SDCL0603Q5N1HT02B01

Sunlord Specifications for Multi-layer Chip Ceramic Inductors Page 1 of 9 SPECIFICATIONS Customer Product Name Multi-layer Chip Ceramic Inductors Sunlord Part Number SDCL0603Q-02B01 Series Customer Part Number [ New Released, Revised] SPEC No.:SDCL03130000 Rev. Effective Date Changed Contents Change reasons Approved By 01 / New release / Hai Guo 【This SPEC is total 9 pages including specifications and appendix. 】 【RoHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China 518110 Tel: 0086-755-82400574 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Date: Restricted Rejected Re-checked By Checked By Sunlord 1. Specifications for Multi-layer Chip Ceramic Inductors Page 2 of 9 Scope This specification applies to SDCL0603Q-02B01 series of multi-layer ceramic chip inductors. 2. Product Description and Identification (Part Number) 1) Description SDCL0603Q-02B01 series of multi-layer ceramic chip inductors. 2) Product Identification (Part Number) SDCL 0603 Q XXX □ ◎ 02 B01 ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ Type ① SDCL 0603 [0201] Applications and Characteristics Code ③ Q Inductance Tolerance B、C、S ±0.1、±0.2、±0.3nH G、H、J ±2%、±3%、±5% Nominal Inductance Example Nominal Value 3N9 3.9nH 10N 10nH Packing ⑥ Serial Code ⑦ 0.6 X 0.3 ④ High Q type ⑤ External Dimensions (L X W) (mm) ② Ceramic Chip Inductor T 02 Tape Carrier Package Internal Code ⑧ B01 3. Electrical Characteristics Please refer to Appendix A (Page 8-9). 4. 1) Operating and storage temperature range (individual chip without packing): -55℃~ +125℃, 2) Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.) Shape and Dimensions 1) Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1, Fig.4-2 and Table 4-1. 2) Structure: See Fig. 4-3 and Fig. 4-4. Mark Solder-resist Chip inductor C Land pattern B A B Fig. 4-2 Fig. 4-1 Unit: mm [inch] [Table 4-1] Type L W T a 0603 0.6±0.05 0.3±0.05 0.3±0.05 0.12±0.05 [0201] [.024±.002] [.012±.002] [.012±.002] [.005±.002] W ④-2 ② ③ Fig. 4-3 ④ 0.2~0.3 0.25~0.35 0.25~0.35 ① Ceramic for SDCL Series Ceramic Sn ① C ② Internal electrode (Ag) T a B Structure of Electro-plating T L a A ③ Pull out electrode( Ag) ④-1 Terminal electrode: Inside (Ag) Ni ④-2 Outside (Electro-plating Ni-Sn) ④-1 Ag Fig. 4-4 Sunlord 3) Specifications for Multi-layer Chip Ceramic Inductors Page 3 of 9 Material Information: See Table 4-2 [Table 4-2] Code Part Name Material Name ① Ceramic Body Ceramic Powder ② Inner Coils Silver Paste Pull-out Electrode (Ag) ③ 4) ④-1 Terminal Electrode: Inside Ag ④-2 Electro-Plating: Ni/Sn plating Silver Paste Termination Silver Composition Plating Chemicals Soldering Notice: The surface with the mark should be on the top side when soldering, but it is not necessary to identify the mark's direction towards left or right. 5. Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 60 X magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Appendix A. b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent. 5.3.2 Inductance (L) a. Refer to Appendix A. b. Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A+16197A or equivalent. c. Test signal: -20dBm or 50mV d. Test frequency refers to Appendix A. e. Short bar residual inductance=0.43nH 5.3.3 Q Factor (Q) a. Refer to Appendix A. b. Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A+16197A or equivalent. c. Test signal: -20dBm or 50mV d. Test frequency refers to Appendix A. 5.3.4 Self-Resonant Frequency (SRF) a. Refer to Appendix A. b. Test equipment: Agilent 8719ES or equivalent. c. Test signal: -20 dBm or 50 mV 5.3.5 Rated Current a. Refer to Appendix A. b. Test equipment (see Fig. 5.3.5-1): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig. 5.3.5-1): 1. Set test current to be 0 mA. 2. Measure initial temperature of chip surface. 3. Gradually increase voltage and measure chip temperature for corresponding current. d. Definition of Rated Current(Ir): Ir is direct electric current as chip surface temperature rose just 20℃ against chip initial surface temperature(Ta) (see Fig. 5.3.5-2). Thermometer Temperature(℃) Electric Power Electric Current Meter Chip R +20 Ta 0 Rated current Fig. 5.3.5-1 Fig. 5.3.5-2 Ir (mA) Sunlord Specifications for Multi-layer Chip Ceramic Inductors Page 4 of 9 5.4 Reliability Test Items Requirements Test Methods and Remarks 5.4.1 No removal or split of the termination or other Terminal defects shall occur. Strength ① Solder the inductor to the testing jig (glass epoxy board shown in Fig. 5.4.1-1) using leadfree solder. Then apply a force in the direction of the arrow. Chip F Mounting Pad ② 2N force for SDCL0603Q-02B01 series. ③ Keep time: 10±1s ④ Speed: 1.0mm/s. ① Solder the inductor to the test jig (glass epoxy board shown in Glass Epoxy Board Fig.5.4.1-1 5.4.2 Resistance No visible mechanical damage. to Fig. 5.4.2-1) Using a leadfree solder. Then apply a force in the Unit: mm [inch] Flexure Type a 0603[0201] 0.25 direction shown Fig. 5.4.2-2. b c ② Flexure: 2mm. 0.8 0.3 ③ Pressurizing Speed: 0.5mm/sec. ④ Keep time: 30 sec. 20 Φ4.5 b R230 Flexure 40 c a ① No visible mechanical damage. Vibration ② Inductance change: Within ±10%. ③ Q factor change: Within ±20%. Cu pad 45[1.772] 45[1.772] 100 Fig. 5.4.2-1 5.4.3 10 Fig. 5.4.2-2 ① Solder the inductor to the testing jig (glass epoxy board shown in Fig. 5.4.3-1) using leadfree solder. ② The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied Solder mask uniformly between the approximate limits of 10 and 55 Hz. ③ The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours). Glass Epoxy Board Fig. 5.4.3-1 5.4.4 Dropping ① No visible mechanical damage. Drop chip inductor 10 times on a concrete floor from a height of 100 ② Inductance change: Within ±10%. cm. ③ Q factor change: Within ±20%. 5.4.5 Inductance change should be within ±10% of Temperature range: SDCL0603Q-02B01: -55℃ to +125℃, Temperature initial value measuring at 20℃. Reference temperature: +20℃ 5.4.6 ① No visible mechanical damage. ① Solder temperture:240±2℃ Solderability ② Wetting shall exceed 75% coverage. ② Duration: 3 sec. ③ Solder: Sn/3.0Ag/0.5Cu. ④ Flux: 25% Resin and 75% ethanol in weight. 5.4.7 ① No visible mechanical damage. ① Solder temperature: 260±3℃ Resistance to ② Wetting shall exceed 75% coverage. ② Duration: 5 sec. Soldering Heat ③ Inductance change: Within ±10%. ③ Solder: Sn/3.0Ag/0.5Cu. ④ Q factor change: Within ±20%. ④ Flux: 25% Resin and 75% ethanol in weight. ⑤ The chip shall be stabilized at normal condition for 1~2 hours before measuring. Sunlord Specifications for Multi-layer Chip Ceramic Inductors 5.4.8 ① No mechanical damage. Thermal Shock ② Inductance change: Within ±10%. ③ Q factor change: Within ±20%. ① 30 min. 125℃ Temperature, Time: (See Fig. 5.4.8-1) SDCL0603Q-02B01: -55℃for 30±3 min→125℃ for 30±3min, 30 min. ② Transforming interval: Max. 20 sec. ③ Tested cycle: 100 cycles. ④ The chip shall be stabilized at normal condition for 1~2 hours before measuring. Ambient Temperature -55℃ Page 5 of 9 30 min. Fig. 5.4.8-1 20sec. (max.) 5.4.9 Resistance ① No mechanical damage. ① Temperature: -55±2℃, to Low ② Inductance change: Within ±10%. ② Duration: 1000 Temperature ③ Q factor change: Within ±20%. ③ The chip shall be stabilized at normal condition for 1~2 hours +24 hours. before measuring. 5.4.10 Resistance ① No mechanical damage. ① Temperature: 125±2℃, to High ② Inductance change: Within ±10%. ② Duration: 1000 Temperature ③ Q factor change: Within ±20%. ③ The chip shall be stabilized at normal condition for 1~2 hours 5.4.11 ① No visible mechanical damage. ① Temperature: 60±2℃ ② Inductance change: Within ±10%. ② Humidity: 90% to 95% RH. ③ Q factor change: Within ±20%. ③ Duration: 1000 ④ The chip shall be stabilized at normal condition for 1~2 hours +24 hours. before measuring. Damp Heat (Steady States) +24 hours. before measuring. 5.4.12 ① No visible mechanical damage. ① Temperature: 60±2℃ Loading Under ② Inductance change: Within ±10%. ② Humidity: 90% to 95% RH. Damp Heat ③ Q factor change: Within ±20%. ③ Duration: 1000 ④ Applied current: Rated current. ⑤ The chip shall be stabilized at normal condition for 1~2 hours +24 hours. before measuring. 5.4.13 Loading at ① No visible mechanical damage. ① Temperature: 125±2℃, High Temperature ② Inductance change: Within ±10%. ② Duration: 1000 (Life Test) ③ Q factor change: Within ±20%. ③ Applied current: Rated current. ④ The chip shall be stabilized at normal condition for 1~2 hours +24 hours. before measuring. 6. Packaging and Storage 6.1 Packaging Tape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig.6.1-1~3 b. Tape carrier packaging quantity please see the following table: Type (1) 0603[0201] Thickness (mm) 0.3±0.05 Tape Paper Tape Quantity 15K Taping Drawings (Unit: mm) .6.1-1 Sunlord Specifications for Multi-layer Chip Ceramic Inductors Page 6 of 9 (2) Taping Dimensions (Unit: mm) Paper Tape Chip Cavity Sprocket Hole Φ1.5 (+0.1,0) 1.75±0.1 B 8.0±0.3 3.5±0.05 A A B P T max 0603[0201] 0.4±0.1 0.7±0.1 2.0±0.05 0.55 T 4.0±0.1 P 2.0±0.05 Type Fig. 6.1-2 Direction of Feed (3) Reel Dimensions (Unit: mm) 4.3±0.2mm 8.4+1.5/-0.0mm C 4.0±0.1mm 2.45±0.2mm 5.0±0.1mm 58±2.0mm 13.5±0.2mm 3.0±0.1mm max＜14.4mm 178±2.0mm Fig. 6.1-3 6.2 Storage a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). c. d. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. Solderability specified in Clause 5.4.6 shall be guaranteed for 6 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 6 months shall be checked solder-ability before use. 7. Recommended Soldering Technologies 7.1 Reflow Profile △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 10sec. △ Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max [Note: The reflow profile in the above table is only for 217℃ the customer's specific board design, solder paste and Max Ramp Up Rate=3℃/sec. Max Ramp Down Rate=6℃/sec. 60～90sec. 200℃ 150℃ 60～120sec. qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on Peak 260℃ max 260℃ 25℃ Time 25℃ to Peak =8 min max process, and should not exceed the parameters as the Reflow profile shows.] 7.2 Iron Soldering Profile △ 3sec. Max. Iron soldering power: Max. 30W 350℃ △ Pre-heating: 150℃/60sec. △ Soldering Tip temperature: 350℃ Max. Soldering Iron △ Soldering time: 3sec. Max. Power: max. 30W △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] Diameter of Soldering Tc ℃ Iron 1.0mm max. Sunlord 8. Specifications for Multi-layer Chip Ceramic Inductors Supplier Information a) Supplier: Shenzhen Sunlord Electronics Co., Ltd. b) Manufacturer: Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110 Page 7 of 9 Sunlord Specifications for Multi-layer Chip Ceramic Inductors Page 8 of 9 Appendix A: Electrical Characteristics (SDCL0603Q-02B01 Series of Inductors) SDCL0603Q-02B01 Series of Inductor Part Number SDCL0603Q0N6□T02B01 L Q (nH) Min. 0.6 13 L, Q Test. S.R.F Q (Typ.) @Freq. (GHz) Freq (MHz) (MHz) 0.5 0.8 1.8 2.0 2.4 Min 500 >24 >32 >54 >57 >65 10000 DCR Ir (mA) (Ω) Max. Max. 0.06 Thickness (mm) [inch] 600 0.3±0.05 [.012±.002] SDCL0603Q0N7□T02B01 0.7 13 500 >24 >32 >54 >57 >65 10000 0.06 550 SDCL0603Q0N8□T02B01 0.8 13 500 >24 >32 >54 >57 >65 10000 0.07 550 SDCL0603Q0N9□T02B01 0.9 13 500 >24 >32 >54 >57 >65 10000 0.07 550 SDCL0603Q1N0□T02B01 1.0 13 500 24 32 54 57 65 10000 0.08 520 SDCL0603Q1N1□T02B01 1.1 13 500 19 26 45 47 55 10000 0.11 440 SDCL0603Q1N2□T02B01 1.2 13 500 19 25 43 44 52 10000 0.12 420 SDCL0603Q1N3□T02B01 1.3 13 500 19 25 40 42 47 10000 0.12 420 SDCL0603Q1N4□T02B01 1.4 13 500 19 24 39 41 47 10000 0.11 440 SDCL0603Q1N5□T02B01 1.5 13 500 19 24 39 41 46 10000 0.12 420 SDCL0603Q1N6□T02B01 1.6 13 500 19 24 39 41 46 10000 0.13 410 SDCL0603Q1N7□T02B01 1.7 13 500 19 24 39 41 46 10000 0.15 380 SDCL0603Q1N8□T02B01 1.8 13 500 19 24 39 41 46 10000 0.15 380 SDCL0603Q1N9□T02B01 1.9 13 500 18 24 38 40 45 10000 0.18 350 SDCL0603Q2N0□T02B01 2.0 13 500 17 24 38 39 44 10000 0.23 300 SDCL0603Q2N1□T02B01 2.1 13 500 17 24 37 39 44 10000 0.24 300 SDCL0603Q2N2□T02B01 2.2 13 500 17 24 38 40 43 10000 0.25 290 SDCL0603Q2N3□T02B01 2.3 13 500 17 24 37 39 43 10000 0.20 330 SDCL0603Q2N4□T02B01 2.4 13 500 17 23 36 38 42 10000 0.22 310 SDCL0603Q2N5□T02B01 2.5 13 500 17 23 35 36 40 9600 0.20 330 SDCL0603Q2N6□T02B01 2.6 13 500 17 22 34 35 39 9400 0.20 330 SDCL0603Q2N7□T02B01 2.7 13 500 17 22 34 35 39 9200 0.22 310 SDCL0603Q2N8□T02B01 2.8 13 500 17 22 34 35 39 8900 0.24 300 SDCL0603Q2N9□T02B01 2.9 13 500 17 22 34 35 39 8800 0.26 280 SDCL0603Q3N0□T02B01 3.0 13 500 17 22 34 35 39 8600 0.26 280 SDCL0603Q3N1□T02B01 3.1 13 500 17 22 34 35 39 8500 0.28 270 SDCL0603Q3N2□T02B01 3.2 13 500 17 22 33 35 39 8200 0.28 270 SDCL0603Q3N3□T02B01 3.3 13 500 18 23 34 36 40 8100 0.30 270 SDCL0603Q3N4□T02B01 3.4 13 500 17 23 33 35 39 8000 0.30 270 SDCL0603Q3N5□T02B01 3.5 13 500 17 23 33 35 39 7900 0.34 250 SDCL0603Q3N6□T02B01 3.6 13 500 16 23 33 35 39 7700 0.38 240 SDCL0603Q3N7□T02B01 3.7 13 500 16 23 33 35 38 7600 0.40 230 SDCL0603Q3N8□T02B01 3.8 13 500 16 22 33 35 38 7500 0.42 230 SDCL0603Q3N9□T02B01 3.9 13 500 16 22 33 35 38 7400 0.42 230 SDCL0603Q4N3□T02B01 4.3 13 500 16 21 32 34 37 6800 0.44 220 SDCL0603Q4N7□T02B01 4.7 13 500 16 22 33 35 38 6200 0.45 220 SDCL0603Q5N1□T02B01 5.1 13 500 17 22 34 36 38 5900 0.46 210 SDCL0603Q5N6□T02B01 5.6 13 500 16 21 33 34 37 5500 0.46 210 SDCL0603Q6N2□T02B01 6.2 13 500 18 23 34 35 37 5100 0.48 210 SDCL0603Q6N8□T02B01 6.8 13 500 17 22 32 33 35 5500 0.50 200 SDCL0603Q7N5□T02B01 7.5 13 500 16 21 31 33 34 4700 0.50 200 SDCL0603Q8N2□T02B01 8.2 13 500 16 21 31 32 34 4300 0.56 190 SDCL0603Q9N1□T02B01 9.1 13 500 16 20 30 31 32 4100 0.72 170 SDCL0603Q10N□T02B01 10 13 500 16 20 28 29 31 3800 0.80 160 SDCL0603Q12N□T02B01 12 13 500 16 20 27 28 28 3400 0.80 160 SDCL0603Q15N□T02B01 15 13 500 15 19 24 24 23 2600 0.85 160 SDCL0603Q18N□T02B01 18 13 500 15 19 23 24 22 2300 1.00 140 SDCL0603Q22N□T02B01 22 13 500 15 19 22 23 20 1900 1.20 130 SDCL0603Q27N□T02B01 27 13 500 15 19 15 13 8 1800 1.60 120 SDCL0603Q33N□T02B01 33 11 300 14 15 8 5 - 1800 2.20 110 Sunlord Specifications for Multi-layer Chip Ceramic Inductors Page 9 of 9 SDCL0603Q39N□T02B01 39 11 300 14 15 6 - - 1600 2.30 100 SDCL0603Q47N□T02B01 47 11 300 14 15 - - - 1500 2.60 100 SDCL0603Q56N□T02B01 56 11 300 13 13 - - - 1400 2.80 80 SDCL0603Q68N□T02B01 68 11 300 13 11 - - - 1200 3.20 80 SDCL0603Q82N□T02B01 82 10 300 12 10 - - - 1100 3.80 70 SDCL0603QR10□T02B01 100 10 300 12 10 - - - 1000 4.00 60 SDCL0603QR12□T02B01 120 9 300 12 8 - - - 1000 5.00 50 Note: □: Please specify the inductance tolerance. For L≤6.2nH, choose B=±0.1nH, C=±0.2nH or S=±0.3nH;For L>6.2nH, choose, H=±3%, J=±5%.or K=±10%