HCB2012KF-400T30

TAI-TECH KBM01-230400059 High Current Ferrite Chip Bead(Lead Free) 1.Features P2. HCB2012KF-400T30 Halogen 1. Monolithic inorganic material construction. Halogen-free 2. Closed magnetic circuit avoids crosstalk. 3. Suitable for reflow soldering. 4. Shapes and dimensions follow E.I.A. spec. 5. Available in various sizes. 6. Excellent solder ability and heat resistance. 7. High reliability. 8. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 9. Low DC resistance structure of electrode to prevent wasteful electric power consumption. 10. Operating Temperature：-55~+125℃(Including self-temperature rise) 2.Dimensions Chip Size A 2.00±0.20 B 1.25±0.20 C 0.85±0.20 D 0.50±0.30 Units: mm 3.Part Numbering HCB 2012 KF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 400 T 30 D E F LxW Lead Free Material 400=40Ω T=Taping and Reel, B=Bulk(Bags) 30=3000 mA 4.Specification ● Impedance (Ω) Test Frequency (Hz) DC Resistance (Ω) max. Rated Current (mA) max. HCB2012KF-400T30 40±25% 60mV/100M 0.04 3000 Rated current: based on temperature rise test In compliance with EIA 595 „ Impedance-Frequency Characteristics HCB2012KF-400T30 80 IMPEDANCE(Ohm) ● Tai-Tech Part Number 60 Z 40 20 X R 0 1 10 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 TAI-TECH KBM01-230400059 P3. 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCB Test Condition GHB FCA -55~+125℃ (Including self-temperature rise) -55~+125℃ (on board) Transportation Storage Temperature --For long storage conditions, please see the Application Notice Agilent4291 Agilent E4991 Impedance (Z) Agilent4287 Refer to standard electrical characteristics list Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Temperature Rise Test Rated Current < 1A ∆T 20℃Max Rated Current ≧ 1A ∆T 40℃Max Life test Appearance: no damage. Impedance: within±15%of initial value. RDC：within ±15% of initial value and shall not exceed the specification value Load Humidity Appearance: no damage. Thermal shock Vibration Bending Impedance: within±15%of initial value. RDC：within ±15% of initial value and shall not exceed the specification value 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preconditioning: Run through reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Temperature: 125±2℃ Applied current: rated current. Duration: 1000±12hrs. Measured at room temperature after placing for 24±2 hrs. Preconditioning: Run through reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Humidity: 85±2%R.H. Temperature: 85±2℃. Duration:1000hrsMin.Bead:with100%ratedcurr ent ， Inductance: with 10% rated current Measured at room temperature after placing for 24±2 hrs. Preconditioning: Run through reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Condition for 1 cycle Step1: -55±2℃ 30±5 min. Step2: 125±2℃ ≦0.5min Step3: 125±2℃ 30±5min. Number of cycles: 500 Measured at room temperature after placing for 24±2 hrs. Appearance：No damage. Impedance：within±15% of initial value RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles) Oscillation Frequency: 10Hz ～ 2KHz ～ 10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:10g Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Appearance：No damage. Impedance：within±10% of initial value RDC：within ±15% of initial value and shall not exceed the specification value Shall be mounted on a FR4 substrate of the following dimensions: >=0805inch(2012mm):40x100x1.2mm =0805inch(2012mm):1.2mm 0805inch(2012mm):1kg