SPECIFICATIONS FOR APPROVAL
GP
Customer Part No.:
HELE. Part No: X2C048000L71H-CEHZ
Application For:
Products:
Accepted Model:
Type & Freq.:
Sample Order No:
EOS-D60007-1
Date:
CRYSTAL
HSX211S / 48.000MHz
2013/06/03
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
HARMONY ELECTRONICS (SUZHOU) CO.,LTD
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409
號2樓
2F., NO.409, SEC.2, TIDING
BLVD., NEIHU DISTRICT,
TAIPEI CITY 114, TAIWAN
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路
39 號
No.39, HWA DONG RD.,
DALLIAO DIST.,DAFA
INDUSTRIAL PARK.,
KAOHSIUNG CITY 831,
TAIWAN
TEL: (07)787-1555-6
FAX: (07)787-1557
THAILAND FACTORY:
66MOO 5,
KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE
70110, THAILAND
TEL: (032)221994-6,
200740-1
FAX: (032)200742
Tittle HSX211S
SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源
工業區
QIAO TANG RD., TANGWEI
VILLAGE FU YONG TOWN
SHENZHEN CITY CHINA
TEL: 0755-27309272 /
27309262
FAX: 0755-27309755
Country of origin
QUARTZ CRYSTAL SPECIFICATION
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X2C048000L71H-CEHZ
ELECTRONICS
SUZHOU FACTORY:
蘇州市相城區黃埭鎮安民路 5 號
NO.5 ANMING ROAD,
HUANGDAI TOWN,
XIANGCHENG DISTRCT,
SUZHOU CITY, JIANGSU
PROVINCE
TEL:86-512-67592373
FAX:86-512-67592363
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1
HSX211S
SPECIFICATION
INDEX
ITEM
PAGE
1. QUARTZ CRYSTAL UNIT SPECIFICATION．．．．．．．．．．．．
3
2. MARKING & DIMENSIONS．．．．．．．．．．．．．．．．．．．
4
3. INSIDE STRUCTURE．．．．．．．．．．．．．．．．．．．．．．
5
4. EMBOSS CARRIER TAPE&REEL．．．．．．．．．．．．．．．．
a. DIMENSIONS OF CARRIER TAPE．．．．．．．．．．．．．．．
6
b. DIMENSIONS OF REEL．．．．．．．．．．．．．．．．．．．．
6-7
c. STORAGE CONDITION．．．．．．．．．．．．．．．．．．．．
7
d. STANDARD PACKING QUANTITY．．．．．．．．．．．．．．．
7
e. MATERIAL OF TAPE．．．．．．．．．．．．．．．．．．．．．
7
f. LABEL CONTENTS．．．．．．．．．．．．．．．．．．．．．．
7
g. TAPING DIMENSION．．．．．．．．．．．．．．．．．．．．．
8
h. JOINT OF TAPE．．．．．．．．．．．．．．．．．．．．．．．
8
i. RELEASE STRENGHT OF COVER TAPE．．．．．．．．．．．．
8
j. PACKAGE．．．．．．．．．．．．．．．．．．．．．．．．．．．
9
5. MECHANICAL ENDURANCE．．．．．．．．．．．．．．．．．．
10
6. ENVIRONMENTAL ENDURANCE．．．．．．．．．．．．．．．．
11
7. SUPPLEMENT．．．．．．．．．．．．．．．．．．．．．．．．． 12-13
8. Flow Chart．．．．．．．．．．．．．．．．．．．．．．．．．．．
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14
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1. QUARTZ CRYSTAL UNIT SPECIFICATION
1. Frequency:
48.000000MHz
2. Holder type :
HSX211S
3. Frequency tolerance:
+/-8ppm at 25deg.C +/-3deg.C
4. Equivalent resistance:
22 ohms Max. / SERIES
5. Storage temperature range:
-40 deg.C To +125 deg.C
6. Operable temperature range:
-30 deg.C To +85 deg.C
7. Temperature drift:
+/-12 ppm
8. Loading capacitance (CL) :
7.8 pF
9. Drive level:
10μW
10. Shunt Capacitance:
0.64~1.04 pF
11. Insulation resistance :
More than 500M ohms at DC 100V
12. Mode of oscillation:
Fundamental
13. Circuit:
Measured in HP/E5100A,S&A 250B
14. Shocking :
Dropping from 75 cm height 3 times on firm wood
Variation :
-30 deg.C To +85 deg.C
(100uW Max)
Frequency less than +/-5 ppm
Resistance less than +/- 15 ﹪or 2ohms max.
15. Aging:
Less than +/- 3 ppm/Year
16. Holder
HSX211S Seam type
17. Dimensions and marking
Refer to page.4
18. Emboss carrier tape & reel
Refer to page.6 and page.7
19. Moisture Sensitivity Level
Level 1
20. Note：
Spurious: 1100ohm (+/- 700KHz)
C1: 2.16~4.16 fF
L1: 1.0~4.0 mH
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2. HSX211S MARKING & DIMENSIONS
Chamfer index mark depends on the ceramic base supplier.
*Marking should be printed as following:
Logo, Nominal Frequency, Manufactured year & month
*Nominal frequency = integer only
( ex. 14.31818 MHz 14 )
*Manufacturing Lot No.
(Y: year) ex. 2000 shall be marked as ‘ 0 ’ (As shown on the Table-1)
(M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2).
Marking : Laser marking.
(Table-1)
Year
2000
2010
0
Code
2001
2011
1
2002
2012
2
2003
2013
3
2004
2014
4
2005
2015
5
2006
2016
6
2007
2017
7
2008
2018
8
2009
2019
9
(Table-2)
Jan.
A
Feb.
B
Mar.
C
Apr.
D
May.
E
Jun.
F
Jul.
G
Tittle HSX211S
Aug.
H
Sep.
J
Oct.
K
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Nov.
L
Dec.
M
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4
3. INSIDE STRUCTURE
※Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metallized Pad: Mo
Ni Plating
Au Plating
(2) LID:
Fe- Ni -Co
(3) Crystal Enclosure Seal:
Seal Seam
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) Adhesive
Silver Conductive Silicon Resin
The use prohibition chemistry
substance of Table 1 of DHE-0204-1
(HE-QA-24) is not included in this
item.
(6) Electrode
(7) PAD
Alumina Ceramic : Mo
Ni Plating
Au Plating
(8) Cover Ring：
Fe-Ni-Co Alloy
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4. HSX211S EMBOSS CARRIER TAPE & REEL
a.) Dimensions of Carrier Tape
b.) Dimensions of Reel
Tittle HSX211S
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(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
9.3+/-0.3
Outer Width
W2
Out Line diameter
B
11.3+/-1.0
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
q
C
120deg
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Width
Center
Core slit
Position
Spindle diameter
Key Ditch
Width
c.) Storage condition
Temperature: +40deg.C Max.
Relative Humidity: 80% Max.
d.) Standard packing quantity
3,000PCS / REEL
e.) Material of the tape
Tape
Carrier tape
Top tape
Material
PS Conductive
Polyester
f.) Label contents
Sticks label for every reel.
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g.) Taping dimension
Cover-tape
Leader
Carrier-tape
Cover-tape
Terminal
Carrier-tape
Terminal
The length of cover-tape in the leader is more than 400 mm including empty
embossed area.
After all products were packaged, must remain more than twenty pieces or
400 mm empty area, which should be sealed by cover-tape.
The tip of cover-tape shall be fixed temporary by paper tape and roll around
the core of reel one round.
The empty embossed area which are sealed by top cover-tape must remain
more the 40 mm.
Components
Leader
Emptv compartments
Emptv compartments
Top cover-tape
Embossed Carrier-tape
h.) Joint of tape
The carrier-tape and top cover-tape should not be jointed.
i.) Release strength of cover tape
It has to between 0.1N to 0.7N under following condition.
Pulling direction 165° to 180°
Speed
300mm/min.
Otherwise unless specified.
165°~ 180°
Pulling direction
Other standards shall be based on JIS C 0806-1990.
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j.) Package
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5. Mechanical Performance
Test Methods
1
Natural Drop
2
Vibration
3
Sealing Tightness
4
Solderability
5
Substrate Bending
Drop 3 times from the height of 75cm onto min. 30mm thickness hard
wooden board.
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z
3 axes, Duration of 2 hours to each axis.
Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak
detector.
After applying ROSIN Flux, dipping in solder bath at
245deg.C+/-5deg.C for 3+/-0.5 sec.
Mount a sample on board.
Apply Pressure to the
center of board until it is
bent to 3 mm and hold
for 5 ±1 sec
Pressure speed :0.5 mm / sec
Mount a sample on
the circuit board.
Apply pressure
vertically to the side
of specimen attached
to the circuit board
with the pressure jig.
Pressure : 5N for 10±1 sec
Apply pressure to the
center of body with the
R0.5 pressure jig.
pressure :10N for 10±1sec
6
7
Adhesion
Body strength
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--B
A
A
A
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6.
Environment Performance
Item
1
2
3
4
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours.
Back to room temperature first, then in 1~2 hours, the component shall
be checked.
-40deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
+85deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
-40deg.C +/-2deg.C (30min) +85deg.C +/-2deg.C (30min) 25
cycles. Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
Humidity
Storage in Low
Temperature
Storage in High
Temperature
Temperature cycles
A
A
A
A
Specifications code
Specifications
A
Frequency variation shall be within +/-5ppm and equivalent resistance shall be within
B
+/-15% or 2Ω
More than 90% of lead shall be covered by new solder.
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7. Supplement
7.1.Soldering
7.2.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
7.3.Land pattern layout(Example)
7.4.Solder iron (Example)
Bit temp.:350℃max.,Time:3sec max. ,Each terminal solder a 1 time max.
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7.5.Mounting
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be sure
of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause Soldering
Process.
7.6.Cleaning
Cleaning liquid which corrodes Nickel shall not be used
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
7.7.Storage
Please keep away from high temperature and high humidity ,which may cause put solderbility. No
direct Sunlight, No dew as well.
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8. Flow Chart
LID(外 殼 蓋 )
BLANK(晶 片 )
BLANK進 料 檢 查
LID進 料 檢 查
1
Incoming Inspection
of LID
4
2
LID洗 淨
5
Cleaning of LID
BASE(基 座 )
6
7
Incoming Inspection
of BLANK
BASE進 料 檢 查
3
Incoming Inspection
of BASE
化學蝕刻
Etching
頻率選別
Sorting of Freq.
蒸著前洗淨
Cleaning before
Base Plating
8
微蝕刻
9
基 礎 蒸 著 ($)
Flash Etching
Base Plating
10
押入接著
11
接 著 硬 化 ($)
12
13
Blank Ass'y
Adhesive Curing
接 著 檢 查 ($)
Bonding Check
22
調 整 蒸 著 / ION Partial
Partial Adjustment/Ion Partial
氣 密 檢 查 II (氦 氣 加 壓 )
23
14
15
氣 密 檢 查 I (AIR) ($)
Leak Check I
中 間 檢 查 ($)
Leak Check II
(Helium Pressurization)
Middle Check
高真空烘烤
24
氣 密 檢 查 II (HE) ($)
Leak Check II
High Vacuum Annealing
25
最 終 檢 查 ($)
Final Check
16
熔 接 Seam Seal
17
強 勵 振 Over Drive
26
TAPING
18
REFLOW
27
Taping 外 觀 檢 查
Check of Taping
19
老 化 Aging
28
20
印字排盤
Aligning
29
21
印 字 +外 觀 檢 查
出貨檢查
Outgoing Inspection
出貨捆包
Packing to
Shipment/stock
Marking & Check
出 貨 Shipment
($)： 特 殊 特 性
(For Special Characteristics)
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REV.
DATE
REASON
No.
0
2013/06/03
New
CONTENTS
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