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PB2012-000/4A0(f)

PB2012-000/4A0(f)

  • 厂商:

    ZHENHUAFU(振华富)

  • 封装:

    SMD,2x1.25mm

  • 描述:

    共模电感 1Ω~10Ω SMD,2x1.25mm 4A

  • 数据手册
  • 价格&库存
PB2012-000/4A0(f) 数据手册
深圳振华富电子有限公司 Shenzhen Zhenhuafu Electronics Co., Ltd. 规 格 承 认 书 SPECIFICATION FOR APPROVAL 客户名称 Customer 客户料号 Customer P/N 型号规格 Product Type PB2012-000/4A0(f) 拟 制 Prepared By 王 楠 审 核 Checked By 明剑华 批 准 Approved By 王裕凡 签发日期 Issued Date 2024-04-18 我们已确认承认书中的产品特性和要求 We have confirmed the product features and requirements in this specification. 客户确认 Customer Approved Signature 请认真阅读承认书的相关内容,将确认签名后承认书回传给我们。 Please read the relevant contents of this specification carefully and return one duplicate of this product specification to us with your signature to acknowledge your receipt. 如果在收到承认书后 1 个月内没有回传承认书,则视为贵公司已默认接受。 If the duplicate of this specification is not returned within 1 month of receipt, the product specification will be deemed to have been received by your company. 最终解决权归深圳振华富电子有限公司所有。 The final interpretation right belongs to Shenzhen Zhenhuafu Electronics Co., Ltd. 总部地址:深圳市龙华区龙华街道和平路振华工业园 HQ ADD: ZhenHua Prodction Center, RD Heping, Longhua District, ShenZhen 电话(TEL):(+86 0755) 28159282 28159885 传真(FAX):(+86 0755) 28159885 邮编(ZIP):518109 生产基地:东莞市虎门镇赤岗社区中国电子东莞产业基地 Manufacturing Base: CEC Dongguan Industrial Base, Chigang Community, Humen Town, DG 电话(TEL):(+86 0769) 85226668 传真(FAX):(+86 0755) 85225678 邮编(ZIP):523899 深圳振华富电子有限公司 Shenzhen Zhenhuafu Electronics Co., Ltd. 更改记录 REVISED RECORD 日期 更改内容 备注 Date Revision Remarks 深圳振华富电子有限公司 Shenzhen Zhenhuafu Electronics Co., Ltd. PB2012 Series Specification 1 Scope: This specification applies to the LPB series of multilayer chip beads 2 Shape And Dimensioncs 3 TYPE L W T a PB2012 2.0±0.2 1.25±0.2 0.85±0.2 0.4±0.2 Part Numbering ① ② ③ ④ PB 2012 - 000 / 4A0 (f) ① ② ③ ④ ⑤ Product symbol 系列代号 Dimensions 尺寸: Length 长(L)×Width 宽(W) Impedance 阻抗: 000:1~10Ω Rated Current 额定电流:4A0:4000mA ⑤ Hazardous Substance Free Products 无有害物质产品 4 Electrical Characteristics Part Numbering PB2012-000/4A0(f) 5 Z(Ω) 100MHz DCR(mΩ) Max. Rated Current (mA) 15 4000 1~10Ω Operating Temperature Operating Temperature(工作温度):–55℃~+125℃ 深圳振华富电子有限公司 Shenzhen Zhenhuafu Electronics Co., Ltd. PB2012 Series Specification 6 Electrical Characteristics 7 Test Conditions and Test Equipment 7.1Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86kPa to 106kPa 7.2Test Equipment  HP4287A PACKED RF LCR METER □ HP4338B MILLIOHM METER □ B2911A PRECISION SOURCE 8 □ E4991A RF IMPEDANCE ANALYZER Recommended land pattern and Recommended soldering condition 深圳振华富电子有限公司 Shenzhen Zhenhuafu Electronics Co., Ltd. Specification 9 Reliability and Conditions ITEM 项 目 Resistance to solder heat 耐焊性 REOUIREMIENTS 要 求 TEST CONDITIOS 测试条件 1. No visible mechanical damage. 无可见机械损伤 2.More than 75% of the terminal shall be covered with new solder. 至少有 75%的端电极被焊锡覆盖. 3.Impedance change:within±30%;Inductance change: within ±10%; Quality factor change :within ±30%. 阻抗变化应在±30%以内;电感变化在±10%以内;Q 值变化在± 30%以内。 ①Solder temperature(焊接温度): 260±3℃ ②Dip time (浸焊时间):10±1s ③Solder(焊料):Sn93.5/Ag3.0/Cu0.5 ④ Flux( 助焊剂 ): 25% Rosin and 75% ethanol in weight. ⑤The chip shall be stabilized at normal condition for 1~2 hours before measuring. ①Solder temperature (焊接温度): 245±2℃ ②Dip time (浸焊时间):4±1s ③Solder(焊料):Sn93.5/Ag3.0/Cu0.5 ④Flux(助焊剂): 25% Rosin and 75% ethanol in weight. 1. No visible mechanical damage 无可见机械损伤 Solderability 2.More than 95% of the terminal shall be covered with new solder. 可焊性 至少有 95%的端电极被焊锡覆盖. Terminal Strength 端电极强度 No visible mechanical damage. 无可见机械损伤 1005 1608 2012 3216 3225 4516 4532 w(N) 5 5 10 10 10 10 10 A(mm) 0.50 0.60 0.8 1.1 1.1 1.3 1.3 B(mm) 0.35 0.80 1.0 2.2 2.2 3.0 3.0 C(mm) 0.80 1.2 1.5 2.0 3.0 2.0 3.5 1 Solder the inductor to the test jig(glass epoxy board). Bending strength 抗弯强度 Drop 跌落 Vibration 振动 The body shall not be damaged by forces applied on the right 以右图测试方式过程中器件无损伤 1. No visible mechanical damage. 无可见机械损伤。 2. Impedance change: within ±20% of initial value;Inductance change: within ±10% of initial value; Q : within ±30% of initial value. 阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化在± 30%以内。 1. No visible mechanical damage. 无可见机械损伤 2. Impedance change: within ±20% of initial value; Inductance change: within ±10% of initial value; Q : within ±30% of initial value. 阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化在± 30%以内。 2 Flexure:2mm. 3 Pressurizing speed:0.5mm/sec. 4 Keep time:30sec. Drop 10 times on a concrets floor from a height of 100cm. 从 100cm 高度跌落到混凝土地面上 10 次 ①Frequency (频率):10Hz-55Hz. ②Amplitude (振幅):1.5mm ③ Direction and time: X,Y and Z directions for 2 hours. 方向和时间:XYZ 三个方向各振动 2 小时 深圳振华富电子有限公司 Shenzhen Zhenhuafu Electronics Co., Ltd. Specification 9 Reliability and Conditions Thermal shock 热冲击 1. No visible mechanical damage. 无可见机械损伤 2.Impedance change: within ±20% of initial value; Inductance change: within ±10% of initial value; Q : within ±30% of initial value. 阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化 在±30%以内。 Resistance to Low Temperature 耐低温 1. No visible mechanical damage. 无可见机械损伤 2. Impedance change: within ±20% of initial value; Inductance change: within ±10% of initial value; Q : within ±30% of initial value. 阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化 在±30%以内。 Resistance to High Temperature 耐高温 1. No visible mechanical damage. 无可见机械损伤 2. Impedance change: within ±20% of initial value; Inductance change: within ±10% of initial value; Q : within ±30% of initial value. 阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化 在±30%以内。 Loading at High Temperature 高温寿命 1. No visible mechanical damage. 无可见机械损伤 2. Impedance change: within ±20% of initial value; Inductance change: within ±10% of initial value; Q : within ±30% of initial value. 阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化 在±30%以内。 Humidity load resistance 耐潮湿 1. No visible mechanical damage. 无可见机械损伤 2. Impedance change: within ±20% of initial value; Inductance change: within ±10% of initial value; Q : within ±30% of initial value. 阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化 在±30%以内。 Solevnt resistance 耐溶剂性 1. No visible mechanical damage. 无可见机械损伤 2. Impedance change: within ±20% of initial value; Inductance change: within ±10% of initial value; Q:within ±30% of initial value. 阻抗变化应在±20%以内;电感变化在±10%以内;Q 值变化 在±30%以内。 Step 1 ( 循 环 1):-55±3 ℃ 30±3 min Step 2( 循 环 2):125±3 ℃ 30±3 min Number of cycle( 循环次数 ):100 times Temperature:-55℃±2℃; Duration: 1000+24 hours. Measured at room temperature after placing for (24±2) hours. 通过额定电流,-55℃±2℃下保 持 1000+24 小时,试验结束后在 室 温 条 件 下 (24 ± 2) 小 时 后 测 量。 ①Temperature:125℃±2℃; ②Duration: 1000+24 hours. ③ Measured at room temperature after placing for (24±2) hours. 125 ℃± 2 ℃下保持 1000+24 小 时,试验结束后在室温条件下 (24±2)小时后测量。 ①Temperature:85℃±2℃; ②Applied current :Rated current; ③Duration: 1000+24 hours. ④ Measured at room temperature after placing for (24±2) hours. 85℃±2℃下施加额定电流,保 持 1000+24 小时,试验结束后在 室 温 条 件 下 (24 ± 2) 小 时 后 测 量。 Temperature:40 ℃ ± 2℃,Time:90~90%RH; Applied current; Rated current time:500 hours. Measured at room temperature after placing for (24±2) hours. 40℃±2℃,90~95%RH 条件下施 加额定电流,保持 500 小时,试 验结束后在室温条件下 (24 ± 2) 小时后测量。 Solvent:Trichlorethylene 溶剂:三氯乙烯 Washer:Ultrasonic washer(100w) Washing time:3 mintues 清洗:100W 超声波清洗 3 分钟 深圳振华富电子有限公司 Shenzhen Zhenhuafu Electronics Co., Ltd. 10 Packaging Style 10.1 Taping Material 包装材料 10.2 Reel Dimensions 卷轴尺寸 (mm) Tape Width A B C D E W T R 8mm 178±2 60±1 13±0.5 21±0.8 2±0.5 10±1 1.5±0.5 1 12mm 178±2 60±1 13±0.5 21±0.8 2±0.5 14±1 1.5±0.5 1 载带宽度 10.3 Carrier Dimensions 载带尺寸(mm) Paper Tape 纸带 Paper Tape 纸带 Type A B P T 1005 0.62±0.03 1.12±0.03 2.0±0.05 0.61±0.02 1608 1.0±0.1 1.6±0.03 4.0±0.1 0.95±0.10 2012 1.5±0.1 2.3±0.1 4.0±0.1 0.95±0.10 3216 1.9±0.1 3.6±0.1 4.0±0.1 0.95±0.10 Embossed Tape 胶带 Embossed Tape 胶带 Type A B C D P K 1608 1.08±0.1 1.88±0.1 8±0.3 3.5±0.05 4.0±0.1 1.05±0.1 2012 1.50±0.1 2.32±0.1 8±0.3 3.5±0.05 4.0±0.1 1.20±0.1 3216 1.88±0.1 3.5±0.1 8±0.3 3.5±0.05 4.0±0.1 1.27±0.1 3225 3.1±0.1 3.8±0.1 12±0.3 5.5±0.05 4.0±0.1 1.63±0.1 4516 2.2±0.1 4.95±0.1 12±0.3 5.5±0.05 4.0±0.1 1.95±0.1 4532 3.8±0.1 4.95±0.1 12±0.3 5.5±0.05 8.0±0.1 1.90±0.1 10.4 Stripping methods and criteria 剥离方法及条件 Peeling angle 剥离角度 160°~180° Speed of Peeling off 剥离速率 300 mm/min Peeling off force 剥离力 20 g to 70 g 深圳振华富电子有限公司 Shenzhen Zhenhuafu Electronics Co., Ltd. Specification 11 Storage 11.1 Quantilty 标准数量 PCS/REEL(只/ PCS/INNERBOX(只/小 PCS/OUTNERBOX(只/大 卷) 盒) 盒) 1005 10000 50000 250000 1608 4000 20000 100000 2012 4000 20000 100000 3216 4000 20000 100000 Type 11.2 Packaging Dimensions 包装尺寸(mm) L W H THICK 厚度 L W H THICK 厚度 180±3 70±3 190±3 2±0.8 180±3 70±3 190±3 2±0.8 11.3 Indication on the box 包装标识 a. CUSORMER 客户名 b. QUANTITY 数量 c. PART NUMBER 料号 d. LOT NUMBER 批号 11.4 Storage 储存 Please be sure to the parts at -10℃~+40℃,70%RH or less,and isolate the parts from sulphic and choric atmosphere. 产品应存放于环境温度-10℃~+40℃,相对湿度不高于 70%,且不含硫和氯的空气气氛中。
PB2012-000/4A0(f) 价格&库存

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PB2012-000/4A0(f)
  •  国内价格
  • 50+0.04049
  • 500+0.03644
  • 5000+0.03374
  • 10000+0.03240
  • 30000+0.03105
  • 50000+0.03024

库存:0