JSM3420
N-Channel 20-V(D-S) MOSFET
ID
RDS(on)MAX
V(BR)DSS
SOT-23-3
0.024Ω@ 10V
1.GATE
6.0 A
0.0 27Ω@ 4.5V
2.SOURCE
or
20V
3
3.DRAIN
0.035Ω@ 2.5V
2
ct
1
General FEATURE
Equivalent Circuit
du
●TrenchFET Power MOSFET
●Lead free product is acquired
on
●Surface mount package
S
em
ic
APPLICATION
●Load Switch for Portable Devices
●DC/DC Converter
MI
CR
O
Maximum ratings (Ta=25℃ unless otherwise noted)
Parameter
Symbol
Value
Unit
VDS
20
Gate-Source Voltage
VGS
±12
Continuous Drain Current
Pulsed Drain Current*1
ID
6.0
IDM
20
Continuous Source-Drain Diode Current
IS
1.25
Maximum Power Dissipation
PD
1.25
W
R θJA
100
℃/W
Junction Temperature
TJ
150
Storage Temperature
Tstg
-55 ~+150
JS
Drain-Source Voltage
Thermal Resistance from Junction to Ambient(t ≤10 s)
V
A
℃
Note :
*1. Pulse Width ≤ 300μs, Duty cycle ≤2%
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JSM3420
N-Channel 20-V(D-S) MOSFET
MOSFET ELECTRICAL CHARAC TERISTICS
Ta =25 ℃ unless otherwise specified
Min
Test Condition
Symbol
Parameter
Typ
Max
0.8
1.0
Units
Static
V(BR)DSS VGS = 0V, ID = 250µA
20
Gate-source threshold voltage
VGS(th)
VDS =VGS, ID = 250µA
0.5
Gate-source leakage
IGSS
VDS =0V, VGS =±12V
Zero gate voltage drain current
IDSS
VDS =16V, VGS =0V
VGS =4.5V, ID =5A
VGS =2.5V, ID =4A
Forward transconductance a
gf s
VDS =5V, ID =6A
b
Output capacitance
Coss
Reverse transfer capacitance
Crss
Total gate charge
Qg
Qgs
Turn-on delay time
MI
CR
O
Rise time
Turn-off delay time
Fall time
VDS =10V,VGS =4.5V,ID =6A
Qgd
S
Gate-source charge
Gate-drain charge
VDS =15V,VGS =0V,f =1MHz
ic
Ciss
em
Input capacitance
on
Dynamic
du
RDS(on)
td(on)
VDD=10V,ID =1A
tr
VGEN=4.5V,Rg=6Ω
td(off)
tf
±100
nA
100
nA
0.016
0.024
0. 019
0.027
0.023
0.035
25
-
ct
VGS =10 V , ID =6A
Drain-source on-state resistance a
V
or
Drain-source breakdown voltage
Ω
S
742
66
pF
78
9.0
nC
1.5
2.6
12.0
23.0
ns
14.0
9.0
Drain-source body diode characteristics
Continuous source-drain diode current
JS
Body diode voltage
IS
TC=25℃
VSD
IS=1.0A
1.25
0.7
1.0
A
V
Notes :
a.Pulse Test : Pulse Width < 300µs, Duty Cycle ≤2%.
b.Guaranteed by design, not subject to production testing.
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第2/6页
JSM3420
N-Channel 20-V(D-S) MOSFET
Typical Characteristics
Brekdown Voltage vs Ambient Temperature
Typical Output Characteristics
1.4
20
BVDSS, Normalized Drain-Source
Breakdown Voltage
VGS=2V
12
8
4
1.2
1
or
ID, Drain Current(A)
16
0.8
0.6
ID=250μA,
VGS=0V
ct
10V, 9V,8V,7V,6V, 5V, 4V, 3V
VGS=1.5V
0
1
2
3
du
0.4
0
-75
4
-50
25
50
75
100 125 150 175
on
1000
2.5V
3V
4.5V
VSD, Source-Drain Voltage(V)
1.8V
em
VGS=1.5V
ic
1.2
S
100
MI
CR
O
R DS(on), Static Drain-Source On-State
Resistance(mΩ)
0
Reverse Drain Current vs Source-Drain Voltage
Static Drain-Source On-State resistance vs Drain Current
VGS=10V
10
0.01
0.1
1
ID, Drain Current(A)
0.8
0.6
Tj=150°C
0.4
0
10
10
4
6
8
IDR , Reverse Drain Current(A)
1.8
R DS(on), Normalized Static DrainSource On-State Resistance
160
140
120
100
80
ID=6A
ID=5.0A
40
2
Drain-Source On-State Resistance vs Junction Tempearture
180
60
Tj=25°C
0.2
JS
200
VGS=0V
1
Static Drain-Source On-State Resistance vs Gate-Source
Voltage
R DS(on), Static Drain-Source OnState Resistance(mΩ)
-25
Tj, Junction Temperature(°C)
VDS, Drain-Source Voltage(V)
20
VGS=4.5V, ID=6A
1.6
1.4
1.2
1
VGS=2.5V, ID=5.0A
0.8
0.6
0.4
0
0
2
4
6
8
VGS, Gate-Source Voltage(V)
10
-60
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-20
20
60
100
140
Tj, Junction Temperature(°C)
180
第3/6页
JSM3420
N-Channel 20-V(D-S) MOSFET
Typical Characteristics(Cont.)
Threshold Voltage vs Junction Tempearture
Capacitance vs Drain-to-Source Voltage
C oss
0.8
0.6
0.4
10
1
10
VDS, Drain-Source Voltage(V)
-60 -40 -20
100
VDS=5V
em
10
VGS, Gate-Source Voltage(V)
ic
10
Pulsed
Ta=25°C
S
1
MI
CR
O
0.1
0.01
0.001
0.01
0.1
1
ID, Drain Current(A)
8
4
2
0
10
0
100
8
12
16
20
Maximum Drain Current vs JunctionTemperature
ID, Maximum Drain Current(A)
JS
8
100μs
1ms
10ms
100ms
0.1
4
Qg, Total Gate Charge(nC)
10
1
VDS=10V
ID=6A
6
Maximum Safe Operating Area
ID, Drain Current(A)
60 80 100 120 140 160
Gate Charge Characteristics
100
DC
TA=25°C, Tj=150°C,VGS=4.5V
RθJA=90°C/W, Single Pulse
0.01
0.01
20 40
Tj, Junction Temperature(°C)
Forward Transfer Admittance vs Drain Current
100
0
on
0.1
GFS, Forward Transfer Admittance(S)
1
or
Crss
100
ID=250μA
1.2
ct
Ciss
1000
1.4
du
VGS(th), Normalized Threshold Voltage
Capacitance---(pF)
10000
7
6
5
4
3
2
1
TA=25°C, VGS=4.5V
0
0.1
1
10
100
25
VDS, Drain-Source Voltage(V)
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50
75
100
125
150
Tj, Junction Temperature(°C)
175
第4/6页
JSM3420
N-Channel 20-V(D-S) MOSFET
Typical Characteristics(Cont.)
Single Pulse Power Rating, Junction to Ambient
(Note on page 1)
Power Derating Curve
1.6
50
Mounted on FR-4 board
with 1 in² pad area
TJ(MAX) =150°C
TA=25°C
RθJA=90°C/W
1
0.8
0.6
0.4
or
40
30
20
ct
1.2
Power (W)
PD, Power Dissipation(W)
1.4
10
0
0
50
100
150
200
0
0.001
0.01
on
TA, Ambient Temperature(℃)
du
0.2
0.1
1
Pulse Width(s)
10
100
ic
Transient Thermal Response Curves
1
em
0.2
0.1
1.RθJA(t)=r(t)*RθJA
2.Duty Factor, D=t1/t2
3.TJM-TC=PDM*ZθJC(t)
4.RθJA=90 °C/W
S
0.1
0.05
0.02
MI
CR
O
Normalized Transient Thermal Resistance
D=0.5
0.01
0.01
Single Pulse
JS
0.001
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
t1, Square Wave Pulse Duration(s)
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第5/6页
JSM3420
N-Channel 20-V(D-S) MOSFET
Package Outline Dimensions
Suggested Pad Layout
JS
MI
CR
O
SOT-23
S
em
ic
on
du
ct
or
SOT-23
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