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RB520S-30-MS

RB520S-30-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOD523(SC-79)

  • 描述:

    二极管配置:独立式;直流反向耐压(Vr):30V;平均整流电流(Io):200mA;正向压降(Vf):600mV@200mA;反向电流(Ir):1uA@10V;

  • 数据手册
  • 价格&库存
RB520S-30-MS 数据手册
www.msksemi.com RB520S-30-MS Semiconductor Compiance PINNING Silicon Epitaxial Planar Schottky Barrier Diode PIN for low current rectification and high speed switching applications DESCRIPTION 1 Cathode 2 Anode 2 1 Features • Extremely small surface mounting type SOD-523 • High reliability Absolute Maximum Ratings (Ta = 25 OC) Parameter Symbol Value Unit VR 30 V Mean Rectifying Current IF(AV) 200 mA Peak Forward Surge Current (60 Hz for 1 Cyc.) IFSM 1 A Tj 125 O C Tstg - 40 to + 125 O C Symbol Max. Unit Forward Voltage at IF = 200 mA VF 0.6 V Reverse Current at VR = 10 V IR 1 µA Reverse Voltage Junction Temperature Storage Temperature Range Characteristics at Ta = 25 OC Parameter Note: ESD sensitive product handling required. www.msksemi.com RB520S-30-MS Semiconductor Forward Characteristics 1000 Reverse Characteristics 1000 100 REVERSE CURRENT IR (uA) (mA) IF FORWARD CURRENT o Ta=100 C 100 10 1 0.1 0.01 0 100 200 300 FORWARD VOLTAGE 400 VF 500 o Ta=25 C 1 0 5 10 (mV) 15 20 25 30 REVERSE VOLTAGE V (V) R Capacitance Characteristics 100 10 0.1 600 Compiance Power Derating Curve 120 Ta=25℃ f=1MHz PD(mW) 30 POWER DISSIPATION CAPACITANCE BETWEEN TERMINALS CT(pF) 100 10 80 60 40 3 20 1 0 5 10 REVERSE VOLTAGE V 15 R (V) 20 0 0 25 50 75 AMBIENT TEMPERATURE T 100 a 125 (℃) www.msksemi.com RB520S-30-MS Semiconductor PACKAGE MECHANICAL DATA Symbol A A1 b c D E E1 E2 L 0 Dimensions In Millimeters Min Max 0.510 0.770 0.500 0.700 0.250 0.350 0.080 0.150 0.750 0.850 1.100 1.300 1.500 1.700 0.200 REF 0.010 0.070 7° REF Dimensions In Inches Min Max 0.020 0.031 0.020 0.028 0.010 0.014 0.003 0.006 0.030 0.033 0.043 0.051 0.059 0.067 0.008 REF 0.001 0.003 7° REF REEL SPECIFICATION P/N RB520S-30-MS PKG SOD-523 QTY 3000 Compiance RB520S-30-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
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