VSP004N10MS-G
100V/135A N-Channel Advanced Power MOSFET
Features
Enhancement mode
Low on-resistance RDS(on) @ VGS=4.5 V
VitoMOS® Ⅱ Technology
V DS
100
V
R DS(on),TYP@ VGS=10 V
3.8
mΩ
R DS(on),TYP@ VGS=4.5 V
5.7
mΩ
ID
135
A
PDFN5060X
100% Avalanche test
Pb-free lead plating; RoHS compliant
Part ID
Package Type
Marking
Packing
VSP004N10MS-G
PDFN5060X
004N10MG
3000PCS/Reel
Maximum ratings, at TA =25°C, unless otherwise specified
Symbol
Parameter
Rating
Unit
V(BR)DSS
Drain-Source breakdown voltage
100
V
VGS
Gate-Source voltage
±20
V
IS
Diode continuous forward current
TC = 25°C
135
A
ID
Continuous drain current @VGS=10V
TC = 25°C
135
A
TC = 100°C
85
A
IDM
Pulse drain current tested ①
TC = 25°C
540
A
IDSM
Continuous drain current @VGS=10V
TA = 25°C
25
A
TA = 70°C
20
A
EAS
Avalanche energy, single pulsed ②
121
mJ
TC = 25°C
125
W
TC = 100°C
50
W
TA = 25°C
4
W
TA = 70°C
2.7
W
-55 to 150
°C
Typical
Unit
PD
PDSM
TSTG,TJ
Maximum power dissipation
Maximum power dissipation ③
Storage and Junction Temperature Range
Thermal Characteristics
Symbol
Parameter
RθJC
Thermal Resistance, Junction-to-Case
1
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
30
°C/W
Copyright Vergiga Semiconductor Co., Ltd
Rev C – MAR, 2022
www.vgsemi.com
VSP004N10MS-G
100V/135A N-Channel Advanced Power MOSFET
Electrical Characteristics
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
Static Electrical Characteristics @ Tj=25°C (unless otherwise stated)
V(BR)DSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250μA
100
--
--
V
Zero Gate Voltage Drain Current(Tj=25℃)
VDS=100V,VGS=0V
--
--
1
μA
Zero Gate Voltage Drain Current(Tj=125℃)
VDS=100V,VGS=0V
--
--
100
μA
IGSS
Gate-Body Leakage Current
VGS=±20V,VDS=0V
--
--
±100
nA
VGS(th)
Gate Threshold Voltage
VDS=VGS,ID=250μA
1.4
1.9
2.4
V
--
3.8
5
mΩ
RDS(on)
Drain-Source On-State Resistance ④
--
5
--
mΩ
--
5.7
7.5
mΩ
3600
4240
4880
pF
1360
1600
1840
pF
25
35
45
pF
--
1.3
--
Ω
--
56
--
nC
IDSS
VGS=10V, ID=40A
RDS(on)
Drain-Source On-State Resistance ④
(Tj=100℃)
VGS=4.5V, ID=30A
Dynamic Electrical Characteristics @ Tj = 25°C (unless otherwise stated)
Ciss
Input Capacitance
VDS=30V,VGS=0V,
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
Qg(10V)
Total Gate Charge
Qg(4.5V)
Total Gate Charge
VDS=50V,ID=50A,
--
26
--
nC
Qgs
Gate-Source Charge
VGS=10V
--
14
--
nC
Qgd
Gate-Drain Charge
--
6.8
--
nC
--
13
--
ns
f=1MHz
f=1MHz
Switching Characteristics
Td(on)
Turn-on Delay Time
VDD=50V,
Tr
Turn-on Rise Time
ID=50A,
--
45
--
ns
Td(off)
Turn-Off Delay Time
RG=3Ω,
--
39
--
ns
--
42
--
ns
VGS=10V
Tf
Turn-Off Fall Time
Source- Drain Diode Characteristics@ Tj = 25°C (unless otherwise stated)
VSD
Forward on voltage
ISD=40A,VGS=0V
--
0.8
1.2
V
Trr
Reverse Recovery Time
Isd=50A, VGS=0V
--
50
--
ns
Qrr
Reverse Recovery Charge
di/dt=100A/μs
--
53
--
nC
NOTE:
① Repetitive rating; pulse width limited by max junction temperature.
② Limited by TJmax, starting TJ = 25°C, L = 0.5mH, RG = 25Ω, IAS = 22A, VGS =10V. Part not recommended for use above this value
③ The power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C.
④ Pulse width ≤ 380μs; duty cycle≤ 2%.
Copyright Vergiga Semiconductor Co., Ltd
Rev C – MAR, 2022
www.vgsemi.com
VSP004N10MS-G
100V/135A N-Channel Advanced Power MOSFET
ID, Drain-Source Current (A)
VGS(TH), Gate -Source Voltage (V)
Typical Characteristics
VDS, Drain -Source Voltage (V)
Tj - Junction Temperature (°C)
Fig2. VGS(TH) Gate -Source Voltage Vs. Tj
Normalized On Resistance
ID, Drain-Source Current (A)
Fig1. Typical Output Characteristics
Fig3. Typical Transfer Characteristics
Fig4. Normalized On-Resistance Vs. Tj
ID - Drain Current (A)
Tj - Junction Temperature (°C)
ISD, Reverse Drain Current (A)
VGS, Gate -Source Voltage (V)
VSD, Source-Drain Voltage (V)
Fig5. Typical Source-Drain Diode Forward Voltage
Copyright Vergiga Semiconductor Co., Ltd
Rev C – MAR, 2022
VDS, Drain -Source Voltage (V)
Fig6. Maximum Safe Operating Area
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VSP004N10MS-G
100V/135A N-Channel Advanced Power MOSFET
C, Capacitance (pF)
VGS, Gate-Source Voltage (V)
Typical Characteristics
VDS, Drain-Source Voltage (V)
Fig8. Typical Gate Charge Vs. Gate-Source Voltage
Thermal Resistance
ZθJC Normalized Transient
Fig7. Typical Capacitance Vs. Drain-Source Voltage
Qg - Total Gate Charge (nC)
Pulse Width (s)
Fig9. Normalized Maximum Transient Thermal Impedance
Fig10. Unclamped Inductive Test Circuit and waveforms
Copyright Vergiga Semiconductor Co., Ltd
Rev C – MAR, 2022
Fig11. Switching Time Test Circuit and waveforms
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VSP004N10MS-G
100V/135A N-Channel Advanced Power MOSFET
Marking Information
Vs
004N10MG
XXXYWW
1st line:
2nd line:
3rd line:
, Vergiga Logo
Vergiga Code(Vs)
Part Number(004N10MG)
Date code (XXXYWW)
XXX: Wafer Lot Number Code, code changed with Lot Number
Y:
Year Code , refer to table below
WW: Week Code (01 to 53)
Code
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
Year
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
2027
2028
2029
2030
Copyright Vergiga Semiconductor Co., Ltd
Rev C – MAR, 2022
www.vgsemi.com
VSP004N10MS-G
100V/135A N-Channel Advanced Power MOSFET
PDFN5060X Package Outline Data
Symbol
DIMENSIONS ( unit : mm )
Min
Typ
Max
A
1.00
1.10
1.20
A1
0.00
--
0.05
b
0.30
0.40
0.50
c
0.20
0.25
0.30
D1
5.00
5.20
5.40
D2
3.80
4.10
4.25
E
5.95
6.15
6.35
E1
5.66
5.86
6.06
E2
3.52
3.72
3.92
e
1.27 BSC
H
0.40
0.50
0.60
K
1.10
--
--
L
0.50
0.60
0.70
L1
0.08
0.15
0.22
α
0°
--
12°
Copyright Vergiga Semiconductor Co., Ltd
Rev C – MAR, 2022
Notes:
1. Refer to JEDEC MO-240 variation AA.
2. Dimensions "D1" and "E1" do NOT include mold flash
protrusions or gate burrs.
3. Dimensions "D1" and "E1" include interterminal flash or
protrusion. Interterminal flash or protrusion shall not exceed
0.25mm per side.
Customer Service
Sales and Service:
sales@vgsemi.com
Vergiga Semiconductor CO., LTD
TEL: (86-755) -26902410
FAX: (86-755) -26907027
WEB: www.vgsemi.com
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