DSR1AW THRU DSR1MW
PINNING
Surface Mount General Purpose Silicon Rectifiers
PIN
Reverse Voltage - 50 to 1000 V
Forward Current - 1 A
DESCRIPTION
1
Cathode
2
Anode
1
2
Top View
:
Weight:17mg,0.0006 oz
Simplified outline SOD-123FL and symbol
Maximum Ratings and Electrical characteristics
Ratings at 25 °C ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load
for capacitive load current derate by 20 %.
Symbols DSR1AW DSR1BW DSR1DW DSR1GW DSR1JW DSR1KW DSR1MW Units
Parameter
Maximum Repetitive Peak Reverse Voltage
V RRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
V RMS
35
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
V DC
50
100
200
400
600
800
1000
V
Maximum Average Forward Rectified Current
at Ta = 65 °C
I F(AV)
1
A
Peak Forward Surge Current 8.3 ms Single Half
Sine Wave Superimposed on Rated Load
(JEDEC Method)
I FSM
30
A
Maximum Instantaneous Forward Voltage at 1 A
VF
1.1
V
IR
5
50
μA
Cj
4
pF
RθJA
180
°C/W
T j , T stg
-55 ~ +150
°C
Maximum DC Reverse Current
at Rated DC Blocking Voltage
Typical Junction Capacitance
Typical Thermal Resistance
Ta = 25 °C
Ta =125 °C
1)
2)
Operating and Storage Temperature Range
1)Measured at 1 MHz and applied reverse voltage of 4 V D.C
2)Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, P.C.B. mounted
REV.08
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DSR1AW THRU DSR1MW
Fig.2 Typical Instaneous Reverse
Characteristics
1.2
Instaneous Reverse Current ( μ A)
Average Forward Current (A)
Fig.1 Forward Current Derating Curve
1.0
0.8
0.6
0.4
0.2
0.0
25
50
75
100
125
150
175
100
T J =150°C
T J =125°C
10
T J =100°C
1.0
T J =75°C
T J =50°C
0.1
T J =25°C
0.01
800
Fig.4 Typical Junction Capacitance
1.0
Junction Capacitance ( pF)
12
2 5°
C
°C
00
TJ
TJ =
=1
=1
50
°C
0.5
TJ
Instaneous Forward Current (A)
Fig.3 Typical Forward Characteristic
0.2
0.1
0.6
0.7
0.8
0.9
1.0
35
30
25
20
15
10
8.3 ms Single Half Sine Wave
(JEDEC Method)
00
1
10
8
6
4
2
0
5
10
15
20
25
30
Reverse Voltage (V)
Fig.5 Maximum Non-Repetitive Peak
Forward Surage Current
05
10
0
1.1
Instaneous Forward Voltage (V)
Peak Forward Surage Current (A)
600
Instaneous Reverse Voltage (V)
Ambient Temperature (°C)
100
Number of Cycles
REV.08
400
200
0
2 of 4
35
40
DSR1AW THRU DSR1MW
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD123FL
∠ALL ROUND
C
A
∠ALL ROUND
VM
D
E
A
g
g
pad
e
E
A
pad
HE
Top View
A
C
D
E
e
g
HE
max
1.1
0.20
2.9
1.9
1.1
0.9
3.8
min
0.9
0.12
2.6
1.7
0.8
0.7
3.5
max
43
7.9
114
75
43
35
150
min
35
4.7
102
67
31
28
138
UNIT
mm
mil
Bottom View
7°
The recommended mounting pad size
2.0
(79)
1.2
(47)
1.2
(47)
1.2
(47)
Unit: mm
(mil)
REV.08
∠
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DSR1AW THRU DSR1MW
Recommended condition of flow soldering
300
Preliminary Heating
Soldering
Cooling (in air)
Temperature of Soldering (°C)
265°C
250
245°C
200
150
120°C
100
100°C
50
0
2 to 5 min
more than 1 min
less than 10s
Recommended condition of reflow soldering
Temperature of Soldering (°C)
300
Peak Temperature
245 to 260°C, 10s max.
250
Reflow Heating Rate
1 to 5°C / s
200
150
100
50
Pre Heating Rate
1 to 5°C / s
Preliminary Heating
130 to 170°C,
50 to 120s
Soldering
230°C
20 to 30s
Cooling
more than 60s
0
2 times max.
Recommended peak temperature is over 245 °C. If peak temperature is below 24 5 ° C , y ou may adjust the
f ollowing parameters; time length of peak temperature (longer), time length of soldering (longer), thickness
of solder paste (thicker)
Condition of hand soldering
Temperature: 370°C
Time: 3s max.
Times: one time
Remark:
Lead free solder paste (96.5Sn/3.0Ag/0.5Cu)
REV.08
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