SD03C-MS

SDXXC-MS Product specification SDXXC-MS MACHANICAL DATA FEATURES  I IEC61000-4-2 (ESD) ±30kV (Contact) ±30kV (Air)  IEC61000-4-4 (EFT) 40A (5/50ηs)  350 Watts Peak Pulse Power per (tp=8/20μs)  Protects one I/O line (bidirectional)  Low clamping voltage  Working voltages:  SOD-323 package  Flammability Rating: UL 94V-0  Packaging: Tape and Reel  High temperature soldering guaranteed: 260℃/10s  Reel size: 7 inch  MSL 1 3V,5V,8V,12V,15V,18V,20V,24V,36V  Low leakage current APPLICATIONS  Cell Phone Handsets and Accessories  Microprocessor based equipment  Personal Digital Assistants (PDA’s)  Notebooks, Desktops, and Servers  Portable Instrumentation  Networking and Telecom  Serial and Parallel Ports.  Peripherals Reference News PACKAGE OUTLINE PIN CONFIGURATION SOD-323 Copyright© Msksemi Incorporated www.msksemi.com SDXXC-MS ABSOLUTE MAXIMUM RATING Symbol Parameter Value Units ESD per IEC 61000-4-2 (Contact) ±30 ESD per IEC 61000-4-2 (Air) ±30 PPP Peak Pulse Power (8/20μs) 350 W TOPT Operating Temperature -55/+150 ℃ TSTG Storage Temperature -55/+150 ℃ V ESD kV ELECTRICAL CHARACTERISTICS (Tamb=25℃) VRWM VB IT VC@1A VC IR CT (V) (V) (mA) (V) (V) (pF) (max.) (min.) (µA) (max.) (max.) 2A 3.3 4.0 SD05C-MS 2B 5.0 SD08C-MS 2C SD12C-MS PART NUMBER DEVICE MARKING SD03C-MS (max.) (max.) 1 7.5 16.0 20 40 450 6.0 1 9.8 18.0 17 10 200 8.0 8.5 1 13.4 24.0 15 2 120 2D 12.0 13.3 1 19.0 32.0 11 1 75 SD15C-MS 2J 15.0 16.7 1 24.0 38.0 10 1 68 SD18C-MS 2K 18.0 20.0 1 29.0 45.0 9 1 57 SD20C-MS 2L 20.0 22.3 1 35.0 50.0 8 1 52 SD24C-MS 2H 24.0 26.7 1 43.0 52.0 7 1 50 SD36C-MS 2N 36.0 40.0 1 60.0 75.0 4.5 1 35 Copyright© Msksemi Incorporated (@A) www.msksemi.com SDXXC-MS ELECTRICAL CHARACTERISTICS CURVE Copyright© Msksemi Incorporated www.msksemi.com SDXXC-MS PACKAGE MECHANICAL DATA REEL SPECIFICATION P/N SDXXC-MS Copyright© Msksemi Incorporated PKG QTY SOD-323 3000 www.msksemi.com SDXXC-MS Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not handle applications that require extremely high levels of reliability, such as life-support have specifications that can systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. Copyright© Msksemi Incorporated www.msksemi.com