NP6003MR
60V N-Channel Enhancement Mode MOSFET
Description
Schematic diagram
The NP6003MR uses advanced trench technology
and design to provide excellent R DS(ON) with low gate
charge. It can be used in a wide variety of applications.
D
G
General Features
V DS =60V ID =3A
RDS(ON)=75mΩ @ V GS=10V (Typ:80m Ω)
RDS(ON)=83mΩ @ V GS =4.5V (Typ:90m Ω)
High density cell design for ultra low Rdson.
Fully characterized avalanche voltage and current.
Low gate to drain charge to reduce switching
losses.
S
Marking and pin assignment
SOT-23-3L
(TOP VIEW)
D
3
Application
Power switching application.
Hard switched and high frequency circuits.
Uninterruptible power supply.
NP6003
Package
1
2
G
S
SOT-23-3L
Ordering Information
Part Number
Storage Temperature
Package
Devices Per Reel
NP6003MR-G
-55°C to +150°C
SOT-23-3L
3000
Absolute Maximum Ratings (TA=25℃ unless otherwise noted)
parameter
symbol
limit
unit
Drain-source voltage
V DS
60
V
Gate-source voltage
V GS
±20
V
TC=25°C
Continuous Drain Current
TC=70°C
Pulsed Drain Current
I DP
Maximum power dissipation
TC=25°C
Power Dissipation – Derate above 25℃
TC=75°C
Operating junction Temperature range
Rev.1.0 —Oct. 26. 2017
ID
1
PD
Tj
3
2
12
2
1.4
-55—150
A
A
W
℃
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NP6003MR
Electrical Characteristics (TA=25℃ unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
60
-
-
V
Static Characteristics
Drain-source breakdown voltage
BV DSS
V GS =0V, I D =250µA
BVDSS Temperature Coefficient
△BV DSS /△T J
Zero gate voltage drain current
I DSS
Gate Leakage Current
I GSS
Gate threshold voltage
V GS(th)
Drain-source on-state resistance1
R DS(ON)
Reference to 25℃,ID=1mA
V DS =60V, V GS =0V
mV/℃
33
-
-
1
-
-
30
V DS =0V, V GS =±20V
-
-
±100
nA
V DS =V GS , I D =250µA
1.2
1.9
2.5
V
-
75
90
86
100
T J =85°C
V GS =10V, I D =3A
V GS =4.5V, I D =2A
µA
mΩ
VDS=10V, VGS=10V
3
-
-
A
ISD=1A,VGS=0V
-
0.75
1.1
V
-
-
3
A
-
15
-
ns
Qrr
IF=1.5A,
dI/dt=100A/us
-
12
-
nC
Gate Resistance
RG
VGS=0V, VDS=0V,f=1MHz
-
2.0
-
Ω
Input capacitance
C ISS
-
175
-
-
21
-
-
13
-
-
15
-
-
16
-
-
10
-
-
10
-
-
4.1
On Status Drain Current
I D(ON)
Diode Characteristics
Diode Forward Voltage
VSD
Diode Continuous Forward Current
IS
Reverse Recovery Time
trr
Reverse Recovery Charge
2
Dynamic Characteristics
Output capacitance
C OSS
Reverse transfer capacitance
C RSS
Turn-on delay time
t D(ON)
Turn-on Rise time
tr
Turn-off delay time
t D(OFF)
Turn-off Fall time
tf
Total gate charge
Qg
Gate-source charge
Q gs
Gate-drain charge
Q gd
V GS =0V ,V DS =25V
f=1.0MHz
V GS =10V, V DD =30V,
RL=4.7Ω, I D =1.5A,
R G =3.3Ω
V GS =10V,I D =2A
V DS =30V
1
-
Note: 1:Pulse test; pulse width ≦ 300ns, duty cycle ≦ 2%.
2:Guaranteed by design, not subject to production testing.
Thermal Characteristics
Parameter
Symbol
Typical
Thermal Resistance-Junction to Case
Rθjc
60
Thermal Resistance junction-to ambient
Rθja
90
Rev.1.0 —Oct. 26. 2017
2
ns
nC
0.8
-
pF
Unit
℃/W
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NP6003MR
Rev.1.0 —Oct. 26. 2017
3
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NP6003MR
Package Information
SOT-23-3L
θ
D
b
E
E1
L
0.2
e
c
Symbol
Dimensions In Millimeters
A
A2
A1
e1
Dimensions In Inches
Min
Max
Min
Max
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950(BSC)
0.037(BSC)
e1
1.800
2.000
0.071
0.079
L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
Rev.1.0 —Oct. 26. 2017
4
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