X2C027120FA1H-HV

PRELIMINARY SPECIFICATIONS GP Customer Part No.: HELE. Part No: Application For: Products: Accepted Model: Type & Freq.: Sample Order No: Date: X2C027120FA1H-HV CRYSTAL HSX211S / 27.120MHz 2011/10/12 Approved By : HARMONY ELECTRONICS CORP. HARMONY ELECTRONICS (THAILAND) CO., LTD. HARMONY ELECTRONICS (SHENZHEN) CORP., LTD. TAIPEI OFFICE: 公司:(114) 台北市內湖區堤頂大道 2 段 409 號 2 樓 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN (R.O.C.) TEL:886-2-26588883 FAX:886-2-26588683 TAIWAN FACTORY: 工廠:(831) 高雄市大寮區大發工業區華東路 39 號 No.39, Hua dong Rd., Daliao Dist.,Dafa Industrial Park., Kaohsiung City 831, Taiwan (R.O.C.) TEL: (07)787-1555-6 FAX: (07)787-1557 Tittle HSX211S Date THAILAND FACTORY: 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RAJCHABUREE PROVINCE 70110, THAILAND TEL: (032)221994-6, 200740-1 FAX: (032)200742 SHENZHEN FACTORY: 深圳市福永鎮塘尾村塘橋路聚源工業區 QIAO TANG RD., TANGWEI VILLAGE FU YONG TOWN SHENZHEN CITY CHINA TEL: 0755-7309272 / 7309262 FAX: 0755-7309755 Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 1 HSX211S SPECIFICATION INDEX ITEM PAGE 1. QUARTZ CRYSTAL UNIT SPECIFICATION．．．．．．．．．．．． 3 2. MARKING & DIMENSIONS．．．．．．．．．．．．．．．．．．． 4 3. INSIDE STRUCTURE．．．．．．．．．．．．．．．．．．．．．． 5 4. EMBOSS CARRIER TAPE&REEL．．．．．．．．．．．．．．．． a. DIMENSIONS OF CARRIER TAPE．．．．．．．．．．．．．．． 6 b. DIMENSIONS OF REEL．．．．．．．．．．．．．．．．．．．． 6-7 c. STORAGE CONDITION．．．．．．．．．．．．．．．．．．．． 7 d. STANDARD PACKING QUANTITY．．．．．．．．．．．．．．． 7 e. MATERIAL OF TAPE．．．．．．．．．．．．．．．．．．．．． 7 f. LABEL CONTENTS．．．．．．．．．．．．．．．．．．．．．． 7 g. TAPING DIMENSION．．．．．．．．．．．．．．．．．．．．． 8 h. JOINT OF TAPE．．．．．．．．．．．．．．．．．．．．．．． 8 i. RELEASE STRENGHT OF COVER TAPE．．．．．．．．．．．． 8 j. PACKAGE．．．．．．．．．．．．．．．．．．．．．．．．．．． 9 5. MECHANICAL ENDURANCE．．．．．．．．．．．．．．．．．． 10 6. ENVIRONMENTAL ENDURANCE．．．．．．．．．．．．．．．． 10 7. SUPPLEMENT．．．．．．．．．．．．．．．．．．．．．．．．． 11-12 8. Flow Chart．．．．．．．．．．．．．．．．．．．．．．．．．．． Tittle HSX211S Date 13 Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 2 1. QUARTZ CRYSTAL UNIT SPECIFICATION 1. Frequency: 27.120000MHz 2. Holder type : HSX211S 3. Frequency tolerance: +/- 30ppm at 25deg.C +/-3deg.C 4. Equivalent resistance: 80 ohms Max. / SERIES 5. Storage temperature range: -40 deg.C To +85 deg.C 6. Operable temperature range: -30 deg.C To +85 deg.C 7. Temperature drift: +/-30 ppm 8. Loading capacitance (CL) : -30 deg.C To +85deg.C 10.0 pF 9. Drive level: 10 μW 10. Shunt Capacitance: 2.0 pF Max 11. Insulation resistance : More than 500M ohms at DC 100V 12. Mode of oscillation: Fundamental 13. Circuit: Measured in HP/E5100A,S&A 250B 14. Shocking : Dropping from 50 cm height 3 times on firm wood Variation : (100uW Max) Frequency less than +/-5 ppm Resistance less than +/- 15 ﹪or 2ohms max. 15. Aging: Less than +/- 1 ppm/Year 16. Holder HSX211S Seam type 17.Dimensions and marking Refer to page.4 18.Emboss carrier tape & reel Refer to page.6 and page.7 19.Note: Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 3 2. HSX211S MARKING & DIMENSIONS *Marking should be printed as following: Logo, Nominal Frequency, Manufactured year & month *Nominal frequency = integer only ( ex. 14.31818 MHz Æ 14 ) *Manufacturing Lot No. (Y: year) ex. 2000 shall be marked as ‘ 0 ’ (As shown on the Table-1) (M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2). Marking : Laser marking. (Table-1) Year 2000 2010 0 Code 2001 2011 1 2002 2012 2 2003 2013 3 2004 2014 4 2005 2015 5 2006 2016 6 2007 2017 7 2008 2018 8 2009 2019 9 (Table-2) Jan. A Feb. B Mar. C Apr. D May. E Jun. F Jul. G Tittle HSX211S Date Aug. H Sep. J Oct. K Nov. L Dec. M Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 4 3. INSIDE STRUCTURE ※Reference drawing (1) Base: Alumina Ceramic (Al2O3) Metallized Pad: W Ni Plating Au Plating The use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included in this item. (2) Cap: Fe- Ni -Co (3) Crystal Enclosure Seal: Seal Seam (4) Crystal Blank Rectangular At-Cut Quartz Crystal Blank (5) Adhesive Silver Conductive Silicon Resin (6) PAD Alumina Ceramic (W. Ni. Au) (7) Cover Ring： Fe-Ni-Co Alloy Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 5 4. HSX211S EMBOSS CARRIER TAPE & REEL a.) Dimensions of Carrier Tape b.) Dimensions of Reel Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 6 (Table-2) (UNIT: mm) MARK DIMENSIONS‧ANGLE Diameter A ψ180+0/-3 Inner Width W1 9.3+/-0.3 Outer Width W2 Out Line diameter B 11.3+/-1.0 ψ60.5+/-0.5 F1 3.0+0.5/-0 F2 4.0+0.5/-0 F3 5.0+0.5/-0 q C 120deg ψ13.2+/-0.5 E 3.0+/-0.2 ITEM FLANCE HUB Width Center Core slit Position Spindle diameter Key Ditch Width c.) Storage condition Temperature: +40deg.C Max. Relative Humidity: 80% Max. d.) Standard packing quantity 3,000PCS / REEL e.) Material of the tape Tape Carrier tape Top tape Material PS Conductive Polyester f.) Label contents Sticks label for every reel. Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 7 g.) Taping dimension Cover-tape Leader Carrier-tape Cover-tape Terminal Carrier-tape Terminal The length of cover-tape in the leader is more than 400 mm including empty embossed area. After all products were packaged, must remain more than twenty pieces or 400 mm empty area, which should be sealed by cover-tape. The tip of cover-tape shall be fixed temporary by paper tape and roll around the core of reel one round. The empty embossed area which are sealed by top cover-tape must remain more the 40 mm. Components Leader Emptv compartments Emptv compartments Top cover-tape Embossed Carrier-tape h.) Joint of tape The carrier-tape and top cover-tape should not be jointed. i.) Release strength of cover tape It has to between 0.1N to 0.7N under following condition. Pulling direction 165° to 180° Speed 300mm/min. Otherwise unless specified. 165°~ 180° Pulling direction Other standards shall be based on JIS C 0806-1990. Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 8 j.) Package Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 9 5. Mechanical Performance Test Methods 1 Natural Drop 2 Vibration 3 Sealing Tightness 4 Solderability Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board. Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak detector. After applying ROSIN Flux, dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. 6. 1 2 3 4 A A --B Environment Performance Item Specifications Code Test Methods Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. -40deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. +85deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. -40deg.C +/-2deg.C (30min) ↔ +85deg.C +/-2deg.C (30min) 25 cycles. Back to the room temperature first, then in 1~2 hours, the component shall be checked. Humidity Storage in Low Temperature Storage in High Temperature Temperature cycles A A A A Specifications code Specifications A Frequency variation shall be within +/-5ppm and equivalent resistance shall be within the specification after the test More than 90% of lead shall be covered by new solder. B Tittle HSX211S Date Specifications Code Item Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 10 7. Supplement 7.1.Soldering 7.2.Please stay with our proposed reflow condition and do then soldering 2 times max. Available for Lead Free Soldering Temperature 260 deg.C 220 deg.C (3) 160~180deg.C (2) (1) Time (1) Preheat 160~180 deg.C 120sec. (2) Primary heat 220 deg.C 60sec. (3) Peak 260 deg.C 10sec. Max. 7.3.Land pattern layout(Example) 7.4.Solder iron (Example) Bit temp.:350℃max.,Time:3sec max. ,Each terminal solder a 1 time max. Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 11 7.5.Mounting This component is designed for automatic insertion. However, you are requested to do the trial with your insertion machine in order to be sure of proper operation and no damage of component. Please pay attention to board warp which may damage the component and cause Soldering Process. 7.6.Cleaning Cleaning liquid which corrodes Nickel shall not be used It may cause the problem on the surface, color, marking etc. Ultra-sonic cleaning is possible, however, you are requested to check on your board. Because we only checked as single unit. 7.7.Storage Please keep away from high temperature and high humidity ,which may cause put solderbility. No direct Sunlight, No dew as well. Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 12 8. Flow Chart LID(外 殼 蓋 ) BLANK(晶 片 ) LID進 料 檢 查 1 Incoming Inspection of LID 2 LID洗 淨 Cleaning of LID BASE(基 座 ) BLANK進 料 檢 查 4 5 6 7 Incoming Inspection of BLANK BASE進 料 檢 查 3 Incoming Inspection of BASE 化學蝕刻 Etching 頻率選別 Freq. Sorting 蒸著前洗淨 Cleaning before Base Plating 8 微蝕刻 9 基 礎 蒸 著 ($) Flash Etching Base Plating 10 押入接著 11 接 著 硬 化 ($) 12 13 Blank Ass'y Adhesive Curing 接 著 檢 查 ($) Bonding Check 調 整 蒸 著 / ION Partial Partial Adjustment/Ion Partial 氣 密 檢 查 II (氦 氣 加 壓 ) 22 14 15 中 間 檢 查 ($) Leak Check II (Helium Pressurization) Middle Check 23 高真空烘烤 Annealing in High Vacuum 24 氣 密 檢 查 II (HE) ($) Leak Check II 最 終 檢 查 ($) Final Check 16 熔 接 Seam Seal 17 強 勵 振 Over Drive 25 TAPING 18 REFLOW 26 Taping 外 觀 檢 查 Check of Taping 19 老 化 Aging 27 20 Outgoing Inspection 印 字 +外 觀 檢 查 Marking & Check 28 21 出貨檢查 氣 密 檢 查 I (AIR) ($) 出貨捆包 Packing to Shipment/stock Leak Check I 出 貨 Shipment ($)： 特 殊 特 性 (For Special Characteristics) Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 13 REV. DATE REASON No. 0 2011/10/12 New CONTENTS Tittle HSX211S Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2011/10/12 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2C027120FA1H-HV ELECTRONICS CORP. 0 14