MBR30100CT
MBRB30100CT
MBR30100CT-1
Technical Data
Data Sheet N0039, Rev. C
MBR30100CT/MBRB30100CT/MBR30100CT-1
SCHOTTKY RECTIFIER
Features
Applications
175 C TJ operation
Center tap configuration
Low forward voltage drop
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
Switching power supply
Converters
Free-Wheeling diodes
Reverse battery protection
MBR30100CT
MBRB30100CT
MBR30100CT-1
TO-220AB
D2PAK
TO-262
Maximum Ratings:
Characteristics
Symbol
Condition
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
-
Average Rectified Forward Current
IF (AV)
Peak Repetitive Forward
Current(Per Leg)
Peak One Cycle Non-Repetitive Surge
Current(Per Leg)
IFRM
IFSM
50% duty cycle @Tc=133°C,
rectangular wave form
Rated VR square wave,
20KHz TC = 133°C
Max.
Units
100
V
15(Per Leg)
30(Per Device)
A
20
A
200
A
8.3ms, Half Sine pulse
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MBR30100CT
MBRB30100CT
MBR30100CT-1
Technical Data
Data Sheet N0039, Rev. C
Electrical Characteristics:
Characteristics
Symbol
Forward Voltage Drop
(Per Leg)*
VF1
VF2
Reverse Current
(Per Leg)*
IR1
IR2
Junction Capacitance(Per Leg)
CT
Series Inductance
(per leg)
Voltage Rate of Change
LS
dv/dt
Condition
@ 15 A, Pulse, TJ = 25 C
@ 30 A, Pulse, TJ = 25 C
@ 15 A, Pulse, TJ = 125 C
@ 30 A, Pulse, TJ = 125 C
@VR = rated VR
TJ = 25 C
@VR = rated VR
TJ = 125 C
@VR = 5V, TC = 25 C
fSIG = 1MHz
Measured lead to lead 5 mm from
package body
-
Typ.
Max.
Units
0.78
0.90
0.67
0.77
0.85
1.05
0.70
0.85
0.003
1.00
mA
2
15.0
mA
380
500
pF
8.0
-
nH
-
10,000
V/s
V
V
* Pulse width < 300 µs, duty cycle < 2%
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Typical Thermal Resistance Junction to
Case
Typical Thermal
Resistance Junction to Case
Typical Thermal
Resistance, Case to Heat Sink
Case Style
Symbol
Condition
Specification
Units
TJ
Tstg
-
-55 to +175
-55 to +175
C
C
RJC
DC operation
1.5
C/W
RJA
DC operation
50
C/W
RCS
Mounting surface, smooth and
greased
TO-220AB D2PAK TO-262
0.50
C/W
Tube Specification
Tube Specification(TO-220AB/TO-262)
Device
Package
Weight
Shipping
MBR30100CT
TO-220AB
1.8g
50pcs / tube
MBRB30100CT
D²PAK
1.85g
800pcs / reel
MBR30100CT-1
TO-262
1.85g
50pcs / tube
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
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MBR30100CT
MBRB30100CT
MBR30100CT-1
Technical Data
Data Sheet N0039, Rev. C
Ratings and Characteristics Curves
TJ=125℃
TJ=25℃
TJ=25℃
Fig.2-Typical Reverse Characteristics
Fig.1-Typical Junction Capacitance
TJ=125℃
TJ=25℃
Fig.3-Typical Instantaneous Forward Voltage Characteristics
Marking Diagram
Where XXXXX is YYWWL
MBR
B
30
100
CT-1
SSG
YY
WW
L
= Device Type
= Package type
= Forward Current (30A)
= Reverse Voltage (100V)
= Configuration
= SSG
= Year
= Week
= Lot Number
Cautions:Molding resin
Epoxy resin UL:94V-0
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MBR30100CT
MBRB30100CT
MBR30100CT-1
Technical Data
Data Sheet N0039, Rev. C
Carrier Tape Specification D2PAK
Millimeters
Min.
Max.
Symbol
A
10.70
10.90
B
16.03
16.23
C
5.11
5.31
d
1.45
1.65
E
1.65
1.85
F
11.40
11.60
P0
3.90
4.10
P
15.90
16.10
P1
1.90
2.10
W
23.90
24.30
Mechanical Dimensions TO-220AB
Symbol
A
A1
A2
b
b1
c
D
D1
E
e
e1
H1
L
L1
ΦP
Q
Θ1
Θ2
Θ3
Millimeters
Min.
4.42
1.17
2.52
0.71
1.17
0.31
14.94
8.85
10.01
4.98
6.04
12.7
3.56
3.74
2.54
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Typical
4.57
1.27
2.69
0.81
1.27
0.38
15.24
9.00
10.16
2.54
5.06
6.24
13.56
3.5
3.84
2.74
7°
3°
4°
Max.
4.72
1.37
2.89
0.96
1.37
0.61
15.54
9.15
10.31
5.18
6.44
13.80
3.96
4.04
2.94
MBR30100CT
MBRB30100CT
MBR30100CT-1
Technical Data
Data Sheet N0039, Rev. C
Mechanical Dimensions D2PAK
Symbol
A
A1
A2
b
b1
c
c1
D
D1
E
E1
E2
e
H
L
L1
L2
L3
e
e1
e2
Millimeters
Min.
4.47
0
2.59
0.71
1.17
0.31
1.17
8.50
6.40
10.01
7.6
9.98
Typical
Max.
10.16
10.31
10.08
2.54
15.1
2.30
1.27
10.31
4.70
0.10
2.69
0.81
1.27
0.38
1.27
8.70
14.6
2.00
1.12
1.30
0.25BSC
5°
4°
0
e3
4.85
0.25
2.89
0.96
1.37
0.61
1.37
8.90
15.6
2.74
1.42
2.20
8°
4°
Mechanical Dimensions TO-262
Symbol
A
A1
A2
b
b1
c
c1
D
D1
E
E1
E2
e
H
L
L1
L2
L3
e
e1
e2
e3
Millimeters
Min.
4.55
0
2.59
0.71
0.36
1.17
8.55
6.40
10.01
7.6
9.98
14.6
2.00
1.17
0
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Typical
4.70
0.10
2.69
0.81
1.27
0.38
1.27
Max.
4.85
0.25
2.89
0.96
0.61
1.37
8.70
8.85
10.16
10.31
10.08
2.54
15.1
2.30
1.27
10.18
0.25BSC
5°
4°
4°
15.6
2.70
1.40
2.20
8°
Technical Data
Data Sheet N0039, Rev. C
MBR30100CT
MBRB30100CT
MBR30100CT-1
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or any
other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd assumes
no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or
circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any secondary
damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party.
When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations..
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