BL-R8723BT1

BL-R8723BT1 802.11n 150Mbps USB WiFi and BT Combo Module Specification SHENZHEN BILIAN ELECTRONIC CO., LTD Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China Web: www.b-link.net.cn Module Name: BL-R8723BT1 Module Type: 802.11b/g/n 150Mbps 1T1R USB WiFi and BT combo Module Revision: V1.1 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision 1 Summary Release Date 1.0 Official release 2020-06-28 1.1 Optimal description 2021-09-28 http://www.b-link.net.cn 1. Introduction BL-R8723BT1 is a highly integrated single-chip 802.11n Wireless LAN (WLAN) USB 2.0 Multi-Function network interface controller with integrated Bluetooth 2.1/3.0/4.0 controller. It combines a WLAN MAC, a 1T1R capable WLAN baseband, and RF in s single chip. The RTL8723BU provides a complete solution for a high-performance integrated wireless and Bluetooth device. The integration provides better coordination between 802.11 and Bluetooth, and with sophisticated dynamic power control and packet traffic arbitration, RTL8723BU is able to provide the best coexistence performance Overview. 1.1 Features  Operating Frequencies: 2.4~2.4835GHz  Host Interface is USB 2.0  IEEE Standards: IEEE 802.11b/g/n  BT2.1+EDR/BT3.0 and BT LE4.0  Wireless data rate can reach up to 150Mbps  Connect to external antenna through half hole pad  Power Supply: 3.3±0.2V main power and VDIO power supply 1.2 Block Diagram 2 http://www.b-link.net.cn 1.3 General Specifications Module Name BL-R8723BT1 WiFi and BT combo Module Chipset RTL8723BU-CG WiFi Standards IEEE802.11b/g/n, 1T1R, 2.4GHz, 150Mbps (Max) BT Standards V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0 Host Interface USB 2.0 Antenna Connect to the external antennas through half hole pad Dimension SMD 14Pins, 12.2*13.4*1.6mm (L*W*H) Power Supply DC 3.3±0.2V (TX mode) @ 300 mA (Max) Operation Temperature -10℃ to +70℃ Operation Humidity 10% to 95% RH (Non-Condensing) 2. Pin Assignments Top view 2.1 Pin Definition No Pin Name Type Description 1 GND P Ground connections 2 RF0 RF WLAN and BT RF port 3 NC NC NC 3 Supply http://www.b-link.net.cn 4 SUS CLK P External 32K or RTC clock input. This pin 5 GND P Ground connections 6 USB_DP I/O USB Transmitter/Receiver Differential Pair 7 USB_DM I/O USB Transmitter/Receiver Differential Pair 8 VDD33 P VDD 3.3V Power Supply 9 CHIP WAKE HOST O Chip Wakeup host pin 10 HOST WAKE CHIP I Host Wakeup Chip pin 11 PCM CLK I/O PCM Clock This pin 12 PCM SYNC I/O PCM frame Synchronization 13 PCM OUT O PCM data Output. This pin 14 PCM IN I PCM data Input. This pin P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port 3. Electrical and Thermal Specifications 3.1 Recommended Operating Conditions Parameters Min Typ Max Units Ambient Operating Temperature -10 25 70 ℃ External Antenna VSWR 1 1.92 2.5 / 3.1 3.3 3.5 V Supply Voltage VDD33 3.2 Current Consumption Conditions : VDD33=3.3V ; Ta:25℃ VDD33 Current (average) Use Case Typ Max Units WiFi Radio Off (Linux Driver) 42 50 mA WiFi Unassociated (Linux Driver) 40 60 mA 2.4G 1Mbps TX (RF-Test) 225 255 mA 2.4G 1Mbps RX (RF-Test) 134 135 mA 2.4G 11Mbps TX (RF-Test) 230 246 mA 4 http://www.b-link.net.cn 2.4G 11Mbps RX (RF-Test) 130 132 mA 2.4G 6Mbps TX (RF-Test) 220 285 mA 2.4G 6Mbps RX (RF-Test) 133 134 mA 2.4G 54Mbps TX (RF-Test) 210 290 mA 2.4G 54Mbps RX (RF-Test) 133 135 mA 2.4G MCS0(HT20) TX (RF-Test) 255 272 mA 2.4G MCS0(HT20) RX (RF-Test) 132 135 mA 2.4G MCS7(HT20) TX (RF-Test) 185 285 mA 2.4G MCS7(HT20) RX (RF-Test) 133 134 mA 2.4G MCS7(HT40) TX (RF-Test) 201 278 mA 2.4G MCS7(HT40) RX (RF-Test) 133 135 mA BT BR_1M DH5 TX(RF-Test) 125 152 mA BT EDR_3M DH5 TX(RF-Test) 119 147 mA BT LE_1M TX(RF-Test) 122 161 mA BT BR_1M DH5 RX Active(RF-Test) 103 127 mA BT EDR_3M DH5 RX Active(RF-Test) 102 130 mA BT LE_1M RX Active(RF-Test) 110 133 mA 5 http://www.b-link.net.cn 4. Interface Functional and Timing Specifications 4.1 USB Power On Sequence 5. WiFi RF Specifications 5.1 2.4G WiFi RF Specification Conditions : VDD33=3.3V ; Ta:25℃ Features Description WLAN Standard IEEE 802.11b/g/n CSMA/CA Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Channels Ch1~Ch13 (For 20MHz Channels) 802.11b (DSSS): DBPSK, DQPSK, CCK; Modulation 802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11b: 1, 2, 5.5, 11Mbps; Date Rate 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps; Frequency Tolerance ≦ ±25ppm 2.4G Transmitter Specifications TX Rate TX Power TX Power Tolerance EVM 802.11b@1~11Mbps 17dBm ±1.5dBm ≦-10dB 802.11g@6Mbps 17dBm ±1.5dBm ≦-10dB 802.11g@54Mbps 15dBm ±1.5dBm ≦-28dB 802.11n@HT20_MCS0 16dBm ±1.5dBm ≦-10dB 802.11n@HT20_MCS7 14dBm ±1.5dBm ≦-28dB 802.11n@HT40_MCS0 16dBm ±1.5dBm ≦-10dB 802.11n@HT40_MCS7 14dBm ±1.5dBm ≦-28dB 6 http://www.b-link.net.cn 2.4G Receiver Specifications RX Rate Min Input Level(Typ) Max Input Level(Typ) PER 802.11b@1Mbps -93dBm -10dBm < 8% 802.11b@11Mbps -86dBm -10dBm < 8% 802.11g@6Mbps -90dBm -15dBm < 10% 802.11g@54Mbps -70dBm -15dBm < 10% 802.11n@HT20_MCS0 -88dBm -15dBm < 10% 802.11n@HT20_MCS7 -65dBm -15dBm < 10% 802.11n@HT40_MCS0 -86dBm -15dBm < 10% 802.11n@HT40_MCS7 -65dBm -15dBm < 10% 5.2 Bluetooth RF Specifications Conditions : VDD33=3.3V ; Ta:25℃ Features Bluetooth Specification Frequency Range Channels Power Classes Description Bluetooth v2.1+EDR/3.0+HS (Bluetooth Classic _ BT BR/EDR), Bluetooth 4.0 (Bluetooth Low Energy _ BT_LE) FHSS 2.4~2.4835GHz (2.4GHz ISM Band) Bluetooth Classic: Ch0~Ch78 (For 1MHz Channels); Bluetooth Low Energy: Ch0~Ch39 (For 2MHz Channels); Bluetooth Classic: Class1; Bluetooth Low Energy: Class1.5; BR_1Mbps: GFSK; Date Rate & Modulation EDR_2Mbps: π/4-DQPSK; EDR_3Mbps: 8DPSK; LE_1Mbps: GFSK; Bluetooth Transmitter Specifications Items Min Typ Max BR_1M TX Power 1 6 8 EDR_2/3M TX Power 1 6 8 LE_125K~1M TX Power 1 6 8 1DH1 TX Power 1 6 8 TX Power 7 http://www.b-link.net.cn 2DH3 TX Power 1 6 8 3DH5 TX Power 1 6 8 145kHz 163kHz -- 143kHz 146kHz -- 1.01 0.12 -- RMS DEVM (EDR_2M) -- 10% 20% 99% DEVM (EDR_2M) -- 13% 30% Peak DEVM (EDR_2M) -- 17% 35% RMS DEVM (EDR_3M) -- 9% 13% 99% DEVM (EDR_3M) -- 11% 20% Peak DEVM (EDR_3M) -- 14% 25% 207kHz 210kHz -- 195kHz 194kHz -- 1.06 1.08 -- BR_1M Modulation Characteristics Δf1avg Δf2max [For at least 99.9% of all Δf2max] Δf1avg / Δf2max EDR Modulation Accuracy LE_Modulation characteristics Δf1avg (LE_1M) Δf2max[For at least 99.9% of all Δf2max] (LE_1M) Δf1avg / Δf2max(LE_1M) Bluetooth Receiver Specifications Items Sensitivity Maximum Input Level Input Level(Typ) BER Input Level(Typ) BER BR_1M -92dBm ≦0.1% -20dBm ≦0.1% EDR_2M -90dBm ≦0.01% -20dBm ≦0.1% EDR_3M -86dBm ≦0.01% -20dBm ≦0.1% LE_1M -92dBm ≦30.8% -20dBm ≦0.1% 1DH1 -92dBm ≦30.8% -20dBm ≦0.1% 2DH3 -90dBm ≦30.8% -20dBm ≦0.1% 3DH5 -86dBm ≦30.8% -20dBm ≦0.1% 8 http://www.b-link.net.cn 6. Mechanical Specifications 6.1 Module Outline Drawing Module dimension: 13.4*12.2*1.6mm (L*W*H; Tolerance: ±0.15mm) Module Bow and Twist：≤0.1mm 9 http://www.b-link.net.cn 6.2 Mechanical Dimensions 7. Application Information 7.1 Typical Application Circuit 10 http://www.b-link.net.cn 7.2 Recommend PCB Layout Footprint 7.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 11 http://www.b-link.net.cn 8. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset RTL8723BU-CG Realtek Note Shen Zhen Tie Fa Technology limited 2 PCB BL-R8723BT1 Guangdong KINGSHINE ELECTRONICS CO., LTD Quzhou Sunlord Electronics Co., Ltd HARMONY ELECTRONICS CORP. LUCKI CM ELECTRONICS CO., LTD 3 Crystal 40MHz-15pF-10ppm-2520 HOSONIC ELECTRONIC CO., LTD. SHENZHEN KAIYUEXIANG ELECTRONICS CO., LTD 9. Package and Storage Information 9.1 Package Dimensions 12 http://www.b-link.net.cn Package specification: 1. 2,000 modules per roll and 10,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 25.3mm (with a width of 21.3mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 5 boxes. 9.2 Storage Conditions Absolute Maximum Ratings: Storage temperature: -45℃ to +85℃ Storage humidity: 10% to 95% RH（Non-Condensing） Recommended Storage Conditions: Storage temperature: 5℃ to +40℃ Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours. When the color of the humidity indicator in the packing changed, the Module shall be baked before soldering. Baking condition: 60℃, 24hours, 1time. ESD Sensitivity： The Module is a static-sensitive electronic device. Do not operate or store near strong electrostatic fields. Take proper ESD precautions! 13 http://www.b-link.net.cn