SWB056R68E7T

SW056R68E7T N-channel Enhanced mode TO-220/TO-263 MOSFET Features TO-220 ⚫ ⚫ ⚫ ⚫ ⚫ ⚫ High ruggedness Low RDS(ON) (Typ 5.8mΩ)@VGS=10V Low Gate Charge (Typ 107nC) Improved dv/dt Capability 100% Avalanche Tested Application:Synchronous Rectification, Li Battery Protect Board, Inverter TO-263 BVDSS : 68V ID : 120A RDS(ON) :5.8mΩ 1 1 2 3 2 2 3 1 1. Gate 2.Drain 3.Source General Description 3 This power MOSFET is produced with advanced technology of SAMWIN. This technology enable the power MOSFET to have better characteristics, including fast switching time, low on resistance, low gate charge and especially excellent avalanche characteristics. Order Codes Item Sales Type Marking Package Packaging 1 SW P 056R68E7T SW056R68E7T TO-220 TUBE 2 SW B 056R68E7T SW056R68E7T TO-263 TUBE Absolute maximum ratings Value Symbol Parameter Unit TO-220 VDSS Drain to source voltage Continuous drain current ID TO-263 (@TC=25oC) 68 V 120* A 95* A 480 A ± 20 V Continuous drain current (@TC=100oC) IDM Drain current pulsed VGS Gate to source voltage EAS Single pulsed avalanche energy (note 2) 289 mJ EAR Repetitive avalanche energy (note 1) 28 mJ dv/dt Peak diode recovery dv/dt (note 3) 5 V/ns 266 W 2.13 W/oC -55 ~ + 150 oC 300 oC Total power dissipation PD TSTG, TJ TL (note 1) (@TC=25oC) Derating factor above 25oC Operating junction temperature & storage temperature Maximum lead temperature for soldering purpose, 1/8 from case for 5 seconds. *. Drain current is limited by junction temperature. Thermal characteristics Symbol Parameter Rthjc Thermal resistance, Junction to case Rthja Thermal resistance, Junction to ambient Copyright@ Semipower Technology Co., Ltd. All rights reserved. Value TO-220 TO-263 0.47 Unit oC/W oC/W 50 May.2022. Rev. 0.7 1/6 SW056R68E7T Electrical characteristic ( TJ = 25oC unless otherwise specified ) Symbol Parameter Test conditions Min. Typ. Max. Unit Off characteristics Drain to source breakdown voltage VGS=0V, ID=250uA ΔBVDSS / ΔTJ BVDSS Breakdown voltage temperature coefficient ID=250uA, referenced to 25oC IDSS Drain to source leakage current 68 V V/oC 0.06 VDS=68V, VGS=0V 1 uA VDS=54V, TJ=125oC 50 uA Gate to source leakage current, forward VGS=20V, VDS=0V 100 nA Gate to source leakage current, reverse VGS=-20V, VDS=0V -100 nA 4.0 V IGSS On characteristics VGS(TH) RDS(ON) Gfs Gate threshold voltage Drain to source on state resistance Forward transconductance VDS=VGS, ID=250uA 2.0 VGS=10V, ID=30A,TJ=25oC 5.8 7.0 mΩ VGS=10V, ID=50A,TJ=25oC 5.9 7.0 mΩ VGS=10V, ID=30A,TJ=125oC 10.4 mΩ 46 S VDS=10V, ID=30A Dynamic characteristics Ciss Input capacitance Coss Output capacitance Crss Reverse transfer capacitance td(on) Turn on delay time tr td(off) tf Rising time Turn off delay time 5676 VGS=0V, VDS=34V, f=1MHz 362 pF 317 29 VDS=34V, ID=30A, RG=4.7Ω, VGS=10V (note 4,5) 69 ns 79 Fall time 33 Qg Total gate charge Qgs Gate-source charge Qgd Gate-drain charge VDS=54V, VGS=10V, ID=30A , IG=5mA (note 4,5) Rg Gate resistance VDS=0V, Scan F mode 107 30 nC 36 Ω 3 Source to drain diode ratings characteristics Symbol Parameter Test conditions IS Continuous source current ISM Pulsed source current Integral reverse p-n Junction diode in the MOSFET VSD Diode forward voltage drop. IS=30A, VGS=0V trr Reverse recovery time Qrr Reverse recovery charge IS=30A, VGS=0V, dIF/dt=100A/us Min. Typ. Max. Unit 120 A 480 A 1.4 V 33 ns 41 nC ※. Notes 1. Repeatitive rating : pulse width limited by junction temperature. 2. L =0.5mH, IAS =34A, VDD=40V, RG=25Ω, Starting TJ = 25oC 3. ISD ≤30A, di/dt = 100A/us, VDD ≤ BVDSS, Staring TJ =25oC 4. Pulse Test : Pulse Width ≤ 300us, duty cycle ≤ 2%. 5. Essentially independent of operating temperature. Copyright@ Semipower Technology Co., Ltd. All rights reserved. May.2022. Rev. 0.7 2/6 SW056R68E7T Fig. 1. On-state characteristics Fig. 2. Transfer Characteristics Fig. 3. On-resistance variation vs. drain current and gate voltage Fig. 4. On-state current vs. diode forward voltage Fig 5. Breakdown voltage variation vs. junction temperature Fig. 6. On-resistance variation vs. junction temperature Copyright@ Semipower Technology Co., Ltd. All rights reserved. May.2022. Rev. 0.7 3/6 SW056R68E7T Fig. 7. Gate charge characteristics Fig. 9. Maximum safe operating area (TO-220 & TO-263) Fig. 8. Capacitance Characteristics Fig. 10. Maximum drain current vs. case temperature (TO-220&TO-263) Fig. 11. Transient thermal response curve(TO-220 & TO-263) Copyright@ Semipower Technology Co., Ltd. All rights reserved. May.2022. Rev. 0.7 4/6 SW056R68E7T Fig. 12. Gate charge test circuit & waveform Fig. 13. Switching time test circuit & waveform VDS 90% RL RGS VDS VDD VIN 10VIN DUT 10% 10% td(on) tr tON td(off) tf tOFF Fig. 14. Unclamped Inductive switching test circuit & waveform Copyright@ Semipower Technology Co., Ltd. All rights reserved. May.2022. Rev. 0.7 5/6 SW056R68E7T Fig. 15. Peak diode recovery dv/dt test circuit & waveform DUT + V DS 10V VGS (DRIVER) L IS di/dt IS (DUT) IRM VDS RG Diode reverse current VDD Diode recovery dv/dt Same type as DUT 10VGS VDS (DUT) *. dv/dt controlled by RG *. Is controlled by pulse period VDD VF Body diode forward voltage drop DISCLAIMER * All the data & curve in this document was tested in SEMIPOWER TESTING & APPLICATION CENTER. * This product has passed the PCT,TC,HTRB,HTGB,HAST,PC and Solderdunk reliability testing. * Qualification standards can also be found on the Web site (http://www.semipower.com.cn) * Suggestions for improvement are appreciated, Please send your suggestions to samwin@samwinsemi.com Copyright@ Semipower Technology Co., Ltd. All rights reserved. May.2022. Rev. 0.7 6/6