BZT52C39

BZT52C2V0 THRU BZT52C7 5 SOD-123 ■ Zener Diodes ■ Features ● Planar Die Construction ● 500mW Power Dissipation on Ceramic PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Processes ● Available in Lead Free Version ■ Simplified outline(SOD-123) Top View ■ Absolute Maximum Ratings Ta = 25℃ Symbol Value Unit Power Dissipation PD 500 mW Forward Voltage at I F = 10 mA VF 0.9 V RθJA 305 °C/W T j , T stg -55 ~ +150 °C Parameter Typical thermal resistance juncting to ambient (1) Operating and Storage Temperature Range (1) Thermal resistance from junction to ambient at P.C.B. mounted with 7.6mm X 9.4mm X 0.87mm copper areas pads. Transient Thermal Impedance（ °C /W） Fig.1 Maximum Continuous Power Derating 0.6 Power Dissipation ( W ) 0.5 0.4 0.3 0.2 0.1 0.0 25 50 75 100 125 150 175 T A , Temperature (°C) www.yfwdiode.com Fig.2 Typical Transient Thermal Impedance 2000 1000 100 10 0.01 0.1 1 10 100 t, Pulse Duration（sec） 1/3 G uangDong YFW Electronics Co, Ltd. BZT52C2V0 THRU BZT52C7 5 SOD-123 Characteristics at Ta = 25°C Zener Voltage Range Type VZT（at IZT） Marking Min（V） ） Nom（V） Maximum Zener (3) Impedance （2） IZT Max（V） (mA) Reverse Current ZZT@IZT IZT ZZK@IZK IZK IR @VR (Ω) (mA) (Ω) (mA) μA V BZT52C2V0 WY 1.91 2.0 2.09 5 100 5 600 1 150 1.0 BZT52C2V4 WX 2.2 2.4 2.6 5 100 5 600 1 50 1.0 BZT52C2V7 W1 2.5 2.7 2.9 5 100 5 600 1 20 1.0 BZT52C3V0 W2 2.8 3.0 3.2 5 95 5 600 1 10 1.0 BZT52C3V3 W3 3.1 3.3 3.5 5 95 5 600 1 5.0 1.0 BZT52C3V6 W4 3.4 3.6 3.8 5 90 5 600 1 5.0 1.0 BZT52C3V9 W5 3.7 3.9 4.1 5 90 5 600 1 3.0 1.0 BZT52C4V3 W6 4 4.3 4.6 5 90 5 600 1 3.0 1.0 BZT52C4V7 W7 4.4 4.7 5 5 80 5 500 1 3.0 2.0 BZT52C5V1 W8 4.8 5.1 5.4 5 60 5 480 1 2.0 2.0 BZT52C5V6 W9 5.2 5.6 6 5 40 5 400 1 1.0 2.0 BZT52C6V2 WA 5.8 6.2 6.6 5 10 5 150 1 3.0 4.0 BZT52C6V8 WB 6.4 6.8 7.2 5 15 5 80 1 2.0 4.0 BZT52C7V5 WC 7 7.5 7.9 5 15 5 80 1 1.0 5.0 BZT52C8V2 WD 7.7 8.2 8.7 5 15 5 80 1 0.7 5.0 BZT52C9V1 WE 8.5 9.1 9.6 5 15 5 100 1 0.5 6.0 BZT52C10 WF 9.4 10 10.6 5 20 5 150 1 0.2 7.0 BZT52C11 WG 10.4 11 11.6 5 20 5 150 1 0.1 8.0 BZT52C12 WH 11.4 12 12.7 5 25 5 150 1 0.1 8.0 BZT52C13 WI 12.4 13 14.1 5 30 5 170 1 0.1 8.0 BZT52C15 WJ 13.8 15 15.6 5 30 5 200 1 0.1 10.5 BZT52C16 WK 15.3 16 17.1 5 40 5 200 1 0.1 11.2 BZT52C18 WL 16.8 18 19.1 5 45 5 225 1 0.1 12.6 BZT52C20 WM 18.8 20 21.2 5 55 5 225 1 0.1 14.0 BZT52C22 WN 20.8 22 23.3 5 55 5 250 1 0.1 15.4 BZT52C24 WO 22.8 24 25.6 5 70 5 250 1 0.1 16.8 BZT52C27 WP 25.1 27 28.9 2 80 2 300 0.5 0.1 18.9 BZT52C30 WQ 28 30 32 2 80 2 300 0.5 0.1 21.0 BZT52C33 WR 31 33 35 2 80 2 325 0.5 0.1 23.1 BZT52C36 WS 34 36 38 2 90 2 350 0.5 0.1 25.2 BZT52C39 WT 37 39 41 2 130 2 350 0.5 0.1 27.3 BZT52C43 6A 40 43 46 2.5 130 2 500 1 2 33 2.5 150 2 500 1 2 36 2.5 180 2 500 1 1 37 BZT52C47 6B 44 47 50 BZT52C51 6C 48 51 54 2.5 180 2 500 1 1 43 2.5 200 2 500 1 0.2 47 BZT52C56 6D 52 56 60 BZT52C62 6E 58 62 66 BZT52C68 6F 64 68 72 2.5 250 2 500 1 0.2 52 BZT52C75 6H 70 75 79 2.5 300 2 500 1 0.2 57 (2) NOTES:（1）f=1KHz （2） Short duration test pulse used to minimize self-heating effect. （3） VZT is tested with pulses 20ms. www.yfwdiode.com 2/3 G uangDong YFW Electronics Co, Ltd. BZT52C2V0 THRU BZT52C7 5 SOD-123 SOD-123 Package Outline Plastic surface mounted package; 2 leads A D b E A1 C ∠ALL ROUND L1 E1 A C D E E1 L1 b A1 max 1.3 0.22 1.8 2.8 3.9 0.45 0.7 0.2 min 0.9 0.09 1.5 2.5 3.6 0.25 0.5 max 51 8.7 71 110 154 18 28 min 35 3.5 59 98 142 10 20 UNIT ∠ mm 9° 8 mil The recommended mounting pad size 2.0 (79) 1.2 (47) 1.2 (47) 1.2 (47) Unit： mm (mil) Summary of Packing Options Package SOD-123 www.yfwdiode.com Packing Description Packing Quantity Industry Standard Tape/Reel,7”reel 3000 EIA-481-1 3/3 G uangDong YFW Electronics Co, Ltd.