HUAXUANYANG
AOD4185
HXY
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
Description
The AOD4185 uses advanced trench technology
to provide excellent RDS(ON), low gate charge and
D
S
operation with gate voltages as low as 4.5V. This
G
device is suitable for use as a
TO252-2L
Battery protection or in other Switching application.
General Features
D
VDS = -40V I D =-40A
G
RDS(ON) < 19 mΩ @ VGS=10V
S
Application
P-Channel MOSFET
Battery protection
Load switch
Uninterruptible power supply
Package Marking and Ordering Information
Product ID
Pack
Marking
AOD4185
TO252-2L
40P04
Qty(PCS)
XXX YYYY
2500
Absolute Maximum Ratings (TC=25℃unless otherwise noted)
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
-40
V
VGS
Gate-Source Voltage
±20
V
ID@TC=25℃
Continuous Drain Current, VGS @ 10V1
-40
A
ID@TC=100℃
Continuous Drain Current, VGS @ 10V1
-22
A
IDM
Pulsed Drain Current2
-140
A
PD@TC=25℃
Total Power Dissipation4
40.3
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
RθJA
Thermal Resistance Junction-ambient 1
66
℃/W
RθJC
Thermal Resistance Junction-Case1
3.1
℃/W
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HUAXUANYANG
AOD4185
HXY
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
Electrical Characteristics (TJ = 25°C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static Characteristics
Drain-Source Breakdown Voltage
Gate-body Leakage current
Zero Gate Voltage Drain
Current
TJ=25℃
TJ=100℃
V(BR)DSS
VGS = 0V, ID = -250µA
-40
-
-
V
lGSS
VDS = 0V, VGS = ±20V
-
-
±100
nA
IDSS
VDS = -40V, VGS = 0V
-
-
-1
-
-
-100
-1.0
-1.5
-2.2
VGS = -10V, ID = -20A
-
13.5
19
VGS = -4.5V, ID = -15A
-
19.5
25
VDS = -10V, ID = -20A
-
44
-
-
2525
-
-
190
-
-
172
-
-
10
-
-
35
-
-
5.5
-
Gate-Threshold Voltage
VGS(th)
Drain-Source On-Resistance4
RDS(on)
gfs
Forward Transconductance4
VDS = VGS, ID = -250µA
μA
V
mΩ
S
Dynamic Characteristics5
Ciss
Input Capacitance
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate Resistance
Rg
VDS = -20V, VGS =0V,
f =1MHz
f =1MHz
pF
Ω
Switching Characteristics5
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
-
8
-
Turn-On Delay Time
td(on)
-
14.5
-
-
20.2
-
-
32
-
-
10
-
-
-
-1.2
V
-
-
-40
A
tr
Rise Time
td(off)
Turn-Off Delay Time
VGS = -10V,VDS = -20V,
ID= -20A
VGS = -10V, VDD = -20V,
RG = 3Ω, ID= -20A
tf
Fall Time
nC
ns
Drain-Source Body Diode Characteristics
VSD
Diode Forward Voltage4
Continuous Source Current
TC=25°C
IS = -20A, VGS = 0V
IS
-
Note :
1. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.
2. The EAS data shows Max. rating . The test condition is VDD= -25V, VGS= -10V, L= 0.1mH, IAS= -34A.
3. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper, The value in any given application depends on the
user's specific board design.
4. The data tested by pulsed , pulse width ≤ 300us , duty cycle ≤ 2%.
5. This value is guaranteed by design hence it is not included in the production test.
Shenzhen HuaXuanYang Electronics CO.,LTD
www.hxymos.com
HUAXUANYANG
AOD4185
HXY
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
Typical Characteristics
40
40
VDS= -5V
VGS = -10V
Drain current -ID (A)
Drain current -ID (A)
VGS = -4.5V
30
VGS = -3.5V
VGS = -3V
20
10
VGS = -2.5V
0
0
1
2
3
4
30
20
10
0
5
Drain−source voltage -VDS (V)
1
0
Figure 1. Output Characteristics
2
3
4
Gate−source voltage -VGS (V)
Figure 2. Transfer Characteristics
On-Resistance RDS (on) (mΩ)
Source current -IS (A)
100
10
1
0.1
0.2
0.4
0.6
0.8
1.0
80
60
40
20
0
1.2
ID= -20A
Source−drain voltage -VSD (V)
3
0
Figure 3. Forward Characteristics of Reverse
12
15
2.5
2.0
30
Normalized RDS (on)
On-Resistance RDS (on) (mΩ)
9
Figure 4. RDS(ON) vs. VGS
40
VGS = -4.5V
20
VGS = -10V
10
0
6
Gate−source voltage -VGS (V)
1.5
1.0
0.5
0
10
20
Drain current -ID (A)
Figure 5. RDS(ON) vs. ID
Shenzhen HuaXuanYang Electronics CO.,LTD
30
0.0
-50
-25
0
25
50
75
Temperature Tj(°C)
100
125
150
Figure 6. Normalized RDS(on) vs. Temperature
www.hxymos.com
HUAXUANYANG
AOD4185
HXY
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
100000
Capacitance(pF)
10000
Ciss
1000
Coss
100
Crss
10
1
F=1.0MHz
10
0
20
30
Drain-source voltage -VDS(V)
40
Figure 8. Gate Charge Characteristics
50
1000
40
100
Drain current -ID (A)
Power Dissipation PD(W)
Figure 7. Capacitance Characteristics
30
20
10
0
25
50
75
100
Case Temperature TC (°C)
125
100μs
10
Limited by RDS(on)
1
150
1ms
DC
10ms
Single Pulse
TC=25℃
0.1
0.01
0
10μs
TJ=150℃
0.1
1
10
100
Drain−source voltage -VDS (V)
Figure 9. Power Dissipation
Figure10. Safe Operating Area
Normalized RθJC ℃/W)
10
1
Duty = 1.0
Duty = 0.5
0.1
Duty = 0.2
Duty = 0.1
Duty = 0.05
0.01
Duty = 0.02
Duty = 0.01
0.001
0.000001
Single Pulse
0.00001
0.0001
0.001
0.01
0.1
1
10
t, Pulse Width(S)
Figure 11. Normalized Maximum Transient Thermal Impedance
Shenzhen HuaXuanYang Electronics CO.,LTD
www.hxymos.com
HUAXUANYANG
AOD4185
HXY
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
Test Circuit
VGS
RL
Qg
VDS
VGS
Qgs
Qgd
DUT
IG=const
Figure A. Gate Charge Test Circuit & Waveforms
RL
VDS
RG
VDD
VGS
DUT
VGS
Figure B. Switching Test Circuit & Waveforms
L
VDS
ID
RG
VDD
DUT
VGS
tp
Figure C. Unclamped Inductive Switching Circuit & Waveforms
Shenzhen HuaXuanYang Electronics CO.,LTD
www.hxymos.com
HUAXUANYANG
AOD4185
HXY
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
TO252-2L Package Information
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min.
Max.
Min.
Max.
A
2.200
2.400
0.087
0.094
A1
0.000
0.127
0.000
0.005
b
0.660
0.860
0.026
0.034
c
0.460
0.580
0.018
0.023
D
6.500
6.700
0.256
0.264
D1
5.100
5.460
0.201
0.215
D2
4.830 TYP.
0.190 TYP.
E
6.000
6.200
0.236
0.244
e
2.186
2.386
0.086
0.094
L
9.800
10.400
0.386
0.409
L1
L2
2.900 TYP.
1.400
L3
0.114 TYP.
1.700
0.055
1.600 TYP.
0.067
0.063 TYP.
L4
0.600
1.000
0.024
0.039
Φ
1.100
1.300
0.043
0.051
θ
0°
8°
0°
8°
h
0.000
0.300
0.000
0.012
V
5.350 TYP.
Shenzhen HuaXuanYang Electronics CO.,LTD
0.211 TYP.
www.hxymos.com
HUAXUANYANG
AOD4185
HXY
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
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