SP3022-01ETG-MS

www.msksemi.com SP3022-01ETG-MS Semiconductor Compiance Applications  Cellular phones audio  MP3 players  Digital cameras 1  Portable applicationss  mobile telephone 2 Features  Low Leakage  Response Time is Typically < 1 ns  ESD Rating of Class 3 (> 16 kV) per Human Body Model  IEC61000−4−2 Level 4 ESD Protection  We declare that the material of product compliant with RoHS requirements and Halogen Free.  S- prefix for automotive and other applications requiring unique site and control change requirements; AEC-Q101 qualified and PPAP capable. SOD882 1 2 ELECTRICAL CHARACTERISTICS P/N SP3022-01ETG-MS IT VC (V) @ IPP = 1 A (Note 3) VC (V) @MAX IPP (Note 3) Min mA Max Max 6 1.0 12 VRWM (V) IR (µA) @ VRWM VBR (V) @ IT (Note 2) Max Max 5 0.5 IPP(A) PPK(W) (Note 3) (Note 3) C (pF) Max Max Typ Max 4 80 0.25 0.3 20 Other voltage available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25℃ 3. Surge current waveform per Figure 1. MAXIMUM RATINGS Rating Symbol IEC 61000-4-2 (ESD) ESD Voltage discharge Air Contact discharge Per Human Body Model Value Unit ±30 ±30 kV kV 16 kV Total Power Dissipation on FR-5 Board (Note 1) @ TA=25℃ PD 200 mW Junction and Storage Temperature Range TJ,TSTG -55 to 150 ℃ Lead Solder Temperature – Maximum (10 Second Duration) TL 260 ℃ Stresses exceeding Maximum Ratings may damage the device. Maximum Rating are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0*0.75*0.62 in. www.msksemi.com SP3022-01ETG-MS Semiconductor Compiance Electrical Parameter Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM IT Test Current VBR Breakdown Voltage @ IT FIG1: Pulse Waveform FIG2:Power Derating www.msksemi.com SP3022-01ETG-MS Semiconductor Compiance PACKAGE MECHANICAL DATA A Dim B C R D E MIN Millimeters MAX MIN MAX A 0.0125 0.02 0.32 0.52 B 0.000 0.002 0.00 0.05 C 0.037 0.043 0.95 1.080 D 0.022 0.027 0.55 0.680 E 0.016 0.024 0.40 0.60 F 0.008 0.012 0.20 0.30 H R F Inches 0.015Typ. 0.001 0.40Typ. 0.005 0.05 0.15 H 1.20 0.50 0.60 0.70 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. REEL SPECIFICATION P/N SP3022-01ETG-MS PKG QTY SOD-882 10000 www.msksemi.com SP3022-01ETG-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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