HXY
SI2323
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
HUAXUANYANG
Description
The SI2323 uses advanced trench technology to
provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 2.5V.
D
This device is suitable for use as a
S
Battery protection or in other Switching application.
G
SOT-23
General Features
VDS = -20V,ID = -5A
RDS(ON) < 45mΩ @ VGS=4.5V
D
Application
High power and current handing capability
Lead free product is acquired
G
Surface mount package
PWM applications
S
Load switch
P-Channel MOSFET
Power management
Package Marking and Ordering Information
Product ID
Pack
Marking
Qty(PCS)
SI2323
SOT-23
A5SHB
3000PCS
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Symbol
Parameter
Limit
Unit
VDS
Drain-Source Voltage
-20
V
VGS
Gate-Source Voltage
±12
V
ID
Drain Current-Continuous
-5
A
IDM
Drain Current-Pulsed (Note 1)
-14
A
PD
Maximum Power Dissipation
1.31
W
-55 To 150
℃
120
℃/W
TJ,TSTG
RθJA
Operating Junction and Storage Temperature Range
Thermal Resistance,Junction-to-Ambient (Note 2)
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www.hxymos.com
HXY
SI2323
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
HUAXUANYANG
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
2
Static Drain-Source On-Resistance
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=-250uA
-20
---
---
V
Reference to 25℃ , ID=-1mA
---
-0.014
---
V/℃
VGS=-4.5V , ID=-4.9A
---
35
45
VGS=-2.5V , ID=-3.4A
---
45
60
VGS=-1.8V , ID=-2A
---
65
85
-0.4
---
-1.0
V
---
3.95
---
mV/℃
VDS=-16V , VGS=0V , TJ=25℃
---
---
-1
VDS=-16V , VGS=0V , TJ=55℃
---
---
-5
VGS=VDS , ID =-250uA
m
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±12V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=-5V , ID=-3A
---
12.8
---
S
Qg
Total Gate Charge (-4.5V)
---
10.2
14.3
---
1.89
2.6
VDS=-15V , VGS=-4.5V , ID=-3A
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
---
3.1
4.3
Td(on)
Turn-On Delay Time
---
5.6
11.2
uA
nC
Rise Time
VDD=-10V , VGS=-4.5V ,
---
40.8
73
Turn-Off Delay Time
RG=3.3, ID=-3A
---
33.6
67
Fall Time
---
18
36
Ciss
Input Capacitance
---
857
1200
Coss
Output Capacitance
---
114
160
Crss
Reverse Transfer Capacitance
---
108
151
Min.
Typ.
Max.
Unit
---
---
-4.9
A
---
---
-14
A
VGS=0V , IS=-1A , TJ=25℃
---
---
-1
V
Tr
Td(off)
Tf
VDS=-15V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
IS
ISM
Parameter
Continuous Source Current
Pulsed Source Current
Conditions
1,4
2,4
2
VG=VD=0V , Force Current
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
IF=-3A , di/dt=100A/µs ,
---
21.8
---
nS
Qrr
Reverse Recovery Charge
TJ=25℃
---
6.9
---
nC
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
Shenzhen HuaXuanYang Electronics CO.,LTD
www.hxymos.com
HXY
SI2323
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
HUAXUANYANG
Typical Characteristics
100
RD S O N( m Ω )
-ID=3A
80
60
40
1
2
3
-VGS (V)
4
5
Fig.2 On-Resistance vs. G-S Voltage
Fig.1 Typical Output Characteristics
-IS Source Current(A)
4
3
TJ=150℃
TJ=25℃
2
1
0
0
0.2
0.4
0.6
0.8
1
-VSD , Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics of Reverse
Fig.4 Gate-charge Characteristics
diode
1.8
Normalized On Resistance
1.8
Normalized VGS(th)
1.4
1
0.6
1.4
1.0
0.6
0.2
0.2
-50
0
50
100
TJ ,Junction Temperature (℃ )
Fig.5 Normalized VGS(th) vs. TJ
Shenzhen HuaXuanYang Electronics CO.,LTD
150
-50
0
50
100
150
TJ , Junction Temperature (℃)
Fig.6 Normalized RDSON vs. TJ
www.hxymos.com
HXY
SI2323
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
HUAXUANYANG
1000
100.00
Ciss
100us
10ms
-ID (A)
C (pF)
10.00
Coss
100
100ms
1.00
Crss
1s
0.10
DC
TA=25℃
Single Pulse
F=1.0MHz
10
0.01
1
5
9
13
17
21
0.1
-VDS (V)
Fig.7 Capacitance
1
10
-VDS (V)
100
Fig.8 Safe Operating Area
Normalized Thermal Response (R θJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
PDM
0.001
TON
SINGLE PULSE
T
D = TON/T
TJpeak = TC + PDM x RθJC
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
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Fig.11 Gate Charge Waveform
www.hxymos.com
HXY
SI2323
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
HUAXUANYANG
SOT-23 Package Outline Dimensions
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Dimensions In Millimeters
Min
Max
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950 TYP
1.800
2.000
0.550 REF
0.300
0.500
0°
8°
Dimensions In Inches
Min
Max
0.035
0.045
0.000
0.004
0.035
0.041
0.012
0.020
0.003
0.006
0.110
0.118
0.047
0.055
0.089
0.100
0.037 TYP
0.071
0.079
0.022 REF
0.012
0.020
0°
8°
SOT-23 Suggested Pad Layout
Shenzhen HuaXuanYang Electronics CO.,LTD
www.hxymos.com
HXY
SI2323
ELECTRONICS CO.,LTD
P-Channel Enhancement Mode MOSFET
HUAXUANYANG
Attention
■ Any and all HUA XUAN YANG ELECTRONICS products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications
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