HT2301ARTZ

HT2301A P-Channel Enhancement Mode Power MOSFET DESCRIPTION D The HT2301A uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate G voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. S GENERAL FEATURES Schematic diagram ● VDS = -20V,ID = -3.5A RDS(ON) < mΩ @ VGS=-2.5V RDS(ON) < mΩ @ VGS=-4.5V ● High Power and current handing capability ● Lead free product is acquired Marking and pin Assignment ● Surface Mount Package Application ●PWM applications ●Load switch SOT-23 top view ●Power management Package Marking And Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity 2301 HT2301A SOT-23 Ø180mm 8 mm 3000 units Absolute Maximum Ratings (TA=25℃unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS -20 V Gate-Source Voltage VGS ±12 V Drain Current-Continuous ID -3.5 A Drain Current -Pulsed (Note 1) IDM -10 A Maximum Power Dissipation PD 1 W TJ,TSTG -55 To 150 ℃ RθJA 125 ℃/W Operating Junction and Storage Temperature Range Thermal Characteristic Thermal Resistance,Junction-to-Ambient (Note 2) Electrical Characteristics (TA=25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit Drain-Source Breakdown Voltage BVDSS VGS=0V ID=-250µA -20 -24 - V Zero Gate Voltage Drain Current IDSS VDS=-20V,VGS=0V - - -1 µA Off Characteristics Rev. 00 HT2301A Gate-Body Leakage Current IGSS VGS=±12V,VDS=0V - - ±100 nA Gate Threshold Voltage VGS(th) VDS=VGS,ID=-250µA -0.4 -0.7 -1 V Drain-Source On-State Resistance RDS(ON) -64 75 mΩ 89 95 mΩ On Characteristics (Note 3) Forward Transconductance gFS VGS=-4.5V, ID=-3.5A VGS=-2.5V, ID=-3A VDS=-5V,ID=-3A - 9.5 - S Dynamic Characteristics (Note4) - 405 - PF - 75 - PF Crss - 55 - PF Turn-on Delay Time td(on) - 11 - nS Turn-on Rise Time tr VDD=-10V,ID=-1A - 35 - nS td(off) VGS=-4.5V,RGEN=10Ω - 30 - nS - 10 - nS - 3.3 12 nC - 0.7 - nC - 1.3 - nC - - -1.2 V - - -1.3 A Input Capacitance Clss Output Capacitance Coss Reverse Transfer Capacitance VDS=-10V,VGS=0V, F=1.0MHz Switching Characteristics (Note 4) Turn-Off Delay Time Turn-Off Fall Time tf Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd VDS=-10V,ID=-3A, VGS=-2.5V Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) VSD Diode Forward Current (Note 2) IS VGS=0V,IS=1.3A Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production Rev. 00 HT2301A TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS ton tr td(on) toff tf td(off) 90% VOUT 90% INVERTED 10% 10% 90% VIN 50% 50% 10% PULSE WIDTH Figure 2:Switching Waveforms PD Power(W) ID- Drain Current (A） Figure 1:Switching Test Circuit TJ-Junction Temperature(℃) TJ-Junction Temperature(℃) Figure 4 Drain Current ID- Drain Current (A) Rdson On-Resistance(Ω) Figure 3 Power Dissipation Vds Drain-Source Voltage (V) Figure 5 Output CHARACTERISTICS ID- Drain Current (A) Figure 6 Drain-Source On-Resistance Rev. 00 ID- Drain Current (A) Normalized On-Resistance HT2301A TJ-Junction Temperature(℃) Vgs Gate-Source Voltage (V) Figure 8 Drain-Source On-Resistance C Capacitance (pF) Rdson On-Resistance(Ω) Figure 7 Transfer Characteristics Vds Drain-Source Voltage (V) Vgs Gate-Source Voltage (V) Figure 10 Capacitance vs Vds Vgs Gate-Source Voltage (V) Is- Reverse Drain Current (A) Figure 9 Rdson vs Vgs Qg Gate Charge (nC) Figure 11 Gate Charge Vsd Source-Drain Voltage (V) Figure 12 Source- Drain Diode Forward Rev. 00 ID- Drain Current (A) HT2301A Vds Drain-Source Voltage (V) Safe Operation Area Transient Thermal Impedance r(t),Normalized Effective Figure 13 Square Wave Pluse Duration(sec) Figure 14 Normalized Maximum Transient Thermal Impedance Rev. 00 HT2301A SOT-23 PACKAGE INFORMATION Dimensions in Millimeters (UNIT:mm) Symbol A A1 A2 b c D E E1 e e1 L L1 θ Dimensions in Millimeters MIN. MAX. 0.900 1.150 0.000 0.100 0.900 1.050 0.300 0.500 0.080 0.150 2.800 3.000 1.200 1.400 2.250 2.550 0.950TYP 1.800 2.000 0.550REF 0.300 0.500 0° 8° NOTES 1. All dimensions are in millimeters. 2. Tolerance ±0.10mm (4 mil) unless otherwise specified 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. Rev. 00