NP3411MR
30V P-Channel Enhancement Mode MOSFET
Description
Schematic diagram
The NP3411MR uses advanced trench technology
to provide excellent R DS(ON) , low gate charge and
operation with gate voltages as low as 1.8V. This
device is suitable for use as a load switch or in PWM
applications.
S
G
General Features
D
V DS =-30V,I D =-9A
R DS(ON) (Typ.)=28mΩ @V GS =-4.5V
R DS(ON) (Typ.)=22mΩ @V GS =-10V
High power and current handing capability
Lead free product is acquired
Surface mount package
Marking and pin assignment
(Thickness 0.55mm)
SOT-23
(TOP VIEW)
D
3
Application
PWM applications
Load switch
NP 3 4 11
Package
SOT-23-3L
1
2
G
S
NP----Natlinear Power
3411----NP3411
Ordering Information
Part Number
Storage Temperature
Package
Devices Per Reel
NP3411MR-G
-55°C to +150°C
SOT-23
3000
Absolute Maximum Ratings (TA=25℃ unless otherwise noted)
parameter
symbol
limit
unit
Drain-source voltage
V DS
-30
V
Gate-source voltage
V GS
±20
V
a
Drain current-continuous @Tj=125℃
-pulse db
ID
-9
A
I DM
-36
A
Drain-source Diode forward current
Is
-9
A
Maximum power dissipation
PD
18
W
Operating junction Temperature range
Tj
-55—150
℃
Rev.1.0 —Dec. 15. 2018
1
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NP3411MR
Electrical Characteristics (TA=25℃ unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
OFF Characteristics
Drain-source breakdown voltage
BV DSS
V GS =0V, I D =-250µA
-30
-
-
V
Zero gate voltage drain current
I DSS
V DS =-30V, V GS =0V
-
-
-1
µA
Gate-body leakage
I GSS
V DS =0V, V GS =±20V
-
-
±100
nA
V DS =V GS , I D =-250µA
-1
-1.7
-2.5
V
V GS =-10V, I D =-9A
-
22
28
V GS =-4.5V, I D =-6A
-
28
36
V GS =-5V, I D =-9A
-
5
-
-
1092
-
-
124
-
-
99
-
-
8
-
-
6
-
-
17
-
-
5
-
-
11.4
-
-
4.3
-
-
3.5
-
-
-0.81
-1.2
ON Characteristics
Gate threshold voltage
V GS(th)
Drain-source on-state resistance
R DS(ON)
Forward transconductance
gfs
mΩ
S
Dynamic Characteristics
Input capacitance
C ISS
Output capacitance
C OSS
Reverse transfer capacitance
C RSS
V DS =-15V ,V GS =0V
f=1.0MHz
pF
Switching Characteristics
Turn-on delay time
t D(ON)
Rise time
V DS =-15V
V GS =-10V
R L =2.3Ω
R GEN =3Ω
tr
Turn-off delay time
t D(OFF)
Fall time
tf
Total gate charge
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
V DS =-15V,I D =-6A
V GS =-10V
ns
nC
DRAIN-SOURCE DIODE CHARACTERISTICS
Diode forward voltage
V SD
V GS =0V,Is=-1.25A
V
Notes:
a. surface mounted on FR4 board,t≤10sec
b. pulse test: pulse width≤300μs,duty≤2%
c. guaranteed by design, not subject to production testing
Thermal Characteristics
Thermal Resistance junction-to ambient
Rev.1.0 —Dec. 15. 2018
Rth JA
2
100
℃/W
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NP3411MR
Typical Performance Characteristics
25.0
15.0
13.5
VGS=10V
-ID-Drain Current(A)
-ID-Drain Current(A)
22.5
20.0
VGS=4.5V
17.5
VGS=3.3V
15.0
12.5
10.0
7.5
5.0
VGS=2.5V
12.0
10.5
9.0
7.5
6.0
4.5
3.0
1.5
2.5
0.0
0.0
0
1
2
3
4
5
6
7
8
9
0.0
10
0.5
90
1800
80
1600
70
60
VGS=-3.3V
40
VGS=-4.5V
30
20
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1400
Ciss
1200
1000
800
600
Coss
Ciss
400
VGS=-10V
10
200
0
0
Crss
Ciss
0
1
2
3
4
5
6
7
8
0.0
9
1.5
3.0
4.5
6.0
7.5
9.0
10.5
12.0
13.5
15.0
-Vds Drain-Source Voltage(V)
-ID-Drain Current(A)
Fig3 Rdson-Drain current
Fig4 Capacitance vs Vds
5.0
-Vgs Gate-Source Voltage(V)
10
-IS- Reverse Drain Current(A)
1.5
Fig2 Transfer Characteristics
2000
Capacitance(pF)
Rdson- On Resistance(mR)
Fig1 Output Characteristics
100
50
1.0
-Vgs Gate-Source Voltage(V)
-Vds Drain-Source Voltage(V)
1
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
0.0
0.2
0.4
0.6
0.8
1.0
0
1.2
2
3
4
5
6
7
8
9
10
Qg Gate Charge(nC)
-Vsd Source -Gate Voltage(V)
Fig5 Source-Drain Diode Forward
Rev.1.0 —Dec. 15. 2018
1
Fig6 Gate Charge
3
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200
20
180
18
Power Dissipation (W)
Rds- On Resistance(mR)
NP3411MR
160
140
120
100
80
60
40
20
16
14
12
10
8
6
4
2
0
0
0
1
2
3
4
5
6
7
8
9
10
0
15
30
45
60
75
90
105
120
-Vgs Gate-Source Voltage(V)
TJ-Junction Temperature(ºC)
Fig7 Rdson-Gate Drain voltage
Fig8 Power De-rating
Rev.1.0 —Dec. 15. 2018
4
135
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150
NP3411MR
Rev.1.0 —Dec. 15. 2018
5
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NP3411MR
Package Information
SOT-23
Rev.1.0 —Dec. 15. 2018
6
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