MOT130N03C
MOT130N03D
N-CHANNEL MOSFET
PRODUCT CHARACTERISTICS
VDSS
RDS(on)Typ( @V GS =10 V)
RDS(on)Typ( @V GS =4.5 V)
ID
Symbol
2.Drain
30V
2.5mΩ
3.5mΩ
130A
1.Gate
APPLICATIONS
Power switching circuit of adaptor and charge
3.Source
FEATURES
Fast switching
Low ON fesistance
Low gate charge
Low reverse transfer capacitances
2
2
1 2
1
3
TO-252
2
3
TO-251
ORDER INFORMATION
Order codes
Halogen-Free
Halogen
N/A
N/A
Package
TO-252
TO-251
MOT130N03D
MOT130N03C
Packing
2500 pieces /Reel
70 pieces /Tube
ABSOLITE MAXIMUM RATINGS (TC =25ć, unless otherwise specified)
Parameter
Drain-to-Source Voltage
Continuous Drain Current TC = 25 °C
Continuous Drain Current TC = 100 °C˄ Package limited ˅
Pulsed Drain Current TC = 25 °C˄ Package limited ˅
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Power Dissipation TC = 25 °C
Derating Factor above 25°C
Operating Junction and Storage Temperature Range
Symbol
VDSS
ID
ID
IDM
VGS
EAS
PD
TJˈTstg
Rating
30
130
60
240
f20
540
83
0.666
±55 to 150
Units
V
A
A
A
V
mJ
W
W/ć
ć
Symbol
R© JC
R© JA
Max.
1.5
100
Units
ć/W
ć/W
THERMAL DATA
Parameter
Junction-to-Case
Junction-to-Ambient
-1-
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MOT130N03C
MOT130N03D
N-CHANNEL MOSFET
ELECTRICAL CHARACTERISTICS (TJ =25ć, unless otherwise noted)
Drain to Source Leakage Current
Symbol
VDSS
IDSS
Gate to Source Forward Leakage
Gate to Source Reverse Leakage
IGSS(F)
IGSS(R)
Drain-to-Source On-Resistance
RDS(ON)
VGS=10V,ID=19A
Gate Threshold Voltage
VGS(TH)
VDS = VGS, ID = 250µA
Parameter
Drain to Source Breakdown Voltage
Test Conditions
VGS=0V, ID=250µA
VDS =30V, VGS= 0V
VDS =24V, VGS= 0V, TJ = 125ć
VGS =+20V
VGS =-20V
VGS=4.5V,ID=19A
Min.
Typ.
Max.
30
1.0
2.5
3.5
-
1
100
100
-100
3.5
4.8
3.0
-
2.3
2400
380
350
-
-
14.8
15.2
119.6
59.2
79.1
13.6
16.0
-
-
44.4
34.6
1.6
60
240
1.2
-
Units
V
µA
µA
nA
nA
mΩ
mΩ
V
Dynamic Characteristics
Gate resistance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Rg
Ciss
Coss
Crss
VGS=0V, VDS=0V, f=1MHz
VGS=0VˈVDS=15V
f=1.0MHz
Ω
pF
Resistive Switching Characteristics
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate to Source Charge
Gate to Drain (“Miller” )Charge
td(ON)
tr
td(OFF)
tf
Qg
Qgs
Q gd
VGS=10VˈR G=6Ω
VDD=15VˈID=50A
VGS=10VˈVDD=15V
ID=50A
ns
nC
Source-Drain Diode Characteristics
Continuous Source Current (Body Diode)
Maximum Pulsed Current (Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
IS
ISM
VSD
trr
Qrr
IRRM
IS=50A,VGS=0V
IS=50A,Tj = 25ć
dIF/dt=100A/us,
-2-
A
A
V
ns
nC
A
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MOT130N03C
MOT130N03D
N-CHANNEL MOSFET
TEST CIRCUIT AND WAVEFORM
Figure1. Maximum Forward Bias Safe Operating Area
Figure2. Maximum Power Dissipation vs Case
Temperature
Figure3. Maximum Continuous Drain Current vs
Figure 4. Typical Output Characteristics
Case Temperature
Figure5. Maximum Effective Transient Thermal Impedance, Junction-to-Case
-3-
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MOT130N03C
MOT130N03D
N-CHANNEL MOSFET
TYPICAL CHARACTERISTICS
Figure 6. Typical Transfer Characteristics
Figure 7. Typical Body Diode Transfer Characteristics
Figure 8. Drain-to-Source On Resistance vs Drain Current
Figure 9. Nomalized on Resistance vs Junction
Temperature
Figure 11. Nomalized Breakdown Voltage vs
Figure 10. Nomalized Theshold Voltage vs
Junction Temperature
Junction Temperature
-4-
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MOT130N03C
MOT130N03D
N-CHANNEL MOSFET
Drain Current,ID (A)
Source-Drain Current,IS (A)
TYPICAL CHARACTERISTICS(Cont.)
Normalized Thermal Transient Impedanc Curve
100
D=0.5
0.2
-1
10
PDM
0.1
0.05
0.02
0.01
t2
1.R©JC(t)=r(t)*R©JC
2.R©JC=See Datasheet
3.TJM-TC=P*R©JC(t)
4.Duty Cycle,D=t1/t2
Single Pulse
10-2
10-5
t1
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (sec)
100
101
-5-
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MOT130N03C
MOT130N03D
N-CHANNEL MOSFET
n TO-251 PACKAGE OUTLINE DIMENSIONS
-6-
www.mot-mos.com
MOT130N03C
MOT130N03D
N-CHANNEL MOSFET
n TO-252 PACKAGE OUTLINE DIMENSIONS
-7-
www.mot-mos.com
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