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FR104W F4

FR104W F4

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOD-123FL-2

  • 描述:

    二极管配置:独立式;直流反向耐压(Vr):400V;平均整流电流(Io):1A;正向压降(Vf):1.3V@1A;

  • 数据手册
  • 价格&库存
FR104W F4 数据手册
www.msksemi.com FR101W THRU FR107W Semiconductor Compiance FEATURES 2 * Ideal for surface mount applications * Easy pick and place * Built-in strain relief * Fast switching speed 1 MECHANICAL DATA * Case: Molded plastic * Epoxy: UL 94V-0 rate flame retardant * Metallurgically bonded construction * Polarity: Color band denotes cathode end * Mounting position: Any SOD-123FL Maximum Ratings and Electrical characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %. FR10W F1 FR10W F2 MARK F1 F2 F3 F4 F5 F6 F7 Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V Maximum Average Forward Rectified Current at Ta = 65 °C IF(AV) 1.0 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) IFSM 30 A Maximum Instantaneous Forward Voltage at 1 A VF 1.3 V Maximum DC Reverse Current at Rated DC Blocking Voltage IR 1 50 μA P/N Parameter Ta = 25 °C Ta =125 °C FR103W FR10W F3 F4 FR105W FR10W F5 F6 FR10W F7 Units ns Maximum Reverse Recovery Time 1) trr Typical Junction Capacitance 2) Cj 15 pF Tj, Tstg -55 ~ +150 °C Operating and Storage Temperature Range 1) 2) 150 250 500 Measured with IF = 0.5 A, IR = 1 A, Irr = 0.25 A Measured at 1MHz and applied reverse voltage of 4V D.C www.msksemi.com FR101W THRU FR107W Semiconductor FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARDCURRENT,(A) CHARACTERISTICS 50 10 3.0 1.0 1.2 1.0 0.8 Single Phase 0.6 Half Wave 60Hz Resistive Or Inductive Load 0.4 0.2 0 0 20 40 Tj=25 C Pulse Width 300us 1% Duty Cycle 60 80 100 120 140 160 180 200 AMBIENT TEMPERATURE ( C) 0.1 .01 .6 .8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE,(V) FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50 NONINDUCTIVE 10 NONINDUCTIVE () (+) D.U.T. 25Vdc (approx.) PULSE GENERATOR (NOTE 2) () 1 NONINDUCTIVE OSCILLISCOPE (NOTE 1) PEAK FORWAARD SURGECURRENT,(A) FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 50 40 30 Sine Wave JEDEC method 10 0 1 | | | | | | | | 0 -0.25A 1cm SET TIME BASE FOR 50 / 10ns / cm 50 100 35 30 25 20 15 10 5 0 -1.0A 10 FIG.5-TYPICAL JUNCTION CAPACITANCE 2. Rise Time= 10ns max., Source Impedance= 50 ohms. +0.5A 5 NUMBER OF CYCLES AT 60Hz NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. trr 8.3ms Single Half Tj=25 C 20 (+) JUNCTION CAPACITANCE,(pF) INSTANTANEOUS FORWARD CURRENT,(A) Compiance .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) www.msksemi.com FR101W THRU FR107W Semiconductor Compiance 1.8± 0.3 0.95 ±0.25 PACKAGE MECHANICAL DATA 1.15±0.25 0.05-0.30 2.75 ±0.25 0.6±0.3 3.7 ±0.30 Dimensions in millimeters 1.4 2.85 1.2 REEL SPECIFICATION P/N FR101W THRU FR107W PKG SOD-123FL QTY 3000 www.msksemi.com FR101W THRU FR107W Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and products must not be exported without obtaining the export license from regulations, theauthorities such concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
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