WW12WR082FTL

Approval sheet WW25W, WW20W, WW10W, WW12W, WW08W, WW06W ±1%, ±5% Thick Film Normal Low Ohm Chip Resistors RoHS Exemption free and Lead free Size 2512, 2010, 1210, 1206, 0805, 0603 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxW_V01 FEB - 2016 Approval sheet FEATURE 1. High power rating and low TCR 2. High reliability and stability 3. Reduced size of final equipment 4. RoHS exemption free and Lead free products APPLICATION • Power supply • PDA • Digital meter • Computer • Automotives • Battery charger • DC-DC power converter DESCRIPTION The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to nominated value within tolerance which controlled by laser trimming of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is Tin (lead free) alloy. Fig 1. Construction of Chip-R Page 2 of 8 ASC_WWxxW_V01 FEB - 2016 Approval sheet QUICK REFERENCE DATA Item General Specification Series No. WW25W WW20W WW10W WW12W WW08W WW06W Size code 2512 (6432) 2010 (5025) 1210 ( 3225 ) 1206 ( 3216 ) 0805 ( 2012 ) 0603 ( 1608 ) ±5%, ±1% Resistance Tolerance Resistance 0.010Ω ~ 0.910Ω, 0.050Ω ~ 0.910Ω, E24 E24 Range TCR (ppm/°C) Max. dissipation at Tamb=70°C 10 - 20mΩ: ±1000 10 - 20mΩ: ±1000 10 - 20mΩ: ±600 10 - 20mΩ: ±1000 10 - 20mΩ: ±1000 50 - 91mΩ: ±400 22 - 39mΩ: ±600 22 - 39mΩ: ±600 22 - 39mΩ: ±400 22 - 39mΩ: ±600 22 - 39mΩ: ±600 100 - 910mΩ: ±200 40 - 47mΩ: ±200 40 - 47mΩ: ±200 40 - 47mΩ: ±200 40 - 47mΩ: ±200 40 - 47mΩ: ±400 50 - 91mΩ: ±100 50 - 91mΩ: ±100 50 - 91mΩ: ±100 50 - 91mΩ: ±100 50 - 91mΩ: ±200 100 - 910mΩ: ±100 100 - 910mΩ: ±100 100 - 910mΩ: ±100 100 - 910mΩ: ±100 100 - 910mΩ: ±100 1W 3/4W 2/3 W 1/3 W 1/4 W Operation 1/8 W -55 ~ +155’C temperature MECHANICAL DATA Symbol WW25W WW20W WW10W WW12W WW08W WW06W L 6.30 ± 0.20 5.00 ± 0.20 3.10 ± 0.10 3.10 ± 0.10 2.00 ± 0.10 1.60 ± 0.10 W 3.10 ± 0.20 2.50 ± 0.20 2.60 ± 0.10 1.60 ± 0.10 1.25 ± 0.10 0.80 ± 0.10 T 0.60 ± 0.15 0.60 ± 0.10 0.55 ± 0.10 0.55 ± 0.10 0.50 ± 0.10 0.45 ± 0.10 Tt 0.60 ± 0.25 0.60 ± 0.25 0.50 ± 0.25 0.50 ± 0.25 0.40 ± 0.20 0.30 ± 0.20 Tb 0.90 ± 0.25 0.60 ± 0.25 0.50 ± 0.25 0.50 ± 0.25 0.40 ± 0.20 0.30 ± 0.20 RECOMMENDED SOLDERING PAD Symbol WW25W WW20W WW10W WW12W WW08W WW06W WL 3.70mm 3.00mm 3.00mm 1.80mm 1.30mm 0.90mm D 1.60mm 1.50mm 1.30mm 1.30mm 1.15mm 1.00mm L 7.60mm 6.80mm 4.70mm 4.70mm 3.50mm 3.00mm Page 3 of 8 ASC_WWxxW_V01 FEB - 2016 Approval sheet MARKING
4-digits marking for 2512, 2010, 1210, 1206, 0805 size Each resistor is marked with a four-digit code on the protective coating to designate the nominal resistance value.
3-digits marking for 0603 size
Each resistor is marked with a three -digit code on the protective coating to designate the nominal resistance value. Page 4 of 8 ASC_WWxxW_V01 FEB - 2016 Approval sheet FUNCTIONAL DESCRIPTION Product characterization Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±5% & ±1%. The values of the E24 series are in accordance with “IEC publication 60063”. Derating curve The power that the resistor can dissipate depends on the operating temperature; see Fig.2 Figure 2 Maximum dissipation in percentage of rated power as a function of the ambient temperature MOUNTING Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact. SOLDERING CONDITION The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no leaching is 260°C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. Fig 3. Infrared soldering profile Page 5 of 8 ASC_WWxxW_V01 FEB - 2016 Approval sheet CATALOGUE NUMBERS The resistors have a catalogue number starting with: WW12 W R020 F T Size code Type code Resistance code Tolerance Packaging code WW25 : 2512 W : Thick film Power low ohm low TCR 0.020Ω = R020 J : ±5% T : 7” Reel taping 0.510Ω = R510 F : ±1% Q : 10” Reel taping WW20 : 2010 WW10 : 1210 L Termination code L = Sn base (lead free) G : 13” Reel taping 0.025Ω = R025 WW12 : 1206 WW08 : 0805 WW06 : 0603 Tape packaging WW10, WW12,WW08, WW06 : 8mm width paper taping 5,000pcs per 7” reel; 10,000pcs per 10” reel; 20,000pcs per 13” reel. WW25, WW20: 12mm width emboss taping 4,000pcs per 7” reel; 8,000pcs per 10” reel; 16,000pcs per 13” reel. Page 6 of 8 ASC_WWxxW_V01 FEB - 2016 Approval sheet TEST AND REQUIREMENTS(JIS C 5201-1 : 1998) TEST Temperature Coefficient of Resistance(T.C.R) Clause 4.8 PROCEDURE Natural resistance change per change in degree centigrade. R2 − R1 × 106 R1 (t2 − t1 ) REQUIREMENT Refer to “QUICK REFERENCE DATA” (ppm/°C) t1 : 25°C R1 : Resistance at reference temperature 25°C R2 : Resistance at test temperature 155°C Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 5second application of a 5 J: ∆R/R max. ±(2%+0.5mΩ) times rated power. F: ∆R/R max. ±(1%+0.5mΩ) Solderability Un-mounted chips completely immersed for 3±0.5 second in a SAC good tinning (>95% covered) solder bath at 245℃±2℃ no visible damage Clause 4.17 Resistance to soldering heat(R.S.H) Clause 4.18 Temperature cycling Clause 4.19 Load life (endurance) Clause 4.25 Load life in Humidity Clause 4.24 Bending strength Un-mounted chips completely immersed for 10±1 second in a SAC no visible damage solder bath at 260℃±5ºC J: ∆R/R max. ±(1%+0.5mΩ) F: ∆R/R max. ±(0.5%+0.5mΩ) 30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous cycles no visible damage J: ∆R/R max. ±(1%+0.5mΩ) F: ∆R/R max. ±(0.5%+0.5mΩ) 1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller J: ∆R/R max. ±(3%+0.5mΩ) 70±2ºC, 1.5 hours on and 0.5 hours off F: ∆R/R max. ±(1%+0.5mΩ) 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber J: ∆R/R max. ±(3%+0.5mΩ) controller at 40°C±2°C and 90~95% relative humidity, 1.5hours on F: ∆R/R max. ±(1%+0.5mΩ) and 0.5 hours off Clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4); no visible damage bending : 3mm for 0603/0805, 2mm for 1206 and above sizes, once J: ∆R/R max. ±(1%+0.5mΩ) for 10 seconds F: ∆R/R max. ±(0.5%+0.5mΩ) Adhesion Pressurizing force: 5N, Test time: 10±1sec. Clause 4.32 Insulation Resistance No remarkable damage removal of the terminations Test voltage: 100+/-15V I.R≧1GΩ or Clause 4.6 Page 7 of 8 ASC_WWxxW_V01 FEB - 2016 Approval sheet PACKAGING Paper Tape specifications (unit :mm) Series No. A B W WW25W 6.70±0.20 3.50±0.20 12.00±0.30 WW20W 5.50±0.20 2.80±0.20 12.00±0.30 WW10W 3.60±0.20 3.00±0.20 WW12W 3.60±0.20 2.00±0.20 WW08W 2.40±0.20 1.65±0.20 WW06W 1.90±0.20 1.10±0.20 Series No. P1 P0 F E 3.50±0.20 1.75±0.10 8.00±0.30 ΦD T WW25W Max. 1.2 WW20W Max. 1.2 WW10W 4.00±0.10 4.00±0.10 WW12W Φ1.50 +−00..10 Max. 1.0 Max. 1.0 WW08W Max. 1.0 WW06W Max. 0.8 Reel dimensions Page 8 of 8 Symbol A B 7” reel Φ178.0±2.0 Φ60.0±1.0 10” reel Φ254.0±2.0 Φ100.0±1.0 13: reel Φ330.0±2.0 Φ100.0±1.0 C D 10.0±1.5 ( 8mm tape ) 13.0±0.5 ASC_WWxxW_V01 13.8±1.5 (12mm tape) FEB - 2016