PZ0703ED
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P-Channel 30 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) ()
ID (A)a
0.009 at VGS = - 10 V
-60
0.011 at VGS = - 4.5 V
-58
VDS (V)
- 30
• Compliant to RoHS Directive 2002/95/EC
Available
RoHS*
COMPLIANT
S
TO-252
G
G
D
S
D
Top View
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
Parameter
Gate-Source Voltage
TC = 25 °C
Continuous Drain Current (TJ = 175 °C)
TC = 125 °C
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energy
L = 0.1 mH
b
TC = 25 °C
Power Dissipation
TA = 25 °C
Operating Junction and Storage Temperature Range
Symbol
Limit
Unit
VGS
± 20
V
ID
- 70
a
IDM
- 58
- 240
IAR
- 60
EAR
180
PD
87d
78
A
mJ
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient
PCB Mount
Free Air
Junction-to-Case
RthJA
RthJC
60
68.5
°C/W
1.0
Notes:
a. Package limited.
b. Duty cycle 1 %.
c. When mounted on 1" square PCB (FR-4 material).
d. See SOA curve for voltage derating.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
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SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = - 250 µA
- 30
VDS = VGS, ID = - 250 µA
-1
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VGS(th)
Gate Threshold Voltage
IGSS
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
ID(on)
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductance
a
VDS = 0 V, VGS = ± 20 V
± 100
VDS = - 30 V, VGS = 0 V
-1
VDS = - 30 V, VGS = 0 V, TJ = 125 °C
- 50
VDS = - 30 V, VGS = 0 V, TJ = 175 °C
- 250
VDS = - 5 V, VGS = - 10 V
RDS(on)
-3
0.009
VGS = - 10 V, ID = - 30 A, TJ = 125 °C
0.012
VGS = - 10 V, ID = - 30 A, TJ = 175 °C
0.013
VGS = - 4.5 V, ID = - 20 A
0.011
VDS = - 15 V, ID = - 75 A
nA
µA
A
- 120
VGS = - 10 V, ID = - 30 A
gfs
V
S
20
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reversen Transfer Capacitance
Crss
Total Gate Chargec
Gate-Source Chargec
Qg
Qgs
Gate-Drain Chargec
Qgd
Turn-On Delay Timec
td(on)
25
40
tr
td(off)
225
360
150
240
210
340
Rise Timec
Turn-Off Delay Timec
Fall Timec
4000
VGS = 0 V, VDS = - 25 V, f = 1 MHz
1565
pF
715
160
VDS = - 15 V, VGS = - 10 V, ID = - 75 A
240
32
nC
30
VDD = - 15 V, RL = 0.2
ID - 75 A, VGEN = - 10 V, Rg = 2.5
tf
ns
Source-Drain Diode Ratings and Characteristics (TC = 25 °C)
b
Continuous Current
Pulsed Current
IS
ISM
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
- 70
- 240
IF = - 75 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = - 75 A, dI/dt = 100 A/µs
A
- 1.2
- 1.5
V
55
100
ns
2.5
5
A
0.07
0.25
µC
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
200
250
TC = - 55 °C
VGS = 10 V thru 6 V
160
I D - Drain Current (A)
I D - Drain Current (A)
200
5V
150
100
4V
25 °C
125 °C
120
80
40
50
3V
0
0
0
2
4
6
8
10
1
2
4
5
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
6
0.036
TC = - 55 °C
0.030
RDS(on) - On-Resistance ()
120
25 °C
125 °C
90
60
30
0.024
0.018
VGS = 4.5 V
VGS = 10 V
0.012
0.006
0
0
0
20
40
60
80
0
100
20
40
ID - Drain Current (A)
60
80
100
120
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
20
10 000
VGS - Gate-to-Source Voltage (V)
12 000
C - Capacitance (pF)
3
VDS - Drain-to-Source Voltage (V)
150
g fs - Transconductance (S)
0
Ciss
8000
6000
4000
Coss
2000
Crss
0
0
VDS = 15 V
ID = 75 A
16
12
8
4
0
6
12
18
24
VDS - Drain-to-Source Voltage (V)
Capacitance
30
0
50
100
150
200
250
300
Qg - Total Gate Charge (nC)
Gate Charge
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.8
100
VGS = 10 V
ID = 30 A
TJ = 150 °C
I S - Source Current (A)
RDS(on) - On-Resistance
(Normalized)
1.5
1.2
0.9
0.6
10
TJ = 25 °C
0.3
0
- 50
- 25
0
25
50
1
75 100 125 150 175
0
0.2
TJ - Junction Temperature (°C)
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
1000
45
ID = 250 µA
IAV (A) at TA = 25 °C
40
VDS (V)
I Dav (a)
100
10
IAV (A) at TA = 150 °C
1
30
0.1
0.00001
35
0.0001
0.001
0.01
0.1
tin (s)
Avalanche Current vs. Time
1
25
- 50
- 25
0
25
50
75 100 125 150
175
TJ - Junction Temperature (°C)
Drain Source Breakdown
vs. Junction Temperature
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THERMAL RATINGS
1000
90
75
100 µs
60
ID - Drain Current (A)
I D - Drain Current (A)
100
45
30
10
1
15
0
0
25
50
75
100
125
150
0.1
0.1
175
TC - Case Temperature (°C)
*
Maximum Avalanche and Drain Current
vs. Case Temperature
Limited
by RDS(on)*
1 ms
10 ms
100 ms
DC
TC = 25 °C
Single Pulse
1
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which RDS(on) is specified
VGS
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
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TO-252AA CASE OUTLINE
E
A
MILLIMETERS
C2
e
b2
D1
e1
E1
L
gage plane height (0.5 mm)
L4
b
L5
H
D
L3
b3
C
A1
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
2.18
2.38
0.086
0.094
A1
-
0.127
-
0.005
b
0.64
0.88
0.025
0.035
b2
0.76
1.14
0.030
0.045
b3
4.95
5.46
0.195
0.215
C
0.46
0.61
0.018
0.024
C2
0.46
0.89
0.018
0.035
0.245
D
5.97
6.22
0.235
D1
5.21
-
0.205
-
E
6.35
6.73
0.250
0.265
E1
4.32
-
0.170
-
H
9.40
10.41
0.370
0.410
e
2.28 BSC
e1
0.090 BSC
4.56 BSC
0.180 BSC
L
1.40
1.78
0.055
0.070
L3
0.89
1.27
0.035
0.050
L4
-
1.02
-
0.040
L5
1.14
1.52
0.045
0.060
ECN: X12-0247-Rev. M, 24-Dec-12
DWG: 5347
Note
• Dimension L3 is for reference only.
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RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
0.243
0.087
(2.202)
0.090
(2.286)
(10.668)
0.420
(6.180)
(5.690)
0.180
0.055
(4.572)
(1.397)
Recommended Minimum Pads
Dimensions in Inches/(mm)
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