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AP2311MI

AP2311MI

  • 厂商:

    APM-MICROELECTRONICS(永源微)

  • 封装:

    SOT23-3

  • 描述:

    类型:P沟道;漏源电压(Vdss):12V;连续漏极电流(Id):7A;功率(Pd):1.6W;导通电阻(RDS(on)@Vgs,Id):19mΩ@4.5V,5.2A;

  • 数据手册
  • 价格&库存
AP2311MI 数据手册
AP2311MI -12V P-Channel Enhancement Mode MOSFET Description The AP2311MI uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a Battery protection or in other Switching application. General Features VDS = -12V ID =-7.0A RDS(ON) < 24mΩ @ VGS=4.5V (Type:19mΩ) Application electronic cigarette Load switch Package Marking and Ordering Information Product ID Pack Marking Qty(PCS) AP2311MI SOT23-3L 20P07 3000 Absolute Maximum Ratings (TC=25℃unless otherwise noted) Symbol Parameter Rating Units VDSS Drain-Source Voltage -12 V VGSS Gate-Source Voltage ±12 V ID@TC=25℃ Continuous Drain Current, VGS @ 10V1 -7.0 A ID@TC=100℃ Continuous Drain Current, VGS @ 10V1 -3.6 A IDM Pulsed Drain Current note1 -22 A PD@TC=25℃ Power Dissipation 1.6 W RθJA Thermal Resistance, Junction to Ambient 125 ℃/W TJ, TSTG Operating and Storage Temperature Range -55 to +150 ℃ 1 AP2311MI RVE1.0 永源微電子科技有限公司 AP2311MI -12V P-Channel Enhancement Mode MOSFET Electrical Characteristics (TJ=25℃, unless otherwise noted) Symbol Parameter Test Condition Min. Typ. Max. Units V(BR)DSS Drain-Source Breakdown Voltage VGS=0V, ID=-250μA -12 -18 - V IDSS Zero Gate Voltage Drain Current VDS =-12V, VGS = 0V, - - -1 μA IGSS Gate to Body Leakage Current VDS =0V, VGS = ±12V - - ±100 nA VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250μA -0.5 -0.65 -1.0 V RDS(on) Static Drain-Source on-Resistance note2 VGS=-4.5V, ID=-5.2A - 19 24 mΩ RDS(on) Static Drain-Source on-Resistance note2 VGS=-2.5V, ID=-4.2A 28 35 mΩ Ciss Input Capacitance - 1100 - pF - 390 - pF - 300 - pF - 11.5 - 1.5 - nC Coss Output Capacitance Crss Reverse Transfer Capacitance Qg Total Gate Charge VDS=-6V, VGS=0V f=1.0MHz VDS=-4V, ID=-4.1A, VGS = -4.5V nC Qgs Gate-Source Charge Qgd Gate-Drain(“Miller”) Charge - 3.2 - nC td(on) Turn-on Delay Time - 25 - ns tr Turn-on Rise Time - 45 - ns td(off) Turn-off Delay Time - 72 - ns tf Turn-off Fall Time - 60 - ns - - -6.0 A - - -16 A VGS=0V, IS =-4.1A - - -1.2 V VGS=0V, IS=-4.1A, di/dt=100A/μs - 20 - ns - 9 - nC IS Maximum Continuous Drain to Source Diode Forward Current ISM VSD VDD =-4V, ID=-3.3A, RG=1.0Ω, VGEN=-4.5V, RL=1.2Ω Maximum Pulsed Drain to Source Diode Forward Current Drain to Source Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge Note : 1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3、The power dissipation is limited by 150℃ junction temperature 4、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. 2 AP2311MI RVE1.0 永源微電子科技有限公司 AP2311MI -12V P-Channel Enhancement Mode MOSFET Typical Characteristics 3 AP2311MI RVE1.0 永源微電子科技有限公司 AP2311MI -12V P-Channel Enhancement Mode MOSFET 4 AP2311MI RVE1.0 永源微電子科技有限公司 AP2311MI -12V P-Channel Enhancement Mode MOSFET Package Mechanical Data-SOT23-3 Symbol A A1 A2 b c D E1 E e e1 L θ Dimensions In Millimeters Min. Max. 1.050 1.250 0.000 0.100 1.050 1.150 0.300 0.500 0.100 0.200 2.820 3.020 1.500 1.700 2.650 2.950 0.950(BSC) 1.800 2.000 0.300 0.600 0° 8° Dimensions In Inches Min. Max. 0.041 0.049 0.000 0.004 0.041 0.045 0.012 0.020 0.004 0.008 0.111 0.119 0.059 0.067 0.104 0.116 0.037(BSC) 0.071 0.079 0.012 0.024 0° 8° 5 AP2311MI RVE1.0 永源微電子科技有限公司 AP2311MI -12V P-Channel Enhancement Mode MOSFET Attention 1,Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications. 2,APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein. 3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment. 4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design. 5,In the event that any or all APM Microelectronics products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. 6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD. 7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. 8, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use. 6 AP2311MI RVE1.0 永源微電子科技有限公司 AP2311MI -12V P-Channel Enhancement Mode MOSFET Edition Date Change Rve1.0 2020/9/8 Initial release Copyright Attribution“APM-Microelectronice” 7 AP2311MI RVE1.0 永源微電子科技有限公司
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