HSS2N15
N-Ch 150V Fast Switching MOSFETs
Description
Product Summary
The HSS2N15 is the high cell density trenched Nch MOSFETs, which provides excellent RDSON
and efficiency for most of the small power switching
and load switch applications.
The HSS2N15 meet the RoHS and Green Product
requirement with full function reliability approved.
VDS
150
V
RDS(ON),max
280
mΩ
ID
1.8
A
⚫
⚫
⚫
⚫
SOT23 Pin Configuration
Green Device Available
Super Low Gate Charge
Excellent Cdv/dt effect decline
Advanced high cell density Trench
technology
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
150
V
VGS
Gate-Source Voltage
ID@TA=25℃
ID@TA=70℃
IDM
PD@TA=25℃
±20
V
Continuous Drain Current, VGS @
10V1
1.8
A
Continuous Drain Current, VGS @
10V1
1.4
A
Current2
7.2
A
Dissipation3
1.3
W
Pulsed Drain
Total Power
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
RθJA
Thermal Resistance Junction-ambient
RθJC
Thermal Resistance Junction-Case1
www.hs-semi.cn
Ver 2.1
1
Typ.
Max.
Unit
---
100
℃/W
---
80
℃/W
1
HSS2N15
N-Ch 150V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
Parameter
BVDSS
Drain-Source Breakdown Voltage
RDS(ON)
Static Drain-Source On-Resistance2
VGS(th)
Conditions
Min.
Typ.
Max.
Unit
150
---
---
V
VGS=10V , ID=2A
---
240
280
VGS=4.5V , ID=1A
---
250
300
VGS=0V , ID=250uA
m
Gate Threshold Voltage
VGS=VDS , ID =250uA
1.0
2
2.5
V
IDSS
Drain-Source Leakage Current
VDS=150V , VGS=0V , TJ=25℃
---
---
1
uA
IDSS
Drain-Source Leakage Current
VDS=150V , VGS=0V , TJ=125℃
---
---
30
uA
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
Qg
Total Gate Charge (10V)
---
18
---
Qgs
Gate-Source Charge
---
4.6
---
Qgd
Gate-Drain Charge
---
5.7
---
Td(on)
Turn-On Delay Time
---
13
---
Tr
Td(off)
Tf
VDS=75V , VGS=10V , ID=2A
Rise Time
VDD=75V , VGS=10V , RG=6
---
19
---
Turn-Off Delay Time
ID=2A
---
26
---
nC
ns
Fall Time
---
9
---
Ciss
Input Capacitance
---
840
---
Coss
Output Capacitance
---
119
---
Crss
Reverse Transfer Capacitance
---
25
---
Min.
Typ.
Max.
Unit
VG=VD=0V , Force Current
---
---
1.8
A
VGS=0V , IS=1A , TJ=25℃
---
---
1.2
V
VDS=75V , VGS=0V , f=1MHz
pF
Diode Characteristics
Symbol
IS
VSD
Parameter
Continuous Source Current1,4
Diode Forward
Voltage2
Conditions
\
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
www.hs-semi.cn
Ver 2.1
2
HSS2N15
N-Ch 150V Fast Switching MOSFETs
Typical Characteristics
www.hs-semi.cn
Ver 2.1
3
HSS2N15
N-Ch 150V Fast Switching MOSFETs
www.hs-semi.cn
Ver 2.1
4
HSS2N15
N-Ch 150V Fast Switching MOSFETs
Ordering Information
Part Number
HSS2N15
www.hs-semi.cn
Package code
SOT-23L
Ver 2.1
Packaging
3000/Tape&Reel
5
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