MTC160808-1R0MT

Specification Sheet for SMD Power Inductor Specification Sheet for Approved Customer Name: Customer Part No.: Ceaiya Part No: MTC160808 Series Spec No: T1608 【For Customer Approval Only】 If you Approval, Please Stamp 【RoHS Compliant Parts】 Approved By 李庆辉 Checked By Prepared By 刘志坚 劳水花 Shenzhen Ceaiya Electronics Co., Ltd. 地址 1: 深圳市龙华区观澜街道银星智界一期综合楼 716 号 地址 2：广东省东莞清溪镇青滨东路 105 号力合紫荆智能制造中心 10 栋 Http//www.szceaiya.com Tel: 0769-89135516 Fax: 0769-89135519 1 Specification Sheet for SMD Power Inductor 【Version of Changed Record】 Rev. Effective Date Changed Contents Change Reasons Approved By A0 2022-06-09 New release / Li qing hui 2 Specification Sheet for SMD Power Inductor 1. Scope This specification applies to the MTC160808 Series of wire wound SMD power inductor. 2. Product Description and Identification (Part Number) 1) Description: MTC160808 series of Wire wound SMD power inductor. 2) Product Identification (Part Number) MTC 160808 - 1R0 M T ① ② ③ ④ ⑤ ① Type MTC ② Mini Molded Chip Power Inductor ③ External Dimensions(L×W×H) 【mm】 160808 1.6×0.8×0.8 Nominal Inductance Example Example 1R0 1.0uH 100 10uH 101 100uH ⑤ ④ Inductance Tolerance N ±30% M ±20% Packing T Tape Carrier Package 3. Electrical Characteristics Please refer to Item 5. 1） Operating temperature range (individual chip without packing): -40℃ ~ +125℃ （Including Self-heating）. 2） Storage temperature range (packaging conditions): -10℃ ~ +40℃ and RH 70% (Max.). 4. Shape and Dimensions (Unit:mm) Dimensions and recommended PCB pattern for reflow soldering, please see Fig4-1 and Table4-1 Shape and Dimensions: Recommended pad: Fig4-1. Table 4-1. A B 1.6±0.2 0.8±0.2 C D a 0.90Max 0.50±0.2 0.70 Ref b c 0.55 Ref 1.0 Ref 3 Specification Sheet for SMD Power Inductor 5. Electrical Characteristics Inductance Part Number DC Resistance Saturation Current Heat Rating Current 1MHz/1V Max. Typ. Max. Typ. Max. Typ. Units uH Ω Ω A A A A Symbol L MTC160808-1R0MT 1.0±20% 20% 0.140 0.115 2.0 2.3 1.3 1.6 MTC160808-2R2MT 2.2±20% 20% 0.300 0.250 1.2 1.4 0.9 1.0 DCR Isat Irms Note:※1: 1: Rated current: Isat(max.)or Irms(max.),whichever is smaller; ※2: Saturation Current: Max. Value, DC current at which the inductance drops less than 30% from its value without current; Typ. Value, DC current at which the inductance drops 30% from its value without current; ※3: 3: Irms: DC current that causes the temperature rise (△T) from 20℃ ambient. For Max. Value, △T＜40℃;; for Typ. Value, △T is approximate 40℃. The part temperature (ambient + temp. rise) should not exceed 125℃ 125 under worst case operating conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. ※4:Absolute Absolute maximum voltage:DC 20V 2 6. Structure The structure of MTC160808 product. ① ② NO. ① Components Core Material Soft magnetic Metal ② Wire Polyurethane system enameled copper wire ③-1 ③-2 Electrodes Inside Cu Ni+Sn Plating Chemicals △f: Clearance between terminal and the surface of plate must be 0.12mm 0. mm max when coil is placed on a flat plate. 4 Specification Sheet for SMD Power Inductor 7. Reliability Test Items Requirements 7.1 Bonding Strength 7.2 Bending Strength Test Methods and Remarks It shall be soldered on the substrate. Applying Force(F): 10N Hold Duration: 5s Chip coil shall not be damaged. Substrate: Glass-epoxy substrate (100×40×1.0mm) Speed of Applying Force: 0.5mm / s Deflection: 2mm Hold Duration: 20s 7.3 Vibration 7.4 Solderability No visible mechanical damage. Inductance change: Within ±10% 1) Solder the inductor to the testing jig (glass epoxy board) using eutectic solder. 2) The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. 3) The frequency range from 10 to 55Hz and return to 10Hz shall be traversed in approximately 1 minute. this motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours). The wetting area of the electrode shall Flux:Ethanol solution of rosin,25(wt)% be at least 90% covered with new Solder : Sn-3.0Ag-0.5Cu solder coating. Pre-Heating:150±10°C / 60 to 90s Solder Temperature:245±5°C Immersion Time:3 s 7.5 Resistance to Soldering Heat Appearance:No damage Reflow soldering method Inductance Change : within ±10% Flux: Ethanol solution of rosin,25(wt)% Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150 to 180°C / 60 to 120s Solder Temperature: 230°C min. / 20 to 40s Peak Temperature: 250+5/-0°C Reflow times: 2 times max Test board shall be 0.8 mm thick. Base material shall be glass epoxy resin. Then measured after exposure Standard atmospheric conditions for 1~2h. 5 Specification Sheet for SMD Power Inductor 7. Reliability Test Items Requirements 7.6 Heat Test Methods and Remarks Temperature: 125±2°C Time: 500h (±12h) Resistance Then measured after exposure Standard atmospheric conditions for 1~2h. 7.7 Cold Temperature: -40±2°C Time: 500h (±12h) Resistance Then measured after exposure Standard atmospheric conditions for 1~2h. Appearance:No damage 7.8 Humidity Inductance Change : within ±10% Temperature: 40±2°C Humidity: 90 to 95%(RH) Time: 500h (±12h) Then measured after 7.9 Temperature Cycle 1 cycle: 1 step: -40±2°C / 30±3m 2 step: Ordinary temp. / 3m max. 3 step: +125±2°C / 30±3m 4 step: Ordinary temp. / 3m max. Total of 100 cycles Then measured after exposure Standard atmospheric conditions for 1~2h. 6 Specification Sheet for SMD Power Inductor 8.Packaging and Marking: 8-1.Carrier Tape Dimensions: E P P2 W F P0 ITEM W A0 B0 K0 P F E D0 P0 P2 T DIM 8.00 1.0 1.80 1.10 4.00 3.5 1.75 1.50 4.00 2.00 0.20 TOLE ±0.3 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 +0.1 ±0.1 ±0.1 ±0.05 8-2.Taping Dimensions: 8-3.Reel Dimensions: Carrier Tape Reel B A C N G Type A 8mm 178 B 20.7±0.8 C 13±0.4 G N T 9 60 10.8 8-4. Packaging Quantity: 3KPCS/ Reel 7