MD7601B12

High Voltage Low Power Consumption LDO MD7601 Series CMOS Voltage Regulator 1A MD7601 Series is a high voltage (up to 40V) low power low dropout voltage regulator (LDO) manufactured in CMOS processes. It can deliver up to 1A of current while consuming only 12uA of quiescent current. It consists of a reference voltage generator, an error amplifier, a current foldback circuit, and a phase compensation circuit plus a driver transistor. ■ FEATURES ⚫ Ultra-low Quiescent Current: 12uA ⚫ Maximum Input Voltage: 40V ⚫ Output Voltage Highly Accurate: ±2％ ⚫ Maximum Output Current: 1A ⚫ Dropout Voltage: 10mV@IOUT=10mA ⚫ Temperature Stability: ±50ppm/℃ ⚫ Protections Circuits: Current Limiter, Foldback, Thermal shutdown ⚫ Output Capacitor: Low ESR Ceramic Capacitor Compatible ⚫ ⚫ ⚫ ⚫ Smart wearer Long-life battery-powered devices Portable mobile devices, such as mobile phones, cameras, and so on Wireless communication equipment ■ APPLICATIONS ■ Product Selections Type Output Voltage （note 1*） Current Limit Accuracy MD7601A30 MD7601A33 MD7601A36 MD7601A40 MD7601A50 MD7601A12 MD7601B30 MD7601B33 MD7601B36 MD7601B40 MD7601B50 MD7601B12 MD7601C30 MD7601C33 MD7601C36 MD7601C40 3.0V 3.3V 3.6V 4.0V 5.0V 12.5V 3.0V 3.3V 3.6V 4.0V 5.0V 12.0V 3.0V 3.3V 3.6V 4.0V 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A 1.8A ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% ±2% 1 / 12 Package MARKING （note 2*） (note 3*） TO-252 TO-252 TO-252 TO-252 TO-252 TO-252 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 SOT-223 7601A30 7601A33 7601A36 7601A40 7601A50 7601A12 7601B30 7601B33 7601B36 7601B40 7601B50 7601B12 7601C30 7601C33 7601C36 7601C40 MD7601C50 MD7601C12 5.0V 12.0V 1.8A 1.8A ±2% ±2% SOT-223 SOT-223 7601C50 7601C12 Notes: 1* Customer can request to customize the output voltage ranged from 1.2V to 15V if desired voltage is not found in the selections. 2* Customer can request customization of package choice. 3* Please pay attention to the MARKING of the product package type. ■ PIN CONFIGURATION (TOP VIEW) TO-252 GND 2 7601AXX SOT-223 VOUT SOT-223 VOUT 4 4 7601BXX 7601CXX 1 3 1 2 3 1 2 3 VIN VOUT VIN VOUT GND GND VOUT VIN ■ Absolute Maximum Ratings (Unless otherwise indicated: Ta=25℃) PARAMETER SYMBOL RATINGS Input Voltage VIN -0.3 ~ 45 Output Voltage VOUT Vss-0.3 ~ VIN+0.3V Power Dissipation PD Operating Ambient Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +125 ESD Protection ESD HBM 2000 TO 252 SOT 223 UNITS 1800 1500 Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. 2 / 12 V mW ℃ V ■ ELECTRICAL CHARACTERISTICS MD7601 Series (Unless otherwise indicated：Ta=25℃) PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT Output Voltage*1 VOUT(S) VIN= VOUT(S)+2V，IOUT=10mA VOUT(S) 0.98 VOUT(S) VOUT(S) 1.02 V Dropout Voltage*2 VDROP IOUT=1mA 4 8 IOUT=1A 1000 1500 Line Regulation ΔVOUT ΔVIN • VOUT(s) VOUT(S)+2V≤VIN≤40V IOUT =1mA 0.01 0.02 VOUT(S)≤10V 20 80 VOUT(S)>10V 85 150 Load Regulation Temperature Stability VOUT2 ΔVOUT Ta • VOUT(s) GND Current VIN=VOUT(S)+2V 1mA≤IOUT≤300mA ±50 -40℃≤Ta≤85℃ VOUT(S)≤10V no load VOUT(S)>10V IOUT=100mA Input Voltage VIN Maximum Output Current IOUTMAX Current Limit*3 ILIM Short Circuit Current*4 ISHORT Power Supply Rejection Ratio Over Temperature Protection ppm/℃ 10 30 12 30 uA 40 V 460 --- 2.2 1 A VIN= VOUT(S)+2V, 1.8 VOUT = 0.95 ×VOUT(S) VIN=VOUT(S)+2V VOUT=0V PSRR VOUT(S)≤10V 50 VOUT(S)>10V 75 f=10Hz, VOUT(S)=3.6V 84 f=100Hz, VOUT(S)=3.6V 80 f=1kHz, VOUT(S)=3.6V 58 IOUT=1mA 180 OTP Notes: 1. VOUT(S): Output voltage when VIN=VOUT+2V, IOUT=1 mA. 2. VDROP=VIN1 -（VOUT(S)× 0.98）where VIN1 is the input voltage when VOUT = VOUT(S)× 0.98. 3. ILIM: Output current when VIN=VOUT(S)+2V and VOUT = 0.95*VOUT(S). 4. VOUT pin should be shorted to GND pin, and the impedance between them is less than 0.1 ohm. ■ TYPICAL APPLICATIONS VIN + VOUT + MD7601AXX DC - ％/V mV VIN = VOUT(S)+2V，IOUT=10mA IGND mV GND VOUT COUT =2.2uF CIN=2.2uF - ■ Notes on Use Input Capacitor (CIN): 2.2µF above Output Capacitor (COUT): 2.2µF above 3 / 12 mA dB ℃ ■ TYPICAL PERFORMANCE CHARACTERISTICS(CONTINUTED) Test Conditions: VIN=VOUT+2.0V, CIN=2.2μF, COUT=2.2μF, unless otherwise indicated. VOUT vs Temperature at VOUT=3.6V VOUT vs Temperature at VOUT=12V VDROP vs Temperature at VOUT=12V VDROP vs Temperature at VOUT=3.6V GND Current vs Input Voltage at VOUT=12V GND Current vs Input Voltage at VOUT=3.6V 4 / 12 ■ TYPICAL PERFORMANCE CHARACTERISTICS(CONTINUTED) Test Conditions: VIN=VOUT+2.0V, CIN=2.2μF, COUT=2.2μF, unless otherwise indicated. GND Current vs Temperature at VOUT=12V GND Current vs Temperature at VOUT=3.6V Output Current Fold-back at VOUT=12V Output Current Fold-back at VOUT=3.6V Output Voltage vs Input Voltage at VOUT=12V Output Voltage vs Input Voltage at VOUT=3.6V 5 / 12 ■ TYPICAL PERFORMANCE CHARACTERISTICS(CONTINUTED) Test Conditions: VIN=VOUT+2.0V, CIN=2.2μF, COUT=2.2μF, unless otherwise indicated. GND Current vs Output Current at VOUT=12V GND Current vs Output Current at VOUT=3.6V Ch1=VOUT Ch1=VOUT Ch2=IOUT Ch2=IOUT Load Transient at VOUT=12V Load Transient at VOUT=3.6V 7601A12(IOUT=0mA~1A) 7601B36(IOUT=0mA~1A) Ch1=VOUT Ch1=VOUT Ch2=IOUT Ch2=IOUT Load Transient at VOUT=12V Load Transient at VOUT=3.6V 7601A12(IOUT=1A~0mA) 7601B36(IOUT=1A~0mA) 6 / 12 ■ TYPICAL PERFORMANCE CHARACTERISTICS(CONTINUTED) Test Conditions: VIN=VOUT+2.0V, CIN=2.2μF, COUT=2.2μF, unless otherwise indicated. Ch1=VOUT Ch1=VOUT Ch2=IOUT Ch2=IOUT Load Transient at VOUT=12V Load Transient at VOUT=3.6V 7601A12(IOUT=1mA~300mA~1mA) 7601B36(IOUT=1mA~300mA~1mA) Ch1=VOUT Ch1=VOUT Ch2=IOUT Ch2=IOUT Load Transient at VOUT=12V Load Transient at VOUT=3.6V 7601A12(IOUT=1mA~1A~1mA) 7601B36(IOUT=1mA~1A~1mA) Ch1=VOUT VIN=14V VIN=15V Ch1=VOUT Ch2=VIN VIN=5.6V VIN=6.6V Line Transient at VOUT=12V Line Transient at VOUT=3.6V 7601A12(IOUT=1mA) 7601B36(IOUT=1mA) 7 / 12 Ch2=VIN ■ TYPICAL PERFORMANCE CHARACTERISTICS(CONTINUTED) Test Conditions: VIN=VOUT+2.0V, CIN=2.2μF, COUT=2.2μF, unless otherwise indicated. Ch1=VOUT Ch1=VOUT VIN=14V VIN=15V Ch2=VIN VIN=5.6V VIN=6.6V Line Transient at VOUT=12V Line Transient at VOUT=3.6V 7601A12(IOUT=10mA) 7601B36(IOUT=10mA) Ch2=VIN Ch1=VOUT Ch1=VOUT Ch2=VIN Ch2=VIN Power-Up at VOUT=12V Power-Up at VOUT=3.6V 7601A12(IOUT=0mA) 7601B36(IOUT=0mA) Ch1=VOUT Ch1=VOUT Ch2=VIN Ch2=VIN Power-Up at VOUT=12V Power-Up at VOUT=3.6V 7601A12(IOUT=1A) 7601B36(IOUT=1A) 8 / 12 ■ TYPICAL PERFORMANCE CHARACTERISTICS(CONTINUTED) Test Conditions: VIN=VOUT+2.0V, CIN=2.2μF, COUT=2.2μF, unless otherwise indicated. Ch1=VOUT Ch1=VOUT Ch2=VIN Ch2=VIN Power-Down at VOUT=12V Power- Down at VOUT=3.6V 7601A12(IOUT=0mA) 7601B36(IOUT=0mA) Ch1=VOUT Ch1=VOUT Ch2=VIN Ch2=VIN Power- Down at VOUT=12V Power- Down at VOUT=3.6V 7601A12(IOUT=1A) 7601B36(IOUT=1A) Power Supply Rejection Ratio at VOUT=3.6V 9 / 12 ■ OPERATIONAL EXPLANATION 1. Output voltage control The voltage divided by resistors R1 and R2 is compared with the internal reference voltage by the error amplifier. The amplifier output then drives the P-channel MOSFET connected to the VOUT pin. The output voltage at the VOUT pin is regulated by this negative feedback system. The current limit circuit and short protect circuit operate in relation to output current level. Further, the IC's internal circuitry can be in operation or shutdown modes controlled by the CE pin's signal. VIN Current Fold-back Protection Vref CE ON/OFF Control VOUT each circuit AMPLIFIER R1 Vfb Reference Voltage R2 GND 2. Pass transistor The pass transistor with low turn-on resistance used in MD83XX is a P-channel MOSFET. If the potential on VOUT pin is higher than VIN, it is possible that IC will be destroyed due to reverse current which is caused by parasitic diodes between VIN and VOUT. Therefore, the VOUT pin potential exceeds VIN+0.3V is not allowed. 3. Current foldback and over temperature protection The MD83XX series includes a combination of a fixed current limiter circuit and a foldback circuit, which aid the operations of the current limiter and circuit protection. When the load current reaches the current limit level, the fixed current limiter circuit operates and output voltage drops. As a result of this drop in output voltage, the foldback circuit operates, output voltage drops further and output current decreases. This design can prevent the chip be damaged due to over temperature, moreover, the heat dissipation is limited by the package type. Special attention should be paid to that the product of the dropout voltage on the chip and the output current must be smaller than the heat dissipation. If power consumption on the chip is more than the heat dissipation, OTP will protect the chip from damaging due to over temperature. ■ Notes: 1. The input and output capacitors should be placed as close as possible to the IC. 2. If the impedance of the power supply is high, which is caused by forgetting installing input capacitor or installing too small value capacitor, the oscillation may occur. 3. Pay attention to the operation conditions of input and output voltage and load current, such that the power consumption in the IC should not exceed the allowable power consumption of the package even though the chip has short circuit protection. 4. IC has a built-in anti-static protection (ESD) circuit, but please do not add excessive stress to the IC. 10 / 12 ■ PACKAGING INFORMATION 11 / 12 ■ PACKAGING INFORMATION(Continued) For the newest datasheet, please see the website: www.md-ic.com.cn Version V1.5: 20210930 12 / 12