LPSC2301
Lonten P-channel -20V, -2A, 110mΩ Power MOSFET
Description
Product Summary
These P-Channel enhancement mode power field
VDSS
-20V
effect
RDS(on).max@ VGS=-4.5V
110mΩ
ID
-2A
transistors
are
using
trench
DMOS
technology. This advanced technology has been
especially tailored to minimize on-state resistance,
provide superior switching performance, and with
stand high energy pulse in the avalanche and
commutation mode. These devices are well suited
Pin Configuration
for high efficiency fast switching applications.
D
Features
-20V,-2A,RDS(ON).max=110mΩ@VGS=-4.5V
Improved dv/dt capability
Fast switching
Green device available
G
S
SOT-23
Applications
PWM applications
Load switch
Portable Equipment
Absolute Maximum Ratings
P-Channel MOSFET
Pb
TA = 25°C unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
Value
Unit
VDSS
-20
V
-2
A
-1.4
A
Continuous drain current ( TA = 25°C )
ID
Continuous drain current ( TA= 100°C )
Pulsed drain current1)
IDM
-10
A
Gate-Source voltage
VGSS
±12
V
PD
0.78
W
TSTG
-55 to +150
°C
TJ
-55 to +150
°C
Symbol
Value
Unit
RθJA
160
°C/W
Power Dissipation ( TA = 25°C )
Storage Temperature Range
Operating Junction Temperature Range
Thermal Characteristics
Parameter
Thermal Resistance, Junction-to-Case
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LPSC2301
Package Marking and Ordering Information
Device
Device Package
Marking
LPSC2301
SOT-23
2301
Electrical Characteristics
Parameter
TJ = 25°C unless otherwise noted
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Static characteristics
Drain-source breakdown voltage
BVDSS
VGS=0 V, ID=-250uA
-20
---
---
V
Gate threshold voltage
VGS(th)
VDS=VGS, ID=-250uA
-0.4
-0.75
-1
V
VDS=-20 V, VGS=0 V, TJ = 25°C
---
---
-1
μA
VDS=-16V, VGS=0 V, TJ = 125°C
---
---
-10
μA
Drain-source leakage current
IDSS
Gate leakage current, Forward
IGSSF
VGS=12 V, VDS=0 V
---
---
100
nA
Gate leakage current, Reverse
IGSSR
VGS=-12 V, VDS=0 V
---
---
-100
nA
VGS=-4.5 V, ID=-2 A
---
80
110
mΩ
VGS=-2.5 V, ID=-1.5 A
---
100
130
mΩ
VDS =-5 V , ID=-2A
---
6
---
S
---
406
---
---
51.7
---
Drain-source on-state resistance
Forward transconductance
RDS(on)
gfs
Dynamic characteristics
Input capacitance
Output capacitance
Ciss
Coss
VDS = -10 V, VGS = 0 V,
pF
F = 1MHz
Reverse transfer capacitance
Crss
---
44.1
---
Turn-on delay time
td(on)
---
10
---
---
5.3
---
td(off)
---
32
---
Fall time
tf
---
8
---
Gate resistance
Rg
---
20
---
---
1.5
---
---
1.2
---
---
8.2
---
Rise time
tr
VDD = -10V,VGS=-4.5V, ID =-2A
Turn-off delay time
VGS=0V,VDS=0V,f=1MHz
ns
Ω
Gate charge characteristics
Gate to source charge
Gate to drain charge
Qgs
Qgd
VDS=-10 V, ID=-2A,
nC
VGS=-4.5 V
Gate charge total
Qg
Drain-Source diode characteristics and Maximum Ratings
Continuous Source Current
IS
---
---
-2
A
Pulsed Source Current2)
ISM
---
---
-10
A
Diode Forward Voltage
VSD
---
---
-1.2
V
VGS=0V, IS=-2A, TJ=25℃
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature.
2: Pulse Test:Pulse Width ≤300μs, Duty Cycle≤2%.
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LPSC2301
Electrical Characteristics Diagrams
Figure 1. Typ. Output Characteristics
Common Source
Tc = 25°C
Pulse test
VGS=2.5V, 3V, 3.5V, 4.5V
-ID-Drain current (A)
Figure 2. Transfer Characteristics
Common Source
VDS= -5 V
Pulse test
-ID -Drain current (A)
From Bottom to Top
VGS=2V
125°C
25°C
VGS=1.5V
-VDS -Drain−source voltage (V)
Figure 3. Capacitance
-VGS -Gate−source voltage (V)
Characteristics
Figure 4. Gate Charge Waveform
Vgs = -4.5V
-VGS -Gate-Source Voltage (V)
Capacitance (pF)
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Ciss
Notes:
f = 1 MHz
VGS=0 V
Coss
Vds = -10 V
ID = -2 A
Crss
-VDS -Drain-Source Voltage (V)
Total Gate Charge QG (nC)
Figure 6. Rdson-Drain Current
ON-Resistance Rdson (mohm)
-IS -Reverse Drain current (A)
Figure 5. Body-Diode Characteristics
125°C
25°C
-VSD-Source-Drain Voltage (V)
Version 0.1, 2018
VGS = -4.5V
VGS = -2.5V
-ID-Drain Current (A)
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LPSC2301
Figure 8. Maximum Safe Operating Area
Drain current I (A)
Normalized On-Resistance
Figure 7. Rdson-Junction Temperature(℃)
D
VGS = -4.5V
ID = -2A
T -Junction Temperation (°C)
Drain-Source Voltage V
J
DS
(V)
Normalized Transient
θJC
Z
Thermal Resistance
Figure 6. Normalized Maximum Transient Thermal Impedance (RthJA)
Pulse Width t (s)
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LPSC2301
Test Circuit & Waveform
Figure 8. Gate Charge Test Circuit & Waveform
Figure 9. Resistive Switching Test Circuit & Waveforms
Figure 10. Unclamped Inductive Switching (UIS) Test Circuit & Waveform
Figure 11. Diode Recovery Circuit & Waveform
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LPSC2301
Mechanical Dimensions for SOT-23
COMMON DIMENSIONS
MILLIMETERS
INCHS
SYMBOL
MIN
MAX
MIN
MAX
A
0.95
1.40
0.037
0.055
A1
0.01
0.10
0.000
0.004
b
0.35
0.50
0.014
0.020
c
0.08
0.19
0.003
0.007
D
2.70
3.10
0.106
0.122
E
1.20
1.65
0.047
0.065
E1
2.20
3.00
0.087
0.118
e
e1
0.95 TYP.
1.78
2.04
0.037 TYP.
0.070
0.080
Part Number
2301
WW
SOT-23 Part Marking Information
“WW”
Date Code
Version 0.1, 2018
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LPSC2301
Disclaimer
The content specified herein is for the purpose of introducing LONTEN's products (hereinafter "Products").
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into
account when designing circuits for mass production.
LONTEN does not assume any liability for infringement of patents, copyrights, or other intellectual property
rights of third parties by or arising from the use of the Products or technical information described in this
document.
The Products are not designed or manufactured to be used with any equipment, device or system which
requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to
human life or create a risk of human injury (such as a medical instrument, transportation equipment,
aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). LONTEN shall bear no
responsibility in any way for use of any of the Products for the above special purposes.
Although LONTEN endeavors to improve the quality and reliability of its products, semiconductor products
have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain
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injury, and injury or damage caused by fire in the event of the failure of a LONTEN product.
The content specified herein is subject to change for improvement without notice. When using a LONTEN
product, be sure to obtain the latest specifications.
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