HSS2308A
N-Ch 60V Fast Switching MOSFETs
Description
Product Summary
The HSS2308A is the high cell density trenched Nch MOSFETs, which provides excellent RDSON
and efficiency for most of the small power switching
and load switch applications.
The HSS2308A meet the RoHS and Green Product
requirement with full function reliability approved.
VDS
60
V
RDS(ON),max
100
mΩ
ID
2.3
A
SOT23 Pin Configuration
⚫
⚫
⚫
⚫
Green Device Available
Super Low Gate Charge
Excellent CdV/dt effect decline
Advanced high cell density Trench
technology
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
60
V
VGS
Gate-Source Voltage
±20
V
ID@TA=25℃
Continuous Drain Current, VGS @ 10V1
2.3
A
ID@TA=70℃
Continuous Drain Current, VGS @ 10V1
1.8
A
IDM
Pulsed Drain Current2
9.2
A
PD@TA=25℃
Total Power Dissipation3
1
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
Max.
Unit
RθJA
Thermal Resistance Junction-Ambient 1
---
125
℃/W
RθJC
Thermal Resistance Junction-Case1
---
80
℃/W
www.hs-semi.cn
Ver 2.0
1
HSS2308A
N-Ch 60V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
Static Drain-Source On-Resistance2
VGS(th)
Gate Threshold Voltage
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
Conditions
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
60
---
---
V
Reference to 25℃ , ID=1mA
---
0.054
---
V/℃
VGS=10V , ID=2A
---
80
100
VGS=4.5V , ID=1A
---
85
110
1.2
---
2.5
V
---
-4.96
---
mV/℃
VDS=48V , VGS=0V , TJ=25℃
---
---
1
VDS=48V , VGS=0V , TJ=55℃
---
---
5
VGS=VDS , ID =250uA
m
uA
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=2A
---
13
---
S
Qg
Total Gate Charge (4.5V)
---
5
7.0
Qgs
Gate-Source Charge
---
1.68
2.4
Qgd
Gate-Drain Charge
---
1.9
2.7
VDS=48V , VGS=4.5V , ID=2A
nC
---
1.6
3.2
Rise Time
VDD=30V , VGS=10V , RG=3.3,
---
7.2
13
Turn-Off Delay Time
ID=2A
---
25
50
Fall Time
---
14.4
28.8
Ciss
Input Capacitance
---
511
715
Coss
Output Capacitance
---
38
53
Crss
Reverse Transfer Capacitance
---
25
35
Min.
Typ.
Max.
Unit
---
---
2.3
A
---
---
9.2
A
---
---
1.2
V
---
9.7
---
nS
---
5.8
---
nC
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=15V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
Parameter
IS
Continuous Source Current1,4
ISM
Pulsed Source Current2,4
VSD
Diode Forward Voltage2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Conditions
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25℃
IF=2A , dI/dt=100A/µs , TJ=25℃
Note :
1.The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature.
4.The data is theoretically the same as I D and IDM , in real applications , should be limited by total power dissipation.
www.hs-semi.cn
Ver 2.0
2
HSS2308A
N-Ch 60V Fast Switching MOSFETs
Typical Characteristics
100
10
ID=2A
VGS=10V
95
VGS=7V
VGS=5V
6
90
VGS=4.5V
RDSON (mΩ)
ID Drain Current (A)
8
VGS=3V
85
4
2
80
0
75
0
0.5
1
1.5
VDS , Drain-to-Source Voltage (V)
2
2
Fig.1 Typical Output Characteristics
4
6
VGS (V)
8
10
Fig.2 On-Resistance v.s Gate-Source
Voltage
10
IS Source Current(A)
8
6
TJ=150℃
4
TJ=25℃
2
0
0.2
0.4
0.6
0.8
1
VSD , Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics of Reverse
Fig.4 Gate-Charge Characteristics
diode
Normalized On Resistance
2.0
1.5
1.0
0.5
-50
0
50
100
150
TJ , Junction Temperature (℃)
Fig.5 Normalized VGS(th) v.s TJ
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Fig.6 Normalized RDSON v.s TJ
Ver 2.0
3
HSS2308A
N-Ch 60V Fast Switching MOSFETs
1000
10.00
F=1.0MHz
100us
Capacitance (pF)
Ciss
10ms
ID (A)
1.00
100
100ms
0.10
Coss
1s
TA=25℃
Single Pulse
Crss
DC
0.01
10
1
5
9
13
17
VDS Drain to Source Voltage(V)
21
0.1
25
1
Fig.7 Capacitance
10
100
VDS (V)
1000
Fig.8 Safe Operating Area
Normalized Thermal Response (R θJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
PDM
0.001
TON
SINGLE PULSE
T
D = TON/T
TJpeak = TA + PDM x RθJA
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
VDS
90%
10%
VGS
Td(on)
Tr
Ton
Td(off)
Tf
Toff
Fig.10 Switching Time Waveform
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Fig.11 Gate Charge Waveform
Ver 2.0
4
HSS2308A
N-Ch 60V Fast Switching MOSFETs
Ordering Information
Part Number
HSS2308A
Package code
SOT-23L
Packaging
3000/Tape&Reel
c
www.hs-semi.cn
Ver 2.0
5
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