X252016MOB4SI

CRYSTAL UNIT YSX211SL Applications Small Size Features ‧SmartWearable ‧Dimensions:2.05 x 1.65 x 0.50 mm. ‧High precision and high frequency stability. IOT Communication. ‧Standard Frequency: 16~54MHz ‧Excellent heat resistance and environmental characteristics. Specifications Standard Frequency 16~54MHz or 96MHZ Vibration Mode AT Fundamental Load Capacitance 8pF,9pF,12pF,or specify Frequency Tolerance (at 25 ) ±10ppm,±20ppm,or specify Frequency Versus Temperature Characteristics ±20ppm,or specify Operating Temperature -40~+85℃ Storage Temperature -40~+85℃ or specify Shunt Capacitance 3 pF Max. Level of Drive 10~200μWMax.(100uW typical) Aging (at 25 ℃ ) ±3ppm/year Max. Equivalent Series Resistance(ESR) 16 ~ 30 MHz 31 ~ 54 MHz Dimensions and Patterns [unit:mm] 100 Ω Max. 80 Ω Max. Package Size – Dimensions (Unit: mm) 2.00±0.10 1.60±0.10 3 4 Marking To p Vi e w 2 0 . 90 0 . 80 0 . 50 0 . 80 0.475±0.10 0 . 30 2 0.5±0.10 4 1 0 . 90 0.7±0.10 1 3 To p Vi ew 2 S id e Vie w 0.575±0.10 4 GND GND 0.50Max 1 Recommended Land Pattern (Unit: mm) Sug ge s te d L a yo u t B o t to m V i ew 3 www.yxc.hk 第1页共2页 CRYSTAL UNIT YSX211SL Small Size Reflow Soldering Profile Temperature Pre Heating Temperature Tp1 ~ Tp2 = + 170 °C Heating Temperature TMlt = + 220 °C Peek Temperature TMax. = + 260 °C +260℃ TMax. +220℃ Tmlt Point of measuring In case of Solder ability Terminal. In case of Resistance to soldering heat Surface. Tp2 Tp1 35s 100s t(time) Taping Specification(Unit: mm) Size A B C D E F G H SMD-2016 180±2.0 8.0±0.3 2.30±0.1 1.90±0.1 4.0±0.1 0.95±0.1 61.0±1.0 8.0±1.0 3000 pcs per reel www.yxc.hk 第2页共2页