50N06
● General Description
● Product Summary
The 50N06 combines advanced trench MOSFET
D
VDS =60V
technology with a low resistance package to provide
extremely low R
DS(ON)
.This device is ideal for load switch
RDSON(10 V typ) =14mΩ
G
and battery protection applications.
RDSON(4.5V typ) =18mΩ
S
● Features
ID=50A
Advance high cell density Trench technology
Low RDS(ON) to minimize conductive loss
Low Gate Charge for fast switching
D
Low Thermal resistance
50N06
●Application
TFYXXAA
50N06
MB/VGA Vcore
SMPS 2nd Synchronous Rectifier
D
POL application
G
BLDC Motor driver
TO-252
S
●Absolute Maximum Ratings(TC =25℃)
Parameter
Symbol
Rating
Unit
Drain-Source Voltage
VDS
60
V
Gate-Source Voltage
VGS
20
V
ID@TC=25℃
50
A
ID@TC=75℃
35
A
ID@TC=100℃
30
A
IDM
104
A
Total Power Dissipation(TC=25℃)
PD@TC=25℃
70
W
Total Power Dissipation(TA=25℃)
PD@TA=25℃
2.8
W
TJ
-55 to 150
℃
TSTG
-55 to 150
℃
IAS IAR
40
A
Continuous Drain Current
Pulsed Drain Current ①
Operating Junction Temperature
Storage Temperature
Avalanche Current
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50N06
●Thermal resistance
Symbol
Min.
Typ.
Max.
Unit
Thermal resistance, junction - case
RthJC
-
-
2.8
°C/W
Thermal resistance, junction - ambient
RthJA
-
-
55
°C/W
Soldering temperature, wavesoldering for 10s
Tsold
-
-
265
°C
Min.
Typ
Max.
Unit
Parameter
●Electronic Characteristics
Parameter
Symbol
Condition
Drain-Source Breakdown
Voltage
BVDSS
VGS =0V, ID =250uA
60
Gate Threshold Voltage
VGS(TH)
VGS =V DS, ID =250uA
1.0
Drain-Source Leakage Current
IDSS
Gate- Source Leakage Current
IGSS
V
2.2
V
VDS=60V, VGS =0V
1.0
uA
VGS=±20V, VDS =0V
±100
nA
1.5
VGS=10V, ID=20A
14
21
mΩ
VGS=4.5V, ID=15A
18
25
mΩ
gFS
VDS =25V, ID=10A
20
VSD
Is=20A
Static Drain-source On
Resistance
RDS(ON)
Forward Transconductance
Source-drain voltage
S
1.20
V
Unit
●Electronic Characteristics
Parameter
Symbol
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Condition
VDS =25V
VGS = 0V
f = 1MHz
Min.
Typ
Max.
-
1000
-
-
108.5
-
-
96.9
-
pF
●Gate Charge characteristics(Ta= 25℃)
Parameter
Symbol
Condition
Min.
Typ
Max.
Total gate charge
Qg
VDD =25V
-
15
-
Gate - Source charge
Qgs
ID = 10A
-
4.5
-
Gate - Drain charge
Qgd
VGS = 10V
-
7.5
-
Note: ① Pulse Test : Pulse width ≤ 300μs, Duty cycle ≤ 2% ;
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Unit
nC
50N06
Fig.2 Typical output Characteristics
1.2
100
VGS=10V
1
Drain Current (A)
Power Dissipation Pd/Pd MAX.%
Fig.1 Power Dissipation
0.8
0.6
0.4
VGS=4.5V
50
0.2
0
0
0
50
100
150
0
200
Temperature (。C)
Fig.3 Threshold Voltage V.S Junction Temperature
2
Fig.4 Resistance V.S Drain Current
30
2.5
ON Resistance
2
Vgs(th )
0.5
1
1.5
Drain-Source voltage (V)
1.5
1
20
10
0.5
0
0
-50
50
Junction Temperature
0
150
Fig.5 On-Resistance VS Gate Source Voltage
10
20
30
Drain Current(A)
40
Fig.6 On-Resistance V.S Junction Temperature
1.5
Normalized ON-Resistance
RDson(mΩ)
30
20
10
1.2
0.9
0.6
0.3
0
3
5
7
VGS( V )
-50
9
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0
50
100
Temperature
150
50N06
Fig.7 Switching Time Measurement Circuit
Fig.8 Gate Charge Waveform
Fig.9 Switching Time Measurement Circuit
Fig.10 Gate Charge Waveform
Fig.11 Avalanche Measurement Circuit
Fig.12 Avalanche Waveform
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50N06
Package Information
TO-252
E
A
E1
c2
L4
H
D
D1
L3
b3
c
b
e
SEE VIEW A
0
GAUGE PLANE
SEATING PLANE
0.25
A1
L
S
Y
M
B
O
L
A
VIEW A
TO-252
RECOMMENDED LAND PATTERN
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
2.18
2.39
0.086
0.094
0.005
0.13
A1
b
0.50
0.89
0.020
0.035
b3
4.95
5.46
0.195
0.215
c
0.46
0.61
0.018
0.024
c2
0.46
0.89
0.018
0.035
0.245
D
5.33
6.22
0.210
D1
4.57
6.00
0.180
E
6.35
6.73
0.250
0.236
0.265
E1
3.81
6.00
0.150
0.236
e
2.29 BSC
9.40
10.41
0.370
0.410
L
0.90
1.78
0.035
0.070
L3
0.89
2.03
0.035
0.080
0
0.040
1.02
0°
6.8 MIN.
6.6
3 MIN.
0.090 BSC
H
L4
6.25 MIN.
8°
0°
8°
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2.286
1.5 MIN.
4.572
UNIT: mm
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