ST0524D25

ST0524D25 Ultra Low Capacitance TVS Arrays Description Mechanical Characteristics The ST0524D25 is an uni-directional TVS diode array, utilizing leading monolithic silicon technology to provide fast response time and low ESD clamping voltage, making this device an ideal solution for protecting voltage sensitive high-speed data lines. The ST0524D25 has an ultra-low capacitance with a typical value at 0.3pF, and complies with the IEC 61000-4-2 (ESD) standard with ±15kV air and ±8kV contact discharge. It is assembled into an flow through lead-free DFN package. The small size, ultra-low capacitance and high ESD surge protection make ST0524D25 an ideal choice to protect cell phone, digital video interfaces and other high speed ports. ♦ Package: DFN2510-10 ♦ Lead Finish: NiPdAu ♦ Case Material: “Green” Molding Compound. ♦ UL Flammability Classification Rating 94V-0 ♦ Moisture Sensitivity: Level 3 per J-STD-020 ♦ Terminal Connections: See Diagram Below ♦ Marking Information: See Below Applications Features ♦ Low capacitance: 0.3 pF typical ♦ Cellular Handsets and Accessories ♦ Ultra low leakage: nA level ♦ Display Ports ♦ Low operating voltage: 5V ♦ MDDI Ports ♦ Low clamping voltage ♦ USB Ports ♦ 10-pin leadless package ♦ Digital Video Interface (DVI) ♦ Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±18kV Contact discharge: ±10kV – IEC61000-4-4 (EFT) 40A (5/50ns) – IEC61000-4-5 (Lightning) 5A (8/20µs) ♦ PCI Express and Serial SATA Ports Ordering Information ♦ RoHS Compliant PIN Identification and Configuration 10 9 8 7 Part Number Packaging Reel Size ST0524D25 3000/Tape & Reel 7 inch Circuit Diagram 6 Pin 1 1 2 3 4 Pin 2 Pin 4 Pin 5 5 3, 8 Rev. 6_Aug, 2014 1 of 6 www.sursemi.com ST0524D25 Absolute Maximum Ratings (TA=25˚C unless otherwise specified) Parameter Symbol Value Unit Peak Pulse Power (8/20µs) Ppk 150 W Peak Pulse Current (8/20µs) IPP 5 A ESD per IEC 61000−4−2 (Air) ±18 VESD ESD per IEC 61000−4−2 (Contact) Operating Temperature Range Storage Temperature Range kV ±10 TJ −55 to +125 °C Tstg −55 to +150 °C Electrical Characteristics (TA=25˚C unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR 6.4 Max Unit Test Condition 5 V 9 V IT = 1mA Reverse Leakage Current IR 0.5 uA VRWM = 5V Clamping Voltage VC 15 V IPP = 1A (8 x 20µs pulse) Junction Capacitance CJ 0.3 0.4 pF VR = 0V, f = 1MHz, beween I/O pins Junction Capacitance CJ 0.3 0.6 pF VR = 0V, f = 1MHz, any I/O to ground Rev. 6_Aug, 2014 2 of 6 www.sursemi.com ST0524D25 Typical Performance Characteristics (TA=25˚C unless otherwise specified) 10 Peak Pulse Power_Ppp (W) Junction Capacitance_Cj (pF) 1 0.8 0.6 0.4 0.2 0 1 0.1 0.01 0 1 2 3 4 Reverse Voltage_VR (V) 5 0.1 1 10 100 1000 Pulse Duration_tp (us) Peak Pulse Power vs. Pulse Time Junction Capacitance vs. Reverse Voltage 120 % of Rated Power 100 80 60 40 20 0 0 Clamping Voltage vs. Peak Pulse Current 25 50 75 100 125 Ambient Temperature_Ta(℃) 150 Power Derating Curve 100 % of Peak Pulse Current 90 80 70 60 50 40 30 20 10 0 0 20 40 Time_t(uS) 60 80 ESD Clamping Voltage 8 X 20uS Pulse Waveform 8 kV Contact per IEC61000−4−2 Rev. 6_Aug, 2014 3 of 6 www.sursemi.com ST0524D25 Applications Information Design Recommendations for HDMI Protection Adding external ESD protection to HDMI ports can be challenging. First, ESD protection devices have an inherent junction capaci tance. Furthermore, adding even a small amount of capacitance will cause the impedance of the differential pair to drop. Second, large packages and land pattern requirements cause discontinuities that adversely affect signal integrity. The ST0524D25 are specifi cally designed for protection of high-speed interfaces such as HDMI. They present ±8kV ESD contact discharges (>±15kV air discharge) as outlined in IEC 61000-4-2. Each device is in a leadless DFN package that is less than 1.1mm wide. They are designed such that the traces flow straight through the device. The narrow package and flow-through design reduces discontinuities and minimizes impact on signal integrity. This becomes even more critical as signal speeds increase. Pin Configuration Figure 1 is an example of how to route the high speed differential traces through the ST0524D25. The solid line represents the PCB trace. The PCB traces are used to connect the pin pairs for each line (pin 1 to pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6). For example, line 1 enters at pin 1 and exits at Pin 10 and the PCB trace connects pin 1 and 10 together. This is true for lines connected at pins 2, 4, and 5 also. Ground is connected at pins 3 and 8. One large ground pad should be used in lieu of two separate pads. HDMI Connector 12 11 10 1 GND GND 9 8 7 1 6 5 4 GND GND 3 2 1 Figure 1. Flow Through Layout Using ST0524D25 Rev. 6_Aug, 2014 4 of 6 www.sursemi.com ST0524D25 HDMI Protection Data 2+ Data 2Data 1+ Data 1- To HDMI Graphics Chip Data 0+ Data 0-Clk+ Clk- ST0524D25 (3(3 Each) RClamp0544T Each) CEC SCL SDA HP Detect 5VPower Gnd Rev. 6_Aug, 2014 5 of 6 www.sursemi.com ST0524D25 DFN2510-10 Package Outline Drawing SYM A TOP VIEW SIDE VIEW DIMENSIONS MILLIMETERS MIN NOM MAX MIN 0.45 0.50 0.55 0.018 INCHES NOM MAX 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.35 0.40 0.45 0.014 0.016 0.018 b2 0.20 0.25 0.30 0.008 0.010 0.012 c 0.10 0.15 0.20 0.004 0.006 0.008 D 2.45 2.50 2.55 0.098 0.100 0.102 e 0.50BSC Nd 2.00BSC 0.020BSC 0.080BSC E 0.95 1.00 1.05 0.038 0.040 0.042 L 0.35 0.40 0.45 0.014 0.016 0.018 L1 0.075REF L2 0.003REF 0.050REF 0.002REF h 0.08 0.12 0.15 0.003 0.005 0.006 R 0.05 0.10 0.15 0.002 0.004 0.006 BOTTOM V IEW Suggested Land Pattern SYM DIMENSIONS MILLIMETERS INCHES X1 0.200 0.008 X2 0.400 0.016 X3 0.500 0.020 Y 0.600 0.024 Z 1.400 0.056 Contact Information Sursemi Technologies,Inc. 396 Arbor Court, Simi Valley, CA 93065 Phone: (805) 402-0326 Email: sales@sursemi.com Sursemi Co., Ltd. reserves the right to make changes to the product specification and data in this document without notice. Sursemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Sursemi assume any liability arising from the application or use of any products or circuits, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Rev. 6_Aug, 2014 6 of 6 www.sursemi.com