MOT50N03C
MOT50N03D
N-CHANNEL MOSFET
PRODUCT CHARACTERISTICS
VDSS
RDS(on)Typ(@VGS =10 V)
RDS (on)Typ(@VGS=4.5 V)
Symbol
2.Drain
30V
8mΩ
10mΩ
50A
ID
1.Gate
APPLICATIONS
* Switching applications
3.Source
FEATURES
4
* Low capacitance
* Low gate charge
* Fast switching capability
* Avalanche energy specified
4
1
2
1
3
TO-252
ORDER INFORMATION
Order codes
Halogen-Free
Halogen
N/A
MOT50N03D
N/A
MOT50N03C
Package
TO-252
TO-251
2
3
TO-251
Packing
2500 pieces /Reel
70 pieces /Tube
ABSOLUTE MAXIMUM RATINGS (TC = 25°C, unless otherwise specified)
UNIT
PARAMETER
RATINGS
SYMBOL
30
VDSS
Drain-Source Voltage
V
±20
V
Gate-Source Voltage
VGSS
A
50
ID
Continuous Drain Current
A
Pulsed Drain Current (Note 2)
180
IDM
45
EAS
Single Pulsed Avalanche Energy (Note 3)
mJ
PD
50
W
Power Dissipation
TJ
+150
Junction Temperature
°C
TSTG
-55 ~ +150
°C
Storage Temperature
Notes: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
2. Repetitive Rating: Pulse width limited by maximum junction temperature.
3. L = 0.1mH, IAS = 30A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C.
-1-
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MOT50N03C
MOT50N03D
N-CHANNEL MOSFET
ELECTRICAL CHARACTERISTICS (TC=25°C, unless otherwise noted)
PARAMETER
Off characteristics
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
Gate-Source Leakage Current
On characteristics
Gate-Threshold Voltage
Drain-Source On-State Resistance
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX UNIT
BVDSS
IDSS
IGSS
VGS =0V, ID =250 µA
VDS=20V, VGS =0V
VDS =0V, VGS = ±20V
30
-
-
1.5
±100
VGS(TH)
VDS =VGS, ID =250 µA
VGS = 10 V
ID = 15 A
VGS = 4.5V
ID = 10 A
1.0
-
1.7
8
2.0
10
10
13
-
610
300
125
-
pF
-
-
ns
-
8.2
9.6
11.2
6.8
5.0
84
15
4.0
6.0
1.9
3.7
15
1.9
3.9
-
ns
ns
ns
ns
ns
ns
ns
nC
nC
nC
nC
nC
nC
-
0.85
1.1
V
-
-
50
A
-
24
14
-
ns
nC
RDS(ON)
-
V
µA
nA
V
mΩ
mΩ
Dynamic characteristics
Input Capacitance
CISS
VDS=12V, VGS =0V, f=1MHz
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
Switching characteristics
Turn-ON Delay Time
tD(ON)
Turn-ON Rise Time
tR
VGS = 4.5 V, VDS =15 V,
I
Turn-OFF Delay Time
tD(OFF)
D = 30 A, RG = 3.0Ω
Turn-OFF Fall-Time
tF
Turn-ON Delay Time
tD(ON)
Turn-ON Rise Time
tR
VGS = 11.5 V, VDS =15 V,
ID = 30 A, RG = 3.0Ω
Turn-OFF Delay Time
tD(OFF)
Turn-OFF Fall-Time
tF
Total Gate Charge
QG
VDS =15V,VGS =4.5V,
Gate-to-Source Charge
QGS
ID =30 A
Gate-to-Drain Charge
QGD
Total Gate Charge
QG
VDS =15V,VGS =11.5V,
Gate-to-Source Charge
QGS
ID =30 A
Gate-to-Drain Charge
QGD
Source-drain diode ratings and characteristics
Drain-Source Diode Forward Voltage
VSD
IS=30 A, VGS =0V
Maximum Continuous Drain-Source Diode
IS
Forward Current
Reverse Recovery Time
trr
IS = 30 A, VGS = 0 V,
dI /dt = 100 A/μs
Reverse Recovery Charge
QRR
Notes: 1. Pulse width limited by TJ(MAX)
2. Pulse Test: Pulse Width≤300µs, Duty Cycle≤2%
2-
-
-
pF
pF
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MOT50N03C
MOT50N03D
N-CHANNEL MOSFET
Drain Current,ID (A)
On-Resistance versus Gate-toSource Voltage
0.065
0.030
Drain-to-Source Resistance,RDS(ON) (Ω)
Drain-to-Source Resistance,RDS(ON) (Ω)
Drain Current,ID (A)
TY PICAL CHARACTERISTICS
ID=15A
TJ=25℃
0.055
0.045
0.035
0.025
0.015
0.005
3
4
5
6
7
8
9 10
Gate-to-Source Voltage,VGS (V)
TJ=25℃
0.025
VGS=4.5V
0.020
0.015
VGS=10V
0.010
0.005
0
10
20
30
40
Drain Current,ID (A)
Capacitance,C (pF)
Leakage,IDSS (nA)
2
On-Resistance versus Drain Current
and Gate Voltage
-3-
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50
Gate-to-Source Voltage,VGS (V)
-4Drain Current,ID (A)
Drain-to-Source Voltage,VDS (V)
Effective Transient Thermal Resistance
(Normalized),r (t)
Source Current,IS(A)
t,TIME (ns)
MOT50N03C
MOT50N03D
N-CHANNEL MOSFET
TY PICAL CHARACTERISTICS(Cont.)
www.mot-mos.com
MOT50N03C
MOT50N03D
N-CHANNEL MOSFET
n TO-251PACKAGE OUTLINE DIMENSIONS
-5-
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MOT50N03C
MOT50N03D
N-CHANNEL MOSFET
n TO-252 PACKAGE OUTLINE DIMENSIONS
-6-
www.mot-mos.com
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