremely high level of
reliability, such as the failure or malfunction of which any may result in a direct
threat to human life or a risk of human injury. Sinopower shall bear no
responsibility in any way for use of any of the products for the above special
purposes. If a product is intended to use for any such special purpose, such
as vehicle, military, or medical controller relevant applications, please contact
Sinopower sales representative before purchasing.
Copyright Sinopower Semiconductor, Inc.
Rev. A.1 - December, 2014
11
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SM6107PSU
®
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak
(Tp)*
package
body
Temperature
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness