深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
文件编号 Document number:
HYSP-HL000XX
版本编码 Version number:
产品规格书
PRODUCT SPECIFICATION
客户名称
CUSTOMER
宏业产品系列
HBLS 系列叠层片式电感器
PRODUCT SERIES
HBLS SERIES MULTILAYER CHIP INDUCTOR
宏业规格型号
PRODUCT TYPE
客户型号规格
CUSTOMER’S PRODUCT TYPE
研发
品质
业务
批准
深圳市宏业兴电子有限公司 SHENZHEN HONGYEX ELECTRONICS CO,.LTD.
传真 Fax number:0755-83295141
邮箱 Email:hy@hongyex.com
公司地址:广东省深圳市福田区深南中路佳和大厦 A 座 23 层
Company address: 23/F,Block A,Jiahe building,Shenzhen City,Guangdong Province,China
工厂地址:惠州市罗阳镇鸿达工业区五号宏业兴工业园
Factory address:Hongyexing Industrial Park, No.5, Hongda Industrial Zone,Luoyang Town,Huizhou
City,Guangdong Province,China
备注 REMARK:
客户回签 CUSTOMER APPROVAL
第 1 页 共 15 页
A2
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
文件编号 Document number:
HYSP-HL000XX
A2
版本编码 Version number:
变更履历 Change list
序号
NO.
1
2
修改日期
DATE
2014.10.14
2019.11.29
修改内容
CHANGE CONTENT
初版 First edition
更新联系方式 Update contact
第 2 页 共 15 页
版本号
Version NO.
A1
A2
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
HYSP-HL000XX
文件编号 Document number:
版本编码 Version number:
1 用途 APPLICATIONS
广泛应用于通信、影音设备、计算机、遥控等领域。
Widely use in Communications, Video and audio equipment, Computer, Remote control, etc.
2 特点 FEATURES
高可靠的一体化结构;
Monolithic structure for high reliability;
尺寸小;
Compact size inductor possible;
适用于各类表面贴装工艺;
Perfect shape for mounting with no directionality;
具有优异的可焊性和耐焊性。
Excellent solderability and high heat resistance for reflow soldering or wave soldering.
3 产品编码 PRODUCT IDENTIFICATION
HBLS
1005 - 10N
J
①
②
③
④
①
Type:Chip Ferrite Inductor
②
External Dimensions (L×W) (mm):1.0×0.5
③
Nominal Inductance:1N0,1.0nH;47N,47nH;R10,100nH
④
Inductance Tolerance:B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,
±5%;K,±10%;
4 外形及尺寸 SHAPE AND DIMENSIONS
Unit: mm[inch]
Type
HBLS0603
[0201]
HBLS1005
[0402]
HBLS1608
[0603]
HBLS2012
[0805]
L
0.6±0.05
[.024±.002]
1.0±0.15
[.039±.006]
1.6±0.15
[.063±.006]
1.65±0.15
[.065±.006]
2.0(+0.3,-0.1)
[.079(+.012,-.004)]
W
0.3±0.05
[.012±.002]
0.5±0.15
[.020±.006]
T
0.3±0.05
[.012±.002]
0.5±0.15
[.020±.006]
a
0.12±0.05
[.005±.002]
0.25±0.1
[.010±.004]
0.8±0.15
[.031±.006]
0.8±0.15
[.031±.006]
0.3±0.2
[.012±.008]
1.25±0.2
[.049±.008]
0.85±0.2
[.033±.008]
0.5±0.3
[.020±.012]
5 特性参数 SPECIFICATIONS
详见附录 A。Please refer to Appendix A.
工作温度范围 Operating temperature range: -40℃~+85℃
储存温度范围 Storage temperature range: -10℃~+40℃, 70% RH.
第 3 页 共 15 页
A2
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
文件编号 Document number:
HYSP-HL000XX
版本编码 Version number:
A2
6 测试及可靠性 TESTING AND RELIABILITY
6.1 测试环境条件 Test Conditions
一般按照以下环境条件测试(有特殊要求的除外),:
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. 温度 Ambient Temperature: 20±15℃
b. 湿度 Relative Humidity: 65±20%
c. 大气压 Air Pressure: 86 kPa to 106 kPa
如果对测试结果有疑义,可以按照以下条件复测:
If any doubt on the results, measurements/tests should be made within the following limits:
a. 温度 Ambient Temperature: 20±2℃
b. 湿度 Relative Humidity: 65±5%
c. 大气压 Air Pressure: 86kPa to 106 kPa
6.2 测试及可靠性 Testing and reliability
测试与可靠性
Testing and reliability
直流电阻
RDC
电感量
Inductance (L)
额定电流
Rated Current(Ir)
品质因数 Q
可焊性
SOLDER-ABILITY
耐焊性
RESISTANCE TO
SOLDER HEAT
测试方法与要求
Test Methods and Remarks
标准值参考第 5 章节。Refer to Item 5.
测 试 仪 器 : 高 精 度 电 阻 表 HP4338B 或 等 效 仪 器 。 Test equipment (Analyzer): High Accuracy
Milliohmmeter-HP4338B or equivalent.
a. 标准值参考第 5 章节。Refer to Item 5.
b. 测试仪器:高精度射频阻抗分析仪 Anglient E4991A+HP16192A 或等效仪器。
Test equipment: High Accuracy RF Impedance /Material Analyzer -Anglient E4991A+ HP16192A or
equivalent.
c. 测试信号 Test signal: -40dBm or 100mV.
d. 测试频率参考第 5 章节。Test frequency refers to Item 5.
a. 标准值参考第 5 章节。Refer to Item 5.
b. 测试仪器:HP6632B 直流电源,Anglient E4991A+HP16192A+HP16200A 或等效仪器。
Test equipment: HP6632B system DC power supply, Anglient E4991A+HP16192A+HP16200A or
equivalent.t.
c. 额定直流电流下的电感量下降不超过 5%。The decreasing-rate of inductance value is within 5 %.
a. 标准值参考第 5 章节。Refer to Item 5.
b. 测试仪器:高精度射频阻抗分析仪 Anglient E4991A+HP16192A 或等效仪器。
Test equipment: High Accuracy RF Impedance /Material Analyzer -Anglient E4991A+ HP16192A or
equivalent.
c. 测试信号 Test signal: -40dBm or 100mV.
d. 测试频率参考第 5 章节。Test frequency refers to Item 5.
至少 95%的焊接面完全被焊锡连续覆盖。95% min. coverage of all metabolised area.
焊锡温度 Solder temp. : 240±5℃
浸入时间 Immersion time : 3±1 sec
焊锡 Solder : Sn-3Ag-0.5Cu
无 可 见 损 伤 。 电 特 性 和 机 械 特 性 满 足 产 品 规 范 或 检 验 标 准 要 求 。No visible damage. Electrical
characteristics and mechanical characteristics shall be satisfied.
焊锡温度 Solder Temp. : 265±3℃
浸入时间 Immersion time : 6±1 sec
预热 Preheating : 100℃ to 150℃, 1 minute.
在室温下放置 24±2 小时后测试检查。Measurement to be made after keeping at room temp for 24±2 hrs.
焊锡 Solder : Sn-3Ag-0.5Cu
第 4 页 共 15 页
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
文件编号 Document number:
振动
Vibration
温度冲击
Temperature shock
湿热负载
HUMIDITY
RESISTANCE
高温负载
HIGH
TEMPERATURE
RESISTANCE
低温储存
LOW
TEMPERATURE
STORAGE LIFE
A2
版本编码 Version number:
Bending
试验后无破损现象,电感量应在±20%以
unit : mm
内,直流电阻应符合标准/规范要求。
Without deformation cases, Inductance
0.8
shall be satisfied ± 20%, DC resistance
45
45
shall be satisfied.
将产品焊接在试验板上,如图所示在试验
板中间位置施加压力,使得试验板中心点
向下弯曲 2mm,保持 10 秒。
After soldering
a chip to a test substrate,bend the substrate
100
by 2mm hold for 10s and then return.
Soldering shall be done in accordance with the recommended PC board pattern and reflow soldering.
a.试验要求 Performance specification
1)外观 Appearance:无可见机械损伤 no mechanical damage
2)电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value
b.试验条件 Test condition
1)波形 Waveform:正弦波 Sine wave
2)频率 Frequency:10~55~10 Hz
3)持续时间 Sweep time:1min
4)Amplitude:1.5mm(peak-peak)
5.Direction:X,Y,Z(3 axes)
6.Duration:2 hrs./axis,total 6 hrs.
a.试验要求 Performance specification
1)外观 Appearance:无可见机械损伤 no mechanical damage
2)电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value
b.试验条件 Test condition
1)温度 Temperature :-40℃,+85℃各保持 30 分钟。-40℃,+85℃ kept stabilized for 30 minutes each
2)周期 Cycle:5 次。5 cycles.
3)检查 Measurement:试验后至少在室温条件下放置 24 小时以上。After placing at room ambient
temperature for 24 hours minimum.
a.试验要求 Performance specification
1)外观 Appearance:无可见机械损伤 no mechanical damage
2)电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value
b.试验条件 Test condition
1)湿度 Humidity:90 to 95﹪RH
2)温度 Temperature:60±2℃
3)加载电流 Applied current:额定直流电流 Rated current
4)试验时间 Testing tine:1000(+48,0)hours
5)检查 Measurement:试验后至少在室温条件下放置 24 小时以上。After placing at room ambient
temperature for 24 hours minimum.
a. 试验要求 Performance specification
1) 外观 Appearance:无可见机械损伤 no mechanical damage
2) 电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value
b. 试验条件 Test condition
1) 温度 Temperature: +85℃±2℃
2) 加载电流 Applied current:额定直流电流 Rated current
3) 试验时间 Testing time:1000(+48,0)hours
4) 检查 Measurement:试验后至少在室温条件下放置 24 小时以上。After placing at room ambient
temperature for 24 hours minimum.
a.试验要求 Performance specification
1)外观 Appearance:无可见机械损伤 no mechanical damage.
2)电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value.
b.试验条件 Test condition
1.温度 Temperature:-40℃±2℃
40
弯曲
Bend
HYSP-HL000XX
第 5 页 共 15 页
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
文件编号 Document number:
端头强度
TERMINAL
STRENGTH
跌落
Drop
盐雾
Salt mist
HYSP-HL000XX
A2
版本编码 Version number:
2.试验时间 Testing time:1000(+48,0)hours
3.检查 Measurement:试验后至少在室温条件下放置 24 小时以上。After placing for 24 hours minimum
at room ambient temperature.
无破损现象。Without deformation cases.
电感量变化应在±20%以内。Inductance shall be satisfied ± 20%.
直流电阻应满足标准要求。DC resistance shall be satisfied.
焊接在 PCB 上的产品应持续成熟 10N 推力共 10 秒;0603[0201]产品推力为
2N。Solder chip on PCB and applied 10N(1.02Kgf) for 10 sec.0603[0201] chip applied 2N.
试验后产品应无失效现象。Products shall be no failure after test.
产品跌落在混凝土地面或钢板上。It shall be dropped on concrete or steel board.
试验方法:自由落下。Method : free fall.
高度 Height : 100cm.
产品跌落方向:3 个方向。Attitude from which the product is dropped : 3 direction.
总次数:每个方向 3 次(共 9 次)。The number of times : 3 times for each direction (Total 9 times).
a.试验要求 Performance specification
1)外观 Appearance:无可见机械损伤 no mechanical damage.
2)电感量变化应在±20%以内 Inductance shall be with ±20﹪of the initial value.
b.试验条件 Test condition
1)盐溶液溶度 Concentration of salt solution:(5±0.1)%.
2)PH:6.5-7.2
3)时间 Time:48±2h
7 包装及储存 Packaging, Storage
7.1 包装 Packaging
(1)载带尺寸 Tape Dimensions(Unit: mm)
Paper Tape
型号 Type
A
B
P
Tmax
0603[0201]
0.4±0.1
0.7±0.1
2.0±0.05
0.55
1005[0402]
0.65±0.1
1.25±0.1
2.0±0.05
0.8
1608[0603]
1.0±0.2
1.8±0.2
4.0±0.1
1.1
2012[0805]
1.5±0.2
2.3±0.2
4.0±0.1
1.1
3216[1206]
1.9±0.2
3.5±0.2
4.0±0.1
1.1
EMbossed Tape
型号 Type
A
B
P
Pmax
Tmax
2012[0805]
1.55±0.2
2.25±0.2
4.0±0.1
1.45
0.3
3216[1206]
1.88±0.2
3.5±0.2
4.0±0.1
1.27
0.3
3225[1210]
2.9±0.2
3.5±0.2
4.0±0.1
1.55
0.28
4532[1812]
3.66±0.2
4.95±0.2
4.0±0.1
1.85
0.33
(2)载带 Tape
第 6 页 共 15 页
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
文件编号 Document number:
HYSP-HL000XX
版本编码 Version number:
A2
(3)卷盘 REEL
型号 Type
T(mm)
载带 Tape
数量 Quantity
0603[0201]
0.3±0.05
Paper Tape
10K
1005[0402]
0.5±0.15
Paper Tape
10K
1608[0603]
0.8±0.15
Paper Tape
4K
2012[0805]
0.85±0.2
Paper Tape
4K
1.25±0.2
Embossed Tape
3K
0.85±0.2
Paper Tape
4K
1.1±0.2
Embossed Tape
3K
3225[1210]
1.3±0.3
Embossed Tape
2K
4532[1812]
1.5±0.3
Embossed Tape
1K
3216[1206]
(4)剥离力 PEELING OFF FORCE
剥离速度
Speed of peeling off
剥离力
Peeling off force
300mm/s
0.1N to 1N(10g to 100g).
(5)包装 Packaging
a. 卷盘和干燥剂一同放入尼龙或塑料袋中。Reel and a bag of desiccant shall be packed in Nylon or plastic bag.
b. 每个内盒中最多装 2 个上述袋子。Maximum of 2 bags shall be packaged in a inner box.
c. 每个外箱中最多装 8 个内盒。Maximum of 8 inner box shall be packaged in a outer box.
7.2 储存 Storage
7.2.1 不得暴露在高温高湿环境下储存,否则导致产品外电极和焊接性恶化变差。建议包装好的产品储存
第 7 页 共 15 页
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
文件编号 Document number:
HYSP-HL000XX
版本编码 Version number:
A2
在低于 40℃、小于 70% RH 条件下。The solderability of the external electrode may be deteriorated if packages
are stored where they are exposed to high humidity. Packages must be stored at 40℃ or less and 70﹪RH or less.
7.2.2 不得暴露在灰尘或腐蚀性气体(如氯化氢,亚硫酸气体或硫化氢等)环境下储存,否则会导致产品
外电极和焊接性恶化变差。The solderability of the external electrode may be deteriorated if packages are stored
where they are exposed to dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide).
7.2.3 如果暴露在阳光直射或加热环境下储存,会导致包装材料变形。Packaging material may be deformed if
packages are stored where they are exposed to heat or direct sunlight.
7.2.4 采用聚乙烯热封载带形式的最小包装,在使用之前不要拆开。如果拆开了,应尽快使用卷盘保护起
来。Minimum packages, such as polyvinyl heat-seal packages shall not be opened until just before they are used.If
opened, use the reels as soon as possible.
7.2.5 在符合 8.2.1 和 8.2.2 要求的环境下储存,从产品发货日期开始 6 个月内,产品的焊接性能够满足 7.2
规定的要求。Solderability specified in composite specification 7.2 shall be for 6 months from the date of delivery
on condition that they are stored at the environment specified clause 8.2.1 & 8.2.2.
在产品使用之前,如果储存期超过 6 个月,则需要复检焊接性。For those parts which passed more than 6
months shall be checked solderability before it is used.
8 安装使用及注意事项
8.1 回流焊条件 Reflow soldering conditions
焊接之前产品应预热到 150℃。焊接后应冷却到 100℃。Pre-heating should be in such a way that the
temperature difference between solder and ferrite surface is limited to 150℃ max.Also cooling into solvent after
soldering should be in such a way that the temperature difference is limited to 100℃ max.
如果预热不充分,会导致产品质量恶化。Unenough pre-heating may cause cracks on the ferrite, resulting
in the deterioration of product quality.
产品应当按照下述曲线焊接。Products should be soldered within the following allowable range indicated
by the slanted line.
作业前,应对焊锡炉进行校准确认,保证能够符合焊接工艺条件。The excessive soldering conditions may
cause the corrosion of the electrode, When soldering is repeated, allowable time is the accumulated time.
第 8 页 共 15 页
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
文件编号 Document number:
HYSP-HL000XX
版本编码 Version number:
A2
8.2 返工 Reworking with soldering iron
预热 Preheating
150℃, l minute
最高温度 Tip temperature
280℃ max
焊接时间 Soldering time
3seconds max.
电烙铁输出功率 Soldering iron output
30w max.
电烙铁焊头尺寸 End of soldering iron
∮3mm max.
*返工仅限一次。Reworking should be limited to only one time.
注意 Note:为了避免焊接高温冲击导致产品本体开裂,电烙铁焊头焊锡时应避免直接与产品接触。Do not
directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material
due to the thermal shock.
8.3 焊料量 Solder Volume
焊料使用时,不得超过如下所示的上限要求。Solder shall be used not to be exceed the upper limits as
shown below.
随着焊料的增加,产品承受的机械应力也随之增加。过量的焊料所产生的机械应力,会导致产品出现
机 械 或 电 气 特 性 失 效 。 Accordingly increasing the solder volume, the mechanical stress to product is also
increased. Exceeding solder volume may cause the failure of mechanical or electrical performance.
第 9 页 共 15 页
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
HYSP-HL000XX
文件编号 Document number:
A2
版本编码 Version number:
附录 A 电气特性表
Appendix A Electrical Characteristics
HBLS0603 Series
Mini.
ctanc
Quality
test
e
Factor
Freq.
Unit
nH
-
MHz
-
Symbol
L
Q
Freq.
Q
HBLS0603-0N6□
0.6
13
500
>24
>32
>54
>57
HBLS0603-0N7□
0.7
13
500
>24
>32
>54
HBLS0603-0N8□
0.8
13
500
>24
>32
HBLS0603-0N9□
0.9
13
500
>24
HBLS0603-1N0□
1
13
500
HBLS0603-1N1□
1.1
13
HBLS0603-1N2□
1.2
HBLS0603-1N3□
Part Number
Mini.self
Typical Q@Freq.(GHz)
Indu
L,Q
resonant
Max.DC
Max.
resistanc
rated
e
Current
MHz
Ω
mA
S.R.F
DCR
Ir
>65
10000
0.06
600
>57
>65
10000
0.06
550
>54
>57
>65
10000
0.07
550
>32
>54
>57
>65
10000
0.07
550
24
32
54
57
65
10000
0.08
520
500
19
26
45
47
55
10000
0.11
440
13
500
19
25
43
44
52
10000
0.12
420
1.3
13
500
19
25
40
42
47
10000
0.12
420
HBLS0603-1N4□
1.4
13
500
19
24
39
41
47
10000
0.11
440
HBLS0603-1N5□
1.5
13
500
19
24
39
41
46
10000
0.12
420
HBLS0603-1N6□
1.6
13
500
19
24
39
41
46
10000
0.13
410
HBLS0603-1N7□
1.7
13
500
19
24
39
41
46
10000
0.15
380
HBLS0603-1N8□
1.8
13
500
19
24
39
41
46
10000
0.15
380
HBLS0603-1N9□
1.9
13
500
18
24
38
40
45
10000
0.18
350
HBLS0603-2N0□
2
13
500
17
24
38
39
44
10000
0.23
300
HBLS0603-2N1□
2.1
13
500
17
24
37
39
44
10000
0.24
300
HBLS0603-2N2□
2.2
13
500
17
24
38
40
43
10000
0.25
290
HBLS0603-2N3□
2.3
13
500
17
24
37
39
43
10000
0.2
330
HBLS0603-2N4□
2.4
13
500
17
23
36
38
42
10000
0.22
310
HBLS0603-2N5□
2.5
13
500
17
23
35
36
40
9600
0.2
330
HBLS0603-2N6□
2.6
13
500
17
22
34
35
39
9400
0.2
330
HBLS0603-2N7□
2.7
13
500
17
22
34
35
39
9200
0.22
310
HBLS0603-2N8□
2.8
13
500
17
22
34
35
39
8900
0.24
300
HBLS0603-2N9□
2.9
13
500
17
22
34
35
39
8800
0.26
280
HBLS0603-3N0□
3
13
500
17
22
34
35
39
8600
0.26
280
HBLS0603-3N1□
3.1
13
500
17
22
34
35
39
8500
0.28
270
HBLS0603-3N2□
3.2
13
500
17
22
33
35
39
8200
0.28
270
HBLS0603-3N3□
3.3
13
500
18
23
34
36
40
8100
0.3
270
HBLS0603-3N4□
3.4
13
500
17
23
33
35
39
8000
0.3
270
0.5
0.8
1.8
2.0
第 10 页 共 15 页
2.4
frequenc
y
Thichness
mm
[inch]
T
0.3±0.05
[.012±.00
2]
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
HYSP-HL000XX
文件编号 Document number:
A2
版本编码 Version number:
HBLS0603-3N5□
3.5
13
500
17
23
33
35
39
7900
0.34
250
HBLS0603-3N6□
3.6
13
500
16
23
33
35
39
7700
0.38
240
HBLS0603-3N7□
3.7
13
500
16
23
33
35
38
7600
0.4
230
HBLS0603-3N8□
3.8
13
500
16
22
33
35
38
7500
0.42
230
HBLS0603-3N9□
3.9
13
500
16
22
33
35
38
7400
0.42
230
HBLS0603-4N3□
4.3
13
500
16
21
32
34
37
6800
0.44
220
HBLS0603-4N7□
4.7
13
500
16
22
33
35
38
6200
0.45
220
HBLS0603-5N1□
5.1
13
500
17
22
34
36
38
5900
0.46
210
HBLS0603-5N6□
5.6
13
500
16
21
33
34
37
5500
0.46
210
HBLS0603-6N2□
6.2
13
500
18
23
34
35
37
5100
0.48
210
HBLS0603-6N8□
6.8
13
500
17
22
32
33
35
4900
0.5
200
HBLS0603-7N5□
7.5
13
500
16
21
31
33
34
4700
0.5
200
HBLS0603-8N2□
8.2
13
500
16
21
31
32
34
4300
0.56
190
HBLS0603-9N1□
9.1
13
500
16
20
30
31
32
4100
0.72
170
0.3±0.05
HBLS0603-10N□
10
13
500
16
20
28
29
31
3800
0.8
160
[.012±.00
HBLS0603-12N□
12
13
500
16
20
27
28
28
3400
0.8
160
2]
HBLS0603-15N□
15
13
500
15
19
24
24
23
2600
0.85
160
HBLS0603-18N□
18
13
500
15
19
23
24
22
2300
1
140
HBLS0603-22N□
22
13
500
15
19
22
23
20
1900
1.2
130
HBLS0603-27N□
27
13
500
15
19
15
13
8
1800
1.6
120
HBLS0603-33N□
33
11
300
14
15
8
5
-
1800
2.2
110
HBLS0603-39N□
39
11
300
14
15
6
-
-
1600
2.3
100
HBLS0603-47N□
47
11
300
14
15
-
-
-
1500
2.6
100
HBLS0603-56N□
56
11
300
13
13
-
-
-
1400
2.8
80
HBLS0603-68N□
68
11
300
13
11
-
-
-
1200
3.2
80
HBLS0603-82N□
82
10
300
12
10
-
-
-
1100
3.8
70
HBLS0603-R10□
100
10
300
12
10
-
-
-
1000
4
60
HBLS0603-R12□
120
9
300
12
8
-
-
-
1000
5
50
*请选用时注明公差(B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,±5%;K,±10%)Please specify
the inductance tolerance code(B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,±5%;K,±10%).
HBLS1005 Series
Mini.
Part Number
Inductance
Quality
Factor
L,Q test
frequency
Typical
Q@Freq.(MHz)
100
800
1000
Mini.self
resonant
frequency
Max.DC
Max.rate
resistance
d Current
Thichness
mm
Unit
nH
-
MHz
-
MHz
Ω
mA
Symbol
L
Q
Freq.
Q
S.R.F
DCR
Ir
T
1.0±0.3
8
100
10000
0.1
400
0.5±0.15
HBLS1005-1N0S
11
34
第 11 页 共 15 页
36
[inch]
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
HYSP-HL000XX
文件编号 Document number:
A2
版本编码 Version number:
HBLS1005-1N1S
1.1±0.3
8
100
11
34
36
10000
0.1
400
[.020±.006
HBLS1005-1N2S
1.2±0.3
8
100
11
34
36
10000
0.1
400
]
HBLS1005-1N3S
1.3±0.3
8
100
11
34
36
10000
0.1
400
HBLS1005-1N5S
1.5±0.3
8
100
11
34
36
6000
0.1
300
HBLS1005-1N6S
1.6±0.3
8
100
11
32
35
6000
0.1
300
HBLS1005-1N8S
1.8±0.3
8
100
11
30
34
6000
0.1
300
HBLS1005-2N0S
2.0±0.3
8
100
10
29
33
6000
0.2
300
HBLS1005-2N2S
2.2±0.3
8
100
10
29
33
6000
0.2
300
HBLS1005-2N4S
2.4±0.3
8
100
10
29
32
6000
0.2
300
HBLS1005-2N7S
2.7±0.3
8
100
10
29
32
6000
0.2
300
HBLS1005-3N0S
3.0±0.3
8
100
10
29
32
6000
0.2
300
HBLS1005-3N3S
3.3±0.3
8
100
10
29
32
6000
0.2
300
HBLS1005-3N6S
3.6±0.3
8
100
10
28
31
4000
0.2
300
HBLS1005-3N9S
3.9±0.3
8
100
10
28
31
4000
0.2
300
HBLS1005-4N3S
4.3±0.3
8
100
10
28
31
4000
0.2
300
HBLS1005-4N7S
4.7±0.3
8
100
10
28
31
4000
0.2
300
HBLS1005-5N1S
5.1±0.3
8
100
10
28
30
4000
0.3
300
HBLS1005-5N6S
5.6±0.3
8
100
10
28
30
4000
0.3
300
HBLS1005-6N2S
6.2±0.3
8
100
10
27
30
3900
0.3
300
HBLS1005-6N8□
6.8
8
100
10
27
30
3900
0.3
300
HBLS1005-7N5□
7.5
8
100
10
27
30
3700
0.4
300
HBLS1005-8N2□
8.2
8
100
10
27
30
3600
0.4
300
HBLS1005-9N1□
9.1
8
100
10
27
30
3400
0.4
300
HBLS1005-10N□
10
8
100
10
27
30
3200
0.4
300
HBLS1005-12N□
12
8
100
10
26
29
2700
0.5
300
HBLS1005-15N□
15
8
100
10
26
28
2300
0.5
300
HBLS1005-18N□
18
8
100
10
25
27
2100
0.6
300
HBLS1005-20N□
20
8
100
10
25
26
2000
0.6
300
HBLS1005-22N□
22
8
100
10
25
25
1900
0.6
300
HBLS1005-27N□
27
8
100
10
25
23
1600
0.7
300
HBLS1005-33N□
33
8
100
10
22
22
1300
0.8
200
HBLS1005-39N□
39
8
100
10
22
19
1200
1
200
HBLS1005-43N□
43
8
100
10
21
16
1100
1.1
200
HBLS1005-47N□
47
8
100
10
21
16
1000
1.1
200
HBLS1005-56N□
56
8
100
10
18
13
750
1.2
200
HBLS1005-68N□
68
8
100
10
18
9
750
1.4
180
HBLS1005-82N□
82
8
100
10
13
-
750
2.4
150
HBLS1005-R10□
100
8
100
10
12
-
700
2.6
150
HBLS1005-R12□
120
8
100
10
-
-
600
2.8
150
HBLS1005-R15□
150
8
100
10
-
-
550
3.2
100
第 12 页 共 15 页
0.5±0.15
[.020±.006
]
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
HYSP-HL000XX
文件编号 Document number:
A2
版本编码 Version number:
HBLS1005-R18□
180
8
100
10
-
-
500
3.7
100
HBLS1005-R22□
220
8
100
12
-
-
450
4
100
HBLS1005-R27□
270
8
100
12
-
-
400
4.5
100
HBLS1005-R33□
330
6
50
-
-
-
350
7
50
*请选用时注明公差(B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,±5%;K,±10%)Please specify
the inductance tolerance code(B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,±5%;K,±10%).
HBLS1608 Series
Mini.
Part Number
Inductance
Quality
Factor
L,Q test
frequency
Typical
Q@Freq.(MHz)
100
800
1000
Mini.self
resonant
frequency
Max.DC
Max.rated
resistance
Current
Unit
nH
-
MHz
-
MHz
Ω
mA
Symbol
L
Q
Freq.
Q
S.R.F
DCR
Ir
HBLS1608-1N0S
1.0±0.3
8
100
13
70
80
10000
0.05
500
HBLS1608-1N2S
1.2±0.3
8
100
13
60
70
10000
0.05
500
HBLS1608-1N5S
1.5±0.3
8
100
13
47
68
6000
0.1
500
HBLS1608-1N8S
1.8±0.3
8
100
13
45
61
6000
0.1
500
HBLS1608-2N2S
2.2±0.3
8
100
13
45
60
6000
0.1
500
HBLS1608-2N7S
2.7±0.3
10
100
13
44
55
6000
0.12
500
HBLS1608-3N3S
3.3±0.3
10
100
13
43
50
6000
0.15
500
HBLS1608-3N9S
3.9±0.3
10
100
13
43
50
6000
0.16
500
HBLS1608-4N7S
4.7±0.3
10
100
13
43
50
6000
0.2
500
HBLS1608-5N6S
5.6±0.3
10
100
14
42
48
5000
0.25
500
HBLS1608-6N8□
6.8
10
100
14
43
50
5000
0.3
500
HBLS1608-8N2□
8.2
10
100
14
43
48
4500
0.35
500
HBLS1608-10N□
10
12
100
15
45
50
3500
0.4
300
HBLS1608-12N□
12
12
100
18
48
50
3000
0.45
300
HBLS1608-15N□
15
12
100
18
48
50
2300
0.5
300
HBLS1608-18N□
18
12
100
16
48
51
2200
0.55
300
HBLS1608-22N□
22
12
100
16
45
48
2000
0.6
300
HBLS1608-27N□
27
12
100
16
45
45
1700
0.65
300
HBLS1608-33N□
33
12
100
16
45
41
1500
0.7
300
HBLS1608-39N□
39
12
100
17
40
48
1400
0.7
300
HBLS1608-47N□
47
12
100
17
35
35
1200
0.7
300
HBLS1608-56N□
56
12
100
17
35
30
1100
0.75
300
HBLS1608-68N□
68
12
100
17
30
20
900
0.85
300
HBLS1608-82N□
82
8
100
15
22
-
800
1
300
HBLS1608-R10□
100
8
100
15
16
-
700
1.2
300
第 13 页 共 15 页
Thichness
mm
[inch]
T
0.8±0.15
[.031±.006]
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
HYSP-HL000XX
文件编号 Document number:
A2
版本编码 Version number:
HBLS1608-R12□
120
8
50
15
-
-
600
1.4
200
HBLS1608-R15□
150
8
50
15
-
-
500
1.6
200
HBLS1608-R18□
180
8
50
15
-
-
400
1.9
200
HBLS1608-R22□
220
8
50
15
-
-
350
2.4
200
HBLS1608-R27□
270
8
50
16
-
-
350
2.6
150
HBLS1608-R33□
330
8
50
16
-
-
350
2.8
150
HBLS1608-R39□
390
8
50
16
-
-
300
3.2
150
HBLS1608-R43□
430
8
50
16
-
-
280
3.4
150
HBLS1608-R47□
470
8
50
15
-
-
250
3.6
150
HBLS1608-R56□
560
8
50
15
-
-
250
4
100
HBLS1608-R68□
680
8
50
15
-
-
250
4.5
100
*请选用时注明公差(B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,±5%;K,±10%)Please specify
the inductance tolerance code(B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,±5%;K,±10%).
HBLS2012 Series
Mini.
Part Number
Inductance
Quality
Factor
L,Q test
frequency
Mini.self
resonant
frequency
Max.DC
Max.rated
resistance
Current
Unit
μH
-
MHz
MHz
Ω
mA
Symbol
L
Q
Freq.
S.R.F
DCR
Ir
HBLS2012-1N0□
1
10
100
>3000
0.1
600
HBLS2012-1N5□
1.5
10
100
>3000
0.1
600
HBLS2012-1N8□
1.8
10
100
>3000
0.1
600
HBLS2012-2N2□
2.2
10
100
>3000
0.1
600
HBLS2012-2N7□
2.7
10
100
>3000
0.1
600
HBLS2012-3N3□
3.3
10
100
>3000
0.13
600
HBLS2012-3N9□
3.9
10
100
>3000
0.15
600
HBLS2012-4N7□
4.7
10
100
>3000
0.2
400
HBLS2012-5N6□
5.6
10
100
>3000
0.23
400
HBLS2012-6N8□
6.8
10
100
>3000
0.25
400
HBLS2012-8N2□
8.2
10
100
>3000
0.28
400
HBLS2012-10N□
10
10
100
2500
0.3
300
HBLS2012-12N□
12
10
100
2450
0.3
300
HBLS2012-15N□
15
10
100
2000
0.4
300
HBLS2012-18N□
18
10
100
1750
0.45
300
HBLS2012-22N□
22
10
100
1700
0.5
300
HBLS2012-27N□
27
10
100
1550
0.55
300
HBLS2012-33N□
33
10
100
1350
0.6
300
HBLS2012-39N□
39
13
100
1300
0.65
300
第 14 页 共 15 页
Thichness
Mm
[inch]
T
0.85±0.20
深圳市宏业兴电子有限公司
Shenzhen HongyeX Electronics Co.,Ltd.
HYSP-HL000XX
文件编号 Document number:
版本编码 Version number:
HBLS2012-47N□
47
15
100
1200
0.7
300
HBLS2012-56N□
56
15
100
1150
0.75
300
HBLS2012-68N□
68
15
100
1000
0.8
300
HBLS2012-82N□
82
15
100
850
0.9
300
HBLS2012-R10□
100
15
100
600
1
300
HBLS2012-R12□
120
15
50
500
1.5
300
HBLS2012-R15□
150
15
50
500
1.5
300
HBLS2012-R22□
220
13
50
350
2.1
200
A2
*请选用时注明公差(B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,±5%;K,±10%)Please specify
the inductance tolerance code(B,±0.1nH;C,±0.2nH;S,±0.3nH;G,±2%;H,±3%;J,±5%;K,±10%).
第 15 页 共 15 页