MOT4N65C
MOT4N65D
N-CHANNEL MOSFET
PRODUCT CHARACTERISTICS
VDSS
RDS(on)Typ(@ V GS =10 V)
Qg@type
ID
Symbol
650V
2.41Ω
19nC
4A
2.Drain
1.Gate
APPLICATIONS
* High frequency switching mode power supply
* Electronic ballast
* LED power supplies
3.Source
FEATURES
* Fast switching capability
* Avalanche energy tested
* Improved dv/dt capability, high ruggedness
1 2
3
TO-252
ORDER INFORMATION
Order codes
Halogen-Free
Halogen
N/A
MOT4N65D
N/A
MOT4N65C
Package
TO-252
TO-251
1
2
3
TO-251
Packing
2500 pieces /Reel
70 pieces /Tube
ABSOLUTE MAXIMUM RATINGS (TC = 25°C, unless otherwise specified)
PARAMETER
UNIT
SYMBOL
RATINGS
Drain-Source Voltage
VDSS
V
650
Gate-Source Voltage
VGSS
V
±30
4.0
A
Avalanche Current (Note 2)
I AR
ID
4.0
A
Continuous
Drain Current
IDM
16
A
Pulsed (Note 2)
mJ
Single Pulsed (Note 3)
E AS
260
Avalanche Energy
mJ
E AR
Repetitive (Note 2)
10.6
V/ns
dv/dt
Peak Diode Recovery dv/dt (Note 4)
4.5
W
PD
Power Dissipation
50
°С
TJ
+150
Junction Temperature
TOPR
-55 ~ +150
°С
Operating Temperature
TSTG
°С
Storage Temperature
-55 ~ +150
Note: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
2. Repetitive Rating : Pulse width limited by maximum junction temperature
3. L = 30mH, IAS = 4A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
4. ISD≤4.4A, di/dt ≤200A/μs, VDD≤BVDSS, Starting TJ = 25°C
-1-
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MOT4N65C
MOT4N65D
N-CHANNEL MOSFET
ELECTRICAL CHARACTERISTICS (TC=25°C, unless otherwise noted)
PARAMETER
Off characteristics
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
Gate- Source Leakage Current
SYMBOL
BVDSS
IDSS
Forward
Reverse
IGSS
TEST CONDITIONS
MIN TYP MAX UNIT
VGS = 0V, ID = 250μA
VDS = 650V, VGS = 0V
VGS = 30V, VDS = 0V
VGS = -30V, VDS = 0V
650
-
-
1
100
-100
V
μA
nA
nA
VDS = VGS, ID = 250μA
VGS = 10V, ID = 2.0A
2.0
-
2.41
4.0
2.8
V
Ω
VDS=25V, VGS=0V, f=1.0 MHz
-
520
75
13
-
pF
pF
pF
VDS=300V, VGS=10V, ID=3.0A
(Note 1, 2)
-
-
VDD=50V, VGS=10V, ID =0.5A,
RG =25Ω (Note 1, 2)
-
19
3.5
5.8
9.0
22
53
42
-
nC
nC
nC
ns
ns
ns
ns
-
-
4
A
-
-
16
A
-
-
1.4
-
V
ns
μC
On characteristics
Gate Threshold Voltage
Static Drain-Source On-State Resistance
Dynamic characteristics
VGS(TH)
RDS(ON)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching characteristics
CISS
COSS
CRSS
Total Gate Charge (Note 1)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time (Note 1)
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Drain-source diode diode characteristics
QG
QGS
QGD
tD(ON)
tR
tD(OFF)
tF
Maximum Continuous Drain-Source Diode
IS
Forward Current
Maximum Pulsed Drain-Source Diode
ISM
Forward Current
Drain-Source Diode Forward Voltage
VSD
IS=4.0A , VGS=0V
Body Diode Reverse Recovery Time
trr
IS=4.0A , VGS=0V di/dt=100A/μs
Body Diode Reverse Recovery Charge
Qrr
Notes: 1. Pulse Test: Pulse width ≤ 300μs, Duty cycle ≤ 2%.
2. Essentially independent of operating temperature.
-2-
290
1.65
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MOT4N65C
MOT4N65D
N-CHANNEL MOSFET
TY PICAL CHARACTERISTICS
80
PD , Power Dissipation ,Watts
Id , Drain Current , Amps
100
10
100us
1
1ms
OPERATION IN THIS AREA
MAY BE LIMITED BY RDS(ON)
TJ=MAX RATED
TC=25℃ Single Pulse
0 .1
DC
10ms
70
60
50
40
30
20
10
0
0 .0 1
1
10
100
V d s , D r a in - t o - S o u r c e V o lta g e , V o lts
0
1000
Figure 1 Maximum Forward Bias Safe Operating Area
8
VGS=10V
Id , Drain Current , Amps
3
2
150
250us Pluse Test
Tc = 25℃
5
4
125
Figure 2 Maximum Power Dissipation vs Case Temperature
6
Id , Drain Current , Amps
75
50
100
TC , Case Temperature , C
25
6
VGS=7V
4
VGS=5V
VGS=6V
VGS=4V
2
1
0
0
0
25
75
100
125
50
TC , C ase Tem perature , C
150
0
Figure 3 Maximum Continuous Drain Current vs Case Temperature
10
15
20
Vds , Drain-to-Source Voltage , Volts
25
Figure 4 Typical Output Characteristics
8
Isd, Reverse Drain Current , Amps
9
Id , Drain Current , Amps
5
250us Pulse Test
VDS=10V
7.5
6
4.5
+25℃
3
+150℃
1.5
0
7
6
5
4
+150℃
3
+25℃
2
1
0
2
4
6
8
Vgs , Gate to Source Voltage , Volts
10
0
0.2
0.4
0.6
0.8
1
Vsd , Source - Drain Voltage , Volts
Figure 7 Typical Body Diode Transfer Characteristics
Figure 6 Typical Transfer Characteristics
-3-
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1.2
MOT4N65C
MOT4N65D
N-CHANNEL MOSFET
TY PICAL CHARACTERISTICS(Cont.)
Rds(on), Drain to Source ON Resistance,
Nomalized
Rds(on), Drain to Source ON
Resistance, Ohms
4
PULSE DURATION = 10μs
DUTY CYCLE= 0.5%MAX
Tc =25 ℃
3.5
VGS=10V
3
2.5
2.5
PULSE DURATION = 10μs
DUTY CYCLE= 0.5%MAX
VGS=10V ID=2A
2.25
2
1.75
1.5
1.25
1
0.75
2
0.5
0
1
2
3
Id , Drain Current , Amps
-50
4
150
1.15
1.15
1.1
Bvdss,Drain to Source
Breakdown Voltage, Normalized
Vgs(th),Threshold Voltage, Nomalized
50
100
Tj, Junction temperature , C
Figure 9 Typical Drian to Source on Resistance
vs Junction Temperature
Figure 8 Typical Drain to Source ON Resistance
vs Drain Current
1.05
1
0.95
0.9
VGS=0V
ID=250μA
0.85
0.8
0.75
1.05
VGS=0V
ID=250μA
0.95
0.85
0.7
0.65
-75
-50
-25
0.75
-55
0
25 50 75 100 125 150 175
Tj, Junction temperature , C
-5
20
45
70
95
120
Tj, Junction temperature , C
145
170
12
Vgs , Gate to Source Voltage ,Volts
10000
1000
Ciss
100
Coss
10
-30
Figure 11 Typical Breakdown Voltage vs Junction Temperature
Figure 10 Typical Theshold Voltage vs Junction Temperature
Capacitance , pF
0
VGS=0V , f=1MHz
Ciss=Cgs+Cgd
Coss=Cds+Cgd
Crss=Cgd
10
VDS=520V
VDS=325V
VDS=130V
8
6
4
2
Crss
ID=4A
0
1
0.1
1
10
Vds , Drain - Source Voltage , Volts
0
100
3
6
9
Qg , Total Gate Charge , nC
12
15
Figure 13 Typical Gate Charge vs Gate to Source Voltage
Figure 12 Typical Capacitance vs Drain to Source Voltage
-4-
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MOT4N65C
MOT4N65D
N-CHANNEL MOSFET
n TO-251-3L PACKAGE OUTLINE DIMENSIONS
-5-
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MOT4N65C
MOT4N65D
N-CHANNEL MOSFET
n TO-252-2L PACKAGE OUTLINE DIMENSIONS
-6-
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