NP3407VR
30V P-Channel Enhancement Mode MOSFET
Description
Schematic diagram
The NP3407VR uses advanced trench technology
to provide excellent R DS(ON) , low gate charge and
operation with gate voltages as low as 2.5V. This
device is suitable for use as a load switch or in PWM
applications.
S
G
General Features
D
V DS =-30V,I D =-4A
R DS(ON)(Typ.)=45mΩ @VGS=-10V
RDS(ON)(Typ.)=60mΩ @VGS=-4.5V
High power and current handing capability
Lead free product is acquired
Surface mount package
Marking and pin assignment
SOT-23
(TOP VIEW)
D
3
Application
347S
PWM applications
Load switch
Package
SOT-23
1
2
G
S
Ordering Information
Part Number
Storage Temperature
Package
Devices Per Reel
NP3407VR-G
-55°C to +150°C
SOT-23
3000
Absolute Maximum Ratings (TA=25℃ unless otherwise noted)
parameter
symbol
limit
unit
Drain-source voltage
V DS
-30
V
Gate-source voltage
V GS
±20
V
T C =25°C
T C =70°C
Continuous Drain Current (TJ = 150 °C)
T A =25°C
-4
ID
T C =25°C
T A =25°C
Pulsed Drain Current (t = 300 µs)
Rev.1.0 —Oct. 26. 2017
IS
I DM
1
-3.5b,c
-2.7b,c
T A =70°C
Continuous Source-Drain Diode Current
-3.5
A
-1.4
-1b,c
-12.8
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NP3407VR
T C =25°C
1.7
T C =70°C
Maximum power dissipation
1.1
PD
T A =25°C
W
1b,c
0.6b,c
T A =70°C
T J ,T STG
-55—150
℃
Symbol
Typical
Maximum
Unit
t≤5s
R θJA
100
130
Steady State
R θJF
60
75
Operating Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient
b, d
Maximum Junction-to-Foot (Drain)
℃/W
Notes:
a. TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 175 °C/W.
Electrical Characteristics (TA=25℃ unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
OFF Characteristics
Drain-source breakdown voltage
BV DSS
V GS =0V, I D =-250µA
-30
-
-
V
Zero gate voltage drain current
I DSS
V DS =-30V, V GS =0V
-
-
-1
µA
Gate-body leakage
I GSS
V DS =0V, V GS =±20V
-
-
±100
nA
-0.7
-1.3
-2.5
V
45
65
ON Characteristics
Gate threshold voltage
V GS(th)
Drain-source on-state resistance
R DS(ON)
Forward transconductance
V DS =V GS , I D =-250µA
V GS =-10V, I D =-4A
gfs
V GS =-4.5V, I D =-3A
-
62
90
V DS =-5V, I D =-4A
-
10
-
-
700
-
-
120
-
-
75
-
-
9
-
-
5
-
-
28
-
-
12.5
-
-
14
-
-
3.1
-
-
3
-
mΩ
S
Dynamic Characteristics
Input capacitance
C ISS
Output capacitance
C OSS
Reverse transfer capacitance
C RSS
V DS =-10V ,V GS =0V
f=1.0MHz
pF
Switching Characteristics
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
t D(ON)
tr
t D(OFF)
tf
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
Rev.1.0 —Oct. 26. 2017
V DD =-15V
I D =-4A
V GEN =-10V
R L =10ohm
R GEN =6ohm
V DS =-15V,I D =-4A
V GS =-4.5V
2
ns
nC
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NP3407VR
DRAIN-SOURCE DIODE CHARACTERISTICS
Diode forward voltage
V SD
V GS =0V,Is=-4.2A
-
-0.81
-1.2
V
Typical Performance Characteristics
25
20
VGS=-2.0V
VGS=-2.5V
VGS=-4.5V
VGS=-10V
20
VDS=-5V
15
-ID(A)
-ID(A)
15
10
10
5
5
0
0.0
0
0
1
2
3
4
5
0.5
1.0
1.5
2.0
2.5
3.0
-VGS(Volts)
-VDS(Volts)
Fig 1:On-Region Characteristics
Fig 2:Transfer Characteristics
200
100
180
VGS=-4.5V
VGS=-10V
80
160
VGS=-2.5V,ID=-2A
VGS=-4.5V,ID=-3.7A
VGS=-10V,ID=-4A
RDS(ON)(mR)
RDS(on)(mR)
140
60
120
100
80
60
40
40
20
20
0
2
4
6
8
0
10
0
20
40
60
80
100
120
-ID(A)
Temperature
Fig 3:On-Resistance vs. Drain Current
and Gate Voltage
Fig 4:On-Resistance vs. Junction
Temperature
25
150
ID=-4A
20
15
-IS(A)
RDS(ON)(mR)
120
90
10
60
5
0
0.0
30
0
2
4
6
8
10
Fig 5:On-Resistance vs. Gate-Source
Voltage
Rev.1.0 —Oct. 26. 2017
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-VSD(V)
-VGS(V)
Fig 6:Body-Diode Characteristics
3
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NP3407VR
Package Information
SOT-23
Rev.1.0 —Oct. 26. 2017
4
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