SFM3011T
110A, 30V N-CHANNEL POWER MOSFET
GENERAL DESCRIPTION
The SFM3011T uses advanced trench technology and design to
provide excellent RDS(pn) with low gate charge.
It can be used in a wide variety applications.
Features
◆VDS=30V,ID=110A
◆RDS(on)
TYP:3.9mΩ@VGS=10V ID=20A
Applications
◆Power faction correction (PFC)
◆Switched mode power supplies (SMPS)
◆Uninterruptible power supply (UPS)
◆LED lighting power
ORDERING INFORMATION
Part No.
Package
Marking
Material
Packing
SFM3011T
PDFN-5*6-8L
SFM3011T
Pb Free
Reel
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Rev 1.1
Page 1 of 8
SFM3011T
ABSOLUTE MAXIMUM RATINGS (TJ=25C unless otherwise noted)
Characteristics
Symbol
Ratings
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
±20
V
TC = 25C
Drain Current
110
ID
TC = 100C
Drain Current Pulsed(Note 1)
A
75
IDM
440
A
PD
90
W
EAS
392
mJ
Operation Junction Temperature Range
TJ
-55~+150
C
Storage Temperature Range
Tstg
-55~+150
C
TL
300
℃
Symbol
MAX
Unit
Thermal Resistance, Junction-to-Case
RθJC
2.6
Thermal Resistance, Junction-to-Ambient
RθJA
62.5
Power Dissipation(TC=25C)
-Derate above 25C
Single Pulsed Avalanche Energy (Note 2)
Maximum lead temperature for soldering
purposes,1/8" from case for 5 seconds
THERMAL CHARACTERISTICS
Characteristics
C/W
ELECTRICAL CHARACTERISTICS
Characteristics
Symbol
Test conditions
Min.
Typ.
Max.
Unit
BVDSS
VGS=0V, ID=250µA
30
--
--
V
Drain-Source Leakage Current
IDSS
VDS=30V, VGS=0V
--
--
1
uA
Gate-Source Leakage Current
IGSS
VGS=20V, VDS=0V
--
--
100
Gate-Source Leakage Current
IGSS
VGS=-20V, VDS=0V
--
--
-100
VGS(th)
VGS= VDS, ID=250µA
1.0
1.7
2.5
VGS=4.5V, ID=20A
--
5.2
7.5
VGS=10V, ID=20A
--
3.9
5.0
Off Characteristics
Drain -Source Breakdown Voltage
nA
On Characteristics
Gate Threshold Voltage
Static Drain- Source On State
Resistance
RDS(on)
V
m
Dynamic Characteristics
Gate Resistance
Rg
VGS=0V, f=1.0MHZ
1
2.7
10
Input Capacitance
Ciss
VDS=25V
--
2010
--
Output Capacitance
Coss
VGS=0V
--
241
--
Crss
f=1.0MHZ
--
214
--
--
10.6
--
--
73.2
--
--
121
--
--
56
--
Reverse Transfer Capacitance
pF
Switching Characteristics
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
Turn-off Delay Time
td(off)
Turn-off Fall Time
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tf
VDD=15V
RG=3.3, ID=30A
(Note 3.4)
Rev 1.1
ns
Page 2 of 8
SFM3011T
Total Gate Charge
Qg
VDS=15V, ID=30A
--
45
--
Gate-Source Charge
Qgs
VGS=5V
--
8.6
--
Gate-Drain Charge
Qgd
--
9.5
--
(Note 3.4)
nc
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristics
Continuous Source Current
Symbol
IS
Test conditions
Min.
Typ.
Max.
Integral Reverse P-N
--
--
110
--
--
440
Junction Diode in the
Unit
A
Pulsed Source Current
ISM
Diode Forward Voltage
VSD
IS=20A,VGS=0V
--
0.8
1.2
V
Reverse Recovery Time
Trr
IF=10A,VR=15V,
--
146
--
ns
Reverse Recovery Charge
Qrr
dIF/dt=100A/µS
--
7.6
--
µC
MOSFET
1.Pluse width limited by maximum junction temperature
2.L=1mH,VDD=15V, VG=10V, RG=25, starting TJ=25C
3.Pulse Test: Pulse width ≤300μs, Duty cycle≤2%
4.Essentially independent of operating temperature
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Rev 1.1
Page 3 of 8
SFM3011T
Typical Performance Characteristics
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Rev 1.1
Page 4 of 8
SFM3011T
Typical Performance Characteristics
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Rev 1.1
Page 5 of 8
SFM3011T
Test Circuit
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Rev 1.1
Page 6 of 8
SFM3011T
Package Dimensions of PDFN5*6-8L
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Rev 1.1
Page 7 of 8
SFM3011T
Disclaimer:
► Hi-semicon reserves the right to make changes to the information herein for the improvement of the design
and performance without further notice! Customers should obtain the latest relevant information before placing
orders and should verify that such information is complete and current.
► All semiconductor products malfunction or fail with some probability under special conditions. When using Hisemicon products in system design or complete machine manufacturing, it is the responsibility of the buyer to
comply with the safety standards strictly and take essential measures to avoid situations in which a malfunction
or failure of such Hi-semicon products could cause loss of body injury or damage to property.
► Hi-semicon will supply the best possible product for customers!
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Rev 1.1
Page 8 of 8
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