LSGE06R046HWB
Lonten N-channel 60V, 104A, 4.6mΩ Power MOSFET
Description
Product Summary
These N-Channel enhancement mode power field
VDSS
60V
effect transistors are using split gate trench DMOS RDS(on),max@ VGS=10V
4.6mΩ
technology. This advanced technology has been
104A
ID
especially tailored to minimize on-state resistance,
provide superior switching performance, and with
stand high energy pulse in the avalanche and
Pin Configuration
commutation mode. These devices are well suited
for high efficiency fast switching applications.
Features
60V,104A, RDS(on),max =4.6mΩ@VGS = 10V
Improved dv/dt capability
Fast switching
100% EAS Guaranteed
Green device available
TO-263
D
Applications
G
Motor Drives
UPS
DC-DC Converter
Pb
S
N-Channel MOSFET
Absolute Maximum Ratings
TC = 25°C unless otherwise noted
Parameter
Symbol
Value
Unit
60
V
104
A
65
A
IDM
312
A
Gate-Source voltage
VGSS
±20
V
Avalanche energy2)
EAS
28
mJ
Power Dissipation
PD
89
W
Storage Temperature Range
TSTG
-55 to +150
°C
Operating Junction Temperature Range
TJ
-55 to +150
°C
Value
Unit
Drain-Source Voltage
Continuous drain current
VDSS
( TC = 25°C )
ID
( TC = 100°C )
Pulsed drain current
1)
Thermal Characteristics
Parameter
Symbol
Thermal Resistance, Junction-to-Case
RθJC
1.4
°C/W
Thermal Resistance Junction-to-Ambient
RθJA
55
°C/W
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LSGE06R046HWB
Package Marking and Ordering Information
Device
Device Package
Marking
Units/Reel
LSGE06R046HWB
TO-263
E06R046HWB
800
Electrical Characteristics
Parameter
TJ = 25°C unless otherwise noted
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Static characteristics
Drain-source breakdown voltage
BVDSS
VGS=0 V, ID=250uA
60
---
---
V
Gate threshold voltage
VGS(th)
VDS=VGS, ID=250uA
2.0
3.0
4.0
V
Drain-source leakage current
IDSS
VDS=60 V, VGS=0V
---
---
1
μA
Gate leakage current, Forward
IGSSF
VGS=20 V, VDS=0 V
---
---
100
nA
Gate leakage current, Reverse
IGSSR
VGS=-20 V, VDS=0 V
---
---
-100
nA
Drain-source on-state resistance
RDS(on)
VGS=10 V, ID=20 A
---
3.6
4.6
mΩ
Forward transconductance
gfs
VDS =5V , ID=20A
---
66
---
S
---
3511
---
---
1176
---
---
67
---
---
20.3
---
Dynamic characteristics
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Turn-on delay time
td(on)
Rise time
tr
VDD = 30V,VGS=10V, ID = 20A
---
9.6
---
Turn-off delay time
td(off)
RG=3Ω
---
61
---
Fall time
tf
---
15.2
---
Gate resistance
Rg
---
1.1
---
---
15.5
---
---
9.5
---
---
48
---
VDS = 30 V, VGS = 0 V,
F = 1MHz
VGS=0 V,VDS=0 V, F=1MHz
pF
ns
Ω
Gate charge characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
VDS=30V, ID=20A,
VGS= 10 V
nC
Drain-Source diode characteristics and Maximum Ratings
Continuous Source Current
IS
---
---
74
A
Pulsed Source Current3)
ISM
---
---
222
A
Diode Forward Voltage
VSD
---
---
1.2
V
Reverse recovery time
trr
---
24
---
ns
Reverse recovery charge
Qrr
---
85
---
nC
VGS=0V, IS=20A, TJ=25℃
IF=20A,dIF/dt=100 A/μs
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature.
2: VDD=50V, VGS=10V, L=0.1mH, IAS=24A, Starting TJ=25℃.
3: Pulse Test:Pulse Width ≤300μs, Duty Cycle≤2%.
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Electrical Characteristics Diagrams
Figure 1. Typ. Output Characteristics
Figure 2. Transfer Characteristics
T=125°C
T=25°C
Gate−source voltage VGS (V)
Figure 3. Capacitance Characteristics
Figure 4. Gate Charge Waveform
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Figure 5. Body-Diode Characteristics
Figure 6. Rdson-Drain Current
VGS = 10V
Drain Current ID (A)
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Figure 7. Rdson-Junction Temperature
Figure 8. VGS(th)-Junction Temperature
Figure 9. On-Resistance vs. Gate-to-Source voltage
Figure 11. Normalized Maximum Transient Thermal Impedance (RthJC)
Transient Thermal Resistance
ZJC(normalized)
1
0.7
0.5
0.3
0.1
R
θJC
= 1.4 ℃/W
0.1
0.05
0.01
0.02
0.01
single pulse
1E-3
PD
Ton
1E-4
1E-6
1E-5
1E-4
1E-3
0.01
T
0.1
t,Time (s)
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Test Circuit & Waveform
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Mechanical Dimensions for TO-263
DIMENSIONS IN MILLITMETERS
DIMENSIONS IN INCHES
SYMBOL
MIN
MAX
MIN
MAX
A
4.36
4.8
0.172
0.189
A1
1.19
1.42
0.047
0.056
A2
2.2
2.96
0.087
0.117
A3
0
0.25
0
0.010
b
0.7
0.96
0.028
0.038
b1
1.17
1.47
0.046
0.058
c
0.3
0.69
0.012
0.027
D1
8.5
9.5
0.335
0.374
D4
6.6
-
0.260
-
E
9.8
10.55
0.386
0.415
E5
7.06
8.7
0.278
0.343
e
2.54BSC
0.1BSC
H
14.7
15.7
0.579
0.618
H2
0.95
1.65
0.037
0.065
L
1.9
2.8
0.075
0.110
L1
-
1.78
-
0.070
L4
θ
Version 1.0,Sep-2020
0.25BSC
0°
9°
0.01BSC
0°
9°
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LSGE06R046HWB
Disclaimer
The content specified herein is for the purpose of introducing LONTEN's products (hereinafter "Products").
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into
account when designing circuits for mass production.
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rights of third parties by or arising from the use of the Products or technical information described in this
document.
The Products are not designed or manufactured to be used with any equipment, device or system which
requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to
human life or create a risk of human injury (such as a medical instrument, transportation equipment,
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responsibility in any way for use of any of the Products for the above special purposes.
Although LONTEN endeavors to improve the quality and reliability of its products, semiconductor products
have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain
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