SPECIFICATIONS FOR APPROVAL
GP
Customer Part No.:
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSX221SA / 32.000MHz
Sample Order No:
X2B032000D81H-U
CRYSTAL
Date:
EOS-G60137-1
2016/06/14
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409 號 2 樓
2F., NO.409, SEC.2, TIDING BLVD.,
NEIHU DISTRICT, TAIPEI CITY 114,
TAIWAN
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路 39 號
No.39, HWA DONG RD., DALLIAO
DIST.,DAFA INDUSTRIAL PARK.,
KAOHSIUNG CITY 831, TAIWAN
TEL: (07)787-1555-6
FAX: (07)787-1557
THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE 70110,
THAILAND
TEL: (032)221994-6,
200740-1
FAX: (032)200742
Country of origin
Tittle HSX221SA
QUARTZ CRYSTAL SPECIFICATION
Date
Confirm
2016/06/14 F. S. TSAI
Check
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Y. W. LEE
U. F. CHEN
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Spec. No.
SHENZHEN FACTORY:
深圳市福永鎮塘尾村橋塘路聚源工業區
QIAO TANG RD., TANGWEI VILLAGE
FU YONG TOWN SHENZHEN CITY
CHINA
TEL: 0755-27309272 /
27309262
FAX: 0755-27309755
TAIWAN FACTORY
THAILAND FACTORY
CHINA FACTORY
Rev.
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X2B032000D81H-U
ELECTRONICS
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1
HSX221SA SPECIFICATION
INDEX
ITEM
PAGE
1. QUARTZ CRYSTAL UNIT SPECIFICATION．．．．．．．．．．．．
3
2. MARKING & DIMENSIONS．．．．．．．．．．．．．．．．．．．
4
3. INSIDE STRUCTURE．．．．．．．．．．．．．．．．．．．．．．
5
4. EMBOSS CARRIER TAPE&REEL．．．．．．．．．．．．．．．．
a. DIMENSIONS OF CARRIER TAPE．．．．．．．．．．．．．．．
6
b. DIMENSIONS OF REEL．．．．．．．．．．．．．．．．．．．．
6-7
c. STORAGE CONDITION．．．．．．．．．．．．．．．．．．．．
7
d. STANDARD PACKING QUANTITY．．．．．．．．．．．．．．．
7
e. MATERIAL OF TAPE．．．．．．．．．．．．．．．．．．．．．
7
f. LABEL CONTENTS．．．．．．．．．．．．．．．．．．．．．．
7
g. TAPING DIMENSION．．．．．．．．．．．．．．．．．．．．．
8
h. JOINT OF TAPE．．．．．．．．．．．．．．．．．．．．．．．
8
i. RELEASE STRENGHT OF COVER TAPE．．．．．．．．．．．．
8
j. PACKAGE．．．．．．．．．．．．．．．．．．．．．．．．．．．
9
5. MECHANICAL ENDURANCE．．．．．．．．．．．．．．．．．．
10
6. ENVIRONMENTAL ENDURANCE．．．．．．．．．．．．．．．．
11
7. SUPPLEMENT．．．．．．．．．．．．．．．．．．．．．．．．．
12-13
8. Flow Chart．．．．．．．．．．．．．．．．．．．．．．．．．．．
14
9. Environmental Workload Chemical Substance Components List．
15
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Tittle HSX221SA
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1. QUARTZ CRYSTAL UNIT SPECIFICATION
1. Frequency:
32.000000MHz
2. Holder type :
HSX221SA
3. Frequency tolerance:
+/-20 ppm at 25deg.C +/-3deg.C
4. Equivalent resistance:
60 ohms Max. / SERIES
5. Storage temperature range:
-40 deg.C To +85 deg.C
6. Operable temperature range:
-30 deg.C To +85 deg.C
7. Temperature drift:
+/-20ppm
8. Loading capacitance (CL) :
8.0 pF
9. Drive level:
10 μW
10. Shunt Capacitance:
2.0 pF Max.
11. Insulation resistance :
More than 500M ohms at DC 100V
12. Mode of oscillation:
Fundamental
13. Circuit:
Measured in HP/E5100A,S&A 250B
14. Shocking :
Dropping from 120 cm height 3 times on Concrete floor
Variation :
-30 deg.C To +85 deg.C
(100uW Max.)
Frequency less than +/-5 ppm
Resistance less than +/- 15 ﹪or 2ohms max.
15. Aging:
Less than +/- 3 ppm/Year
16. Holder
HSX221SA Seam type
17. Dimensions and marking
Refer to page.4
18. Emboss carrier tape & reel
Refer to page.6 and page.7
19. Moisture Sensitivity Level
20. Note:
Level 1
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Tittle HSX221SA
QUARTZ CRYSTAL SPECIFICATION
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3
2. HSX221SA MARKING & DIMENSIONS
2.5±0.15
Frequency
3
4
3
1
2
1
2
0.50 Max
2±0.15
4
1.15
0.73
4
3
1
2
1
1.3
0.9
0.7
1.0
0.58
2
1.75
4
3
UNIT: mm
TOLERANCE: ±0.1
Chamfer index mark depends on the ceramic base supplier
*Marking should be printed as following:
Logo, Nominal Frequency, Manufactured year & month
*Nominal frequency = integer only
( ex. 14.31818 MHz 14 )
*Manufacturing Lot No.
(Y: year) ex. 2000 shall be marked as ‘ 0 ’ (As shown on the Table-1)
(M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2).
Marking : Laser marking.
(Table-1)
Year
2000
2010
0
Code
2001
2011
1
2002
2012
2
2003
2013
3
2004
2014
4
2005
2015
5
2006
2016
6
2007
2017
7
2008
2018
8
2009
2019
9
(Table-2)
Jan.
A
Feb.
B
Mar.
C
Apr.
D
May.
E
Jun.
F
Jul.
G
Aug.
H
Sep.
J
Oct.
K
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Nov.
L
Dec.
M
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4
3. INSIDE STRUCTURE
Cover Ring(8)
ELECTRODE(7)
PAD(6)
PAD(6)
LID(2)
CRYSTAL BLANK(4)
ADHESIVE(5)
Base(1
※Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
(6) Metallized Pad: W
Ni Plating
Au Plating
(2) Lid :
Fe- Ni -Co
(3) Crystal Enclosure Seal:
Seal Seam
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) Adhesive
Silver Conductive Silicon Resin
(7) Electrode
(8) Cover Ring：
Fe-Ni-Co Alloy
The use prohibition chemistry
substance of Table 1 of DHE-0204-1
(HE-QA-24) is not included in this
item.
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4. HSX221SA EMBOSS CARRIER TAPE & REEL
a.) Dimensions of Carrier Tape
b.) Dimensions of Reel
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(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
9.3+/-0.3
Outer Width
W2
11.3+/-1.0
Out Line diameter
B
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
Q
120deg
C
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Width
Center
Core slit
Position
Spindle diameter
Key Ditch
Width
c.) Storage condition
Temperature: +40deg.C Max.
Relative Humidity: 80% Max.
d.) Standard packing quantity
3,000PCS / REEL
e.) Material of the tape
Tape
Carrier tape
Top tape
Material
PS Conductive
Polyester
f.) Label contents
Sticks label for every reel.
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g.) Taping dimension
Cover-tape
Leader
Carrier-tape
Cover-tape
Terminal
Carrier-tape
Terminal
The length of cover-tape in the leader is more than 400 mm including
empty embossed area.
After all products were packaged, must remain more than twenty
pieces or 400 mm empty area, which should be sealed by cover-tape.
The tip of cover-tape shall be fixed temporary by paper tape and roll
around the core of reel one round.
The empty embossed area which are sealed by top cover-tape must
remain more the 40 mm.
Components
Leader
Emptv compartments
Emptv compartments
Top cover-tape
Embossed Carrier-tape
h.) Joint of tape
The carrier-tape and top cover-tape should not be jointed.
i.) Release strength of cover tape
It has to between 0.1N to 0.7N under following condition.
Pulling direction 165° to 180°
Speed
300mm/min.
Otherwise unless specified.
165°~ 180°
Pulling direction
Other standards shall be based on JIS C 0806-1990.
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j.) Package
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5. Mechanical Performance
Test Methods
1
Natural Drop
2
Vibration
Dropping from 120 cm height 3 times on Concrete floor
Refer to: JIS C 60068-2-6
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z
3 axes, Duration of 2 hours to each axis.
Refer to: MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6
Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak
detector.
After applying ROSIN Flux, dipping in solder bath at
245deg.C+/-5deg.C for 3+/-0.5 sec.
Refer to: JIS C 60068-2-20
Mount a sample on board.
Apply Pressure to the
center of board until it is
bent to 3 mm and hold
for 5 ±1 sec
Pressure speed :0.5 mm / sec
Refer to: EIAJ ET-7403
Mount a sample on
the circuit board.
Apply pressure
vertically to the side
of specimen attached
to the circuit board
with the pressure jig.
Pressure : 5N for 10±1 sec
Refer to: EIAJ ET-7403
Apply pressure to the
center of body with the
R0.5 pressure jig.
pressure :10N for 10±1sec
Refer to: EIAJ ET-7403
3
Sealing Tightness
4
Solder ability
5
6
7
Substrate Bending
Adhesion
Body strength
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QUARTZ CRYSTAL SPECIFICATION
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Specifications
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--B
A
A
A
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6.
Environment Performance
Item
1
2
3
4
Specifications
Code
Test Methods
Humidity
Temperature 60℃+/-2℃, RH 90~95%, Duration of 240 hours.
Back to room temperature first, then in 1~2 hours, the component shall
be checked.
Refer to: JIS C 60068-2-3
-40deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
Refer to: JIS C 60068-2-1
+85deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
Refer to: JIS C 60068-2-2
-40deg.C +/-2deg.C (30min) +85deg.C +/-2deg.C (30min) 25
cycles. Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
Refer to: JIS C 0025
Storage in Low
Temperature
Storage in High
Temperature
Temperature cycles
A
A
A
A
Specifications code
Specifications
A
Frequency variation shall be within +/-5ppm and equivalent resistance shall be within
+/-15% or 2Ω
More than 90% of lead shall be covered by new solder.
B
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7. Supplement
7.1.Soldering
7.2.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
260 deg.C
Temperature
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
7.3.Land pattern layout(Example)
7.4.Solder iron (Example)
Bit temp.: 350℃max., Time:3sec max. , Each terminal solder a 1 time max.
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7.5.Mounting
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be
Sure of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause
Soldering process.
Avoid mounting and processing by Ultrasonic welding because this method has a
Possibility of an excessive vibration spreading inside the crystal products and
Becoming the cause of characteristic deterioration and not oscillating.
7.6.Cleaning
Cleaning liquid which corrodes Nickel shall not be used
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
7.7.Storage
Please keep away from high temperature and high humidity, which may cause put solderbility.
No direct Sunlight, No dew as well.
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8. Flow Chart
LID(外 殼 蓋 )
BLANK(晶 片 )
BLANK進 料 檢 查
LID進 料 檢 查
1
Incoming Inspection
of Lid
2
LID洗 淨
Lid Cleaning and Dry
BASE(基 座 )
5
6
7
8
9
10
11
12
13
14
15
16
17
3
Incoming Inspection
of Base
4
Base Cleaning
化學蝕刻
Etching
BASE(基 座 )洗 淨
頻率選別
Frequency Sorting
晶片排盤
Blank Filling
洗 淨 +微 蝕 刻
Blank Cleaning (Individule
cleaning+flash etching)
基礎蒸著
Base Plating
押入接著
Blank Mounting and
Bonding
接著硬化
Bonding Curing
接著外觀檢查
24
Bonding Inspection
氣 密 檢 查 I (Air)
Sealing Inspection I (Air Leak)
調整蒸著
Partial Adjustment (Ion Partial)
25
氣 密 檢 查 II (氦 氣 加 壓 )
Sealing Inspection II
(He Pressurization)
中 間 檢 查 ($)
Middle Check
26
氣 密 檢 查 II (He)
Sealing Inspection II (He Leak)
高真空烘烤
High Vacuum Anneal
27
溫度特性抽檢
28
最 終 檢 查 ($)
LID點 焊
Temporary Positioning
18
熔 接 (seam)
19
強 勵 振 Overdrive
20
Relow
21
老 化 Aging
22
印字排盤
23
BASE(基 座 )進 料 檢 查
Incoming Inspection
of Crystal blank
Sealing (seam)
29
30
31
Temperature characteristics
adjustment inspection
Final Inspection
TAPPING外 觀 檢 查
Appearance inspection after Taping
出 貨 檢 查 ($)
Outgoing Inspection
出貨捆包
Packing
Mark Loading
印 字 +外 觀 檢 查
出 貨 Shipment
Laser Marking and
Appearance Inspection
($)： 特 殊 特 性
(For Critical prcoess had been monitored)
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9. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
HSX221S
PERCENTAGE
9.6(mg)
ppm
Si
0.316800
30.412800
Au
0.048000
4.608000
Co & Co Compound
0.784320
75.294720
Mo & Mo Compound
0.017280
1.658880
Ag
1.875840
180.080640
Cu
0.075840
7.280640
Cr & Cr Compound
0.024000
2.304000
Al
2.083200
199.987200
Mn & Mn Compound
0.014400
1.382400
W & W Compound
0.042240
4.055040
Ni & Ni Compound
2.090880
200.724480
Fe
2.220480
213.166080
Chemical Substance Components
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REV.
No.
DATE
REASON
0
2016/06/14
New
CONTENTS
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