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Wire Wound Chip Ceramic Inductor
Page 1 of 14
S P E C I F I C AT I O N S
Customer
Product Name
Wire Wound Chip Ceramic Inductor
Sunlord Part Number
SDWL1608C
STFN
Customer Part Number
[
New Released,
Revised]
SPEC No.: SDWL0912200000
【This SPEC is total 14 pages including specifications and appendix.】
【ROHS, Halogen-Free and SVHC Compliant Parts】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China
518110
Tel: 0086-755-29832333
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For Customer approval Only】
Qualification Status:
Full
Approved By
Comments:
Verified By
Restricted
Date:
Rejected
Re-checked By
Checked By
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Wire Wound Chip Ceramic Inductor
Page 2 of 14
【Version change history】
Rev.
Effective Date
01
/
Changed Contents
New release
Change reasons
/
Approved By
Jingxin Huang
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Wire Wound Chip Ceramic Inductor
Page 3 of 14
Caution
All products listed in this specification are developed, designed and intended for use in general electronics equipment. The
products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or
quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society,
person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in
any of the applications below. Please contact us for more details if you intend to use our products in the following applications.
1. Aircraft equipment
2. Aerospace equipment
3. Undersea equipment
4. nuclear control equipment
5. military equipment
6. Power plant equipment
7. Medical equipment
8. Transportation equipment (automobiles, trains, ships,etc.)
9. Traffic signal equipment
10. Disaster prevention / crime prevention equipment
11. Data-processing equipment
12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
【Precautions】
1. Magnetic materials shall be far away from parts to avoid impacts on their electrical characteristics.
2. Parts could be damaged by external mechanical pressure or stacked heavy objects, as well as strong shaking & dropping.
3. Please do not store parts in bulk to prevent coils and parts being damaged.
4. Oversized external force to parts on PCB may lead to parts being damaged or slipped off.
5. Please do not use parts on edge or top of PCB board in your design to avoid parts being damaged during PCB is moved.
6.Please use flux contained with resin since the highly acidic (Chlorine content more than 0.2 wt%) or water-soluble one could damage
the insulation film of wires, then causing short circuit of parts.
7.Please do not use the brush to clean product or its surroundings. If you use the brush to clean product or its surroundings on
PCB,copper wire may be broke, causing the product open .
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1.
2.
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Scope
This specification applies to the SDWL1608C
Wire Wound Chip Ceramic Inductor
STFN
Page 4 of 14
of Wire Wound Chip Ceramic Inductor.
Product Description and Identification (Part Number)
1) Description
Wire Wound Chip Ceramic Inductor, 1608, XXX nH± X% @XXXMHz, XXXΩ, XXX Ma
2) Product Identification (Part Number)
SDWL
1608
C
S
T
F
N
①
②
③
④
⑤
⑥
⑦
⑧
⑨
② External Dimensions [L X W] (mm)
① Type
1608
Wire Wound Chip Inductor
SDWL
④ Nominal Inductance (nH)
③ Material Code
C
Example
Ceramic
⑤ Inductance Tolerance
C
±0.2nH
S
±0.3nH
D
±0.5nH
G
±2%
H
±3%
J
±5%
K
±10%
1.6 X 0.8
Nominal Value
1N8
1.8
10N
10
R10
100
⑥ Product Classification Code
Sn Plating
Five-faces Coating
S
⑧ HSF Products
Hazardous Substance Free Products
⑦ Packing
B
Bulk Package
T
Tape & Reel
⑨ Internal Code
N01
3.
Electrical Characteristics
Please refer to Appendix A.
1) Operating and storage temperature range (individual chip without packing): -40℃ to +125℃
2) Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.)
4.
Shape and Dimensions
1) Dimensions: See the following.
Unit：mm
A MAX.
1.8
B MAX.
1.12
C MAX.
1.02
D REF.
0.38
E REF.
F REF.
H REF.
I REF.
J REF.
0.76
0.33
1.02
0.64
0.64
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Wire Wound Chip Ceramic Inductor
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2) Electrode Coplanarity:0.1mm Max.
3) Structure: See the following.
5.
No.
Components
Material
A
Coating
Ultraviolet epoxy resin
B
Core
Ceramic
C
Wire
Polyurethane system enameled copper wire
D
Electrodes
Ag-Pd with Ni and Sn plating
Test and Measurement Procedures
5.1 Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65%±20%
c. Air Pressure: 86 KPa to 106 KPa
If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 20±2℃
b. Relative Humidity: 65%±5%
c. Air Pressure: 86KPa to 106 KPa
5.2 Visual Examination
a. Inspection Equipment: 30X magnifier
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a. Refer to Item 3.
b. Test equipment: HIOKI3540 or equivalent.
5.3.2 Inductance (L)
a. Refer to Item 3.
b. Test equipment: Agilent4287A+Agilent16197A or equivalent.
c. Test signal: -13dBm or 10mA
d. Test frequency refers to Item 3.
5.3.3 Q Factor (Q)
a. Refer to Item 3.
b. Test equipment: Agilent4287A+Agilent16197A or equivalent.
c. Test signal: -13dBm or 10mA
d. Test frequency refers to Item 3.
5.3.4 Self-Resonant Frequency (SRF)
a. Refer to Item 3.
b. Test equipment: Agilent4991B+Agilent16197A and HP 8753E or equivalent.
c. Test signal: -20dBm or 50mV
5.3.5 Rated Current
a. Refer to Item 3.
b. Test equipment (see Fig.5.3.5-1): Electric Power, Electric current meter, Thermometer.
c. Measurement method (see Fig. 5.3.5-1):
1. Set test current to be 0 mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d. Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 15℃ against
chip initial surface temperature (Ta) (see Fig. 5.3.5-2).
Ta+15℃
Ta
0
Rated current
Fig. 5.3.5-1
Fig. 5.3.5-2
Ir (mA)
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5.4 Reliability Test
Items
5.4.1
Terminal
Strength
Requirements
Test Methods and Remarks
No removal or split of the termination or other defects
①
shall occur.
②
③
④
5.4.2
Resistance to
Flexure
①
No visible mechanical damage.
20
Unit: mm
10
②
③
④
R10
45
5.4.3
Vibration
①
②
③
45
No visible mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
Cu pad
Solder the inductor to the testing jig (glass
epoxy board) using eutectic solder. Then apply a force
in the direction of the arrow.
7N force.
Keep time: 10±1s
Speed: 1.0 mm/s.
Solder the inductor to the test jig. Using a eutectic
solder. Then apply a force in the direction shown as
left.
Flexure: 2mm
Pressurizing Speed: 0.5mm/sec.
Keep time: 5sec.
Flexure
①
②
Solder mask
③
Solder the inductor to the testing jig (glass epoxy
board )using eutectic solder.
The inductor shall be subjected to a simple harmonic
motion having total amplitude of 1.5mm, the frequency
being varied uniformly between the approximate limits
of 10 and 55 Hz.
The frequency range from 10 to 55 Hz and return to 10
Hz shall be traversed in approximately 1 minute. This
motion shall be applied for a period of 2 hours in each
3 mutually perpendicular directions (total of 6 hours)
Glass Epoxy Board
5.4.4
Dropping
①
②
③
5.4.5
Temperature
coefficient
+50±100ppm/℃
①
②
Between -40℃ and +125℃
With a reference value of +20℃
5.4.6
Solderability
90% or more of electrode area shall be
Coated by new solder.
①
Electrode of the coil shall be immersed in flux for 5 to
10 Seconds.
The coil shall be immersed in solder bath at a
temperature of 240±5℃, Duration for 3±0.5 seconds.
Solder: Sn/3.0Ag/0.5Cu
Flux: 25% Resin and 75% ethanol in weight.
No visible mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
Drop chip inductor 10 times on a concrete floor from a
height of 100 cm.
②
③
④
5.4.7
Resistance to
Soldering
Heat
①
②
③
No visible mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
Re-flowing Profile:
Max: 260℃/10sec
260℃
200℃
240℃
190℃
150℃
90±30sec.
20~40sec.
Gradual Cooling
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5.4.8
①
Thermal Shock ②
③
Wire Wound Chip Ceramic Inductor
①
No visible mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
+125℃
30 min.
②
③
④
Page 7 of 14
Temperature, Time:
-40℃ for 30±3 min→+125℃ for 30±3min
Transforming interval: 20s (max.)
Tested cycle: 100 cycles
The chip shall be stabilized at normal condition for 1~2
hours before measuring.
30 min.
Ambient
Temperature
-40℃
30 min.
20s (max.)
5.4.9
Resistance to
Low
Temperature
①
②
③
No visible mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
①
②
③
Temperature: -40±2℃
Duration: 1000+24 hours
The chip shall be stabilized at normal condition for 1~2
hours before measuring.
5.4.10
Resistance to
High
Temperature
①
②
③
No mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
①
②
③
Temperature: 125±2℃
Duration: 1000+24 hours
The chip shall be stabilized at normal condition for 1~2
hours before measuring.
5.4.11
Damp Heat
(Steady
States)
①
②
③
No mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
①
②
③
Temperature: 60±2℃, Humidity: 90% to 95% RH
Duration: 1000+24 hours
The chip shall be stabilized at normal condition for 1~2
hours before measuring.
5.4.12
①
Loading Under ②
Damp Heat
③
No mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
①
②
③
④
Temperature: 60±2℃ ,Humidity: 90% to 95% RH
Duration: 1000+24hours
Applied current: Rated current.
The chip shall be stabilized at normal condition for 1~2
hours before measuring.
①
②
③
No mechanical damage.
Inductance change: within ±5%
Q factor change: within ±20%
①
②
③
④
Temperature: 125±2℃
Duration: 1000+24hours
Applied current: Rated current.
The chip shall be stabilized at normal condition for 1~2
hours before measuring.
5.4.13
Loading at
High
Temperature
(Life Test)
6.
Packaging and Storage
6.1 Packaging
There is one type of packaging for the chip inductors. Please specify the packing code when ordering.
Tape Carrier Packaging:
Packaging code: T
i.
Tape carrier packaging are specified in attached figure Fig.6.1-1~5
ii.
Tape carrier packaging quantity please see the following table:
Type
1608
Tape
Paper Tape
Quantity
3K
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Wire Wound Chip Ceramic Inductor
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(1) Taping Drawings (Unit: mm)
Paper Tape
Top Tape
Paper
Sprocket Hole
Chip Cavity
Fig. 6.1-1
Remark: The sprocket holes are to the right as the tape is pulled toward the user.
(2) Taping Dimensions (Unit: mm)
T
1.75±0.1
Φ1.50 -0/+0.1
8.0±0.1
3.5±0.05
4.0±0.1
B
K
A
P
2.0±0.05
Fig. 6.1-2
Type
A
1608
1.17±0.05
图7.1-3
B
1.80±0.05
P
K
T
4.0±0.10
1.03±0.10
1.07±0.10
(3) Leader and blank portion
Fig. 6.1-3
图7.1-3
(4) Reel Dimensions (Unit: mm)
10±1.5
2.45±0.2
3.0±0.1
178±2
5.0±0.1
58±2
4.0±0.1
13.5±0.2
Sunlord
9
9
±
0
Fig. 6.1-4
.
图7.1-3
3
9
9
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(5) Peeling off force: 10gf to 70gf in the direction show below.
Top tape or cover tape
165°~ 180°
Base tape
Fig. 6.1-5
6.2 Storage
a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity.
Package must be stored at 40℃ or less and 70% RH or less.
b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas
(e.g. HCl, sulfurous gas of H2S)
c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight.
d. Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon as
possible.
e. Solderability shall be guaranteed for 12 months from the date of delivery on condition that they are stored at the environment specified
in specification. .For those parts, which passed more than 12 months shall be checked solder-ability before use.
7.
Warning and Attentions
7.1 Precautions on Use
a. Always wear static control bands to protect against ESD.
b. Any devices used (soldering iron, measuring instruments) should be properly grounded.
c. Use non-magnetic tweezers when handing the chips.
d. Pre-heating when soldering, and refer to the recommended condition specified in specification.
e. Don’t apply current in excess of the rated current value. It may cause damage to components due to over-current.
f.
Keep clear of anything that may generate magnetic fields such as speakers, coils.
g. When soldering, the electrical characteristics may be varied due to hot energy and mechanical stress.
h. When coating products with resin, the relatively high resin curing stress may change the electrical characteristics. For exterior coating,
select resin carefully so that electrical and mechanical performance of the product is not affected. Before using, please evaluate
reliability with the product mounted in your application set.
i.
When mount chips with adhesive in preliminary assembly, do appropriate check before the soldering stage, i.e., the size of land
pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use.
j.
Mounting density: Add special attention to radiating heat of products when mounting other components nearby. The excessive heat by
other products may cause deterioration at joint of this product with substrate.
k. Since some products are constructed like an open magnetic circuit, narrow spacing between components may cause magnetic
coupling.
l.
Please do not give the product any excessive mechanical shocks in transportation.
m. Please do not touch wires by sharp terminals such as tweezers to avoid causing any damage to wires.
n. Please do not add any shock and power to the soldered product to avoid causing any damage to chip body.
o. Please do not touch the electrodes by naked hand as the solderability of the external electrodes may deteriorate by grease or oil on
the skin.
7.2 PCB Bending Design
The following shall be considered when designing and laying out PCB’s.
a. PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection.
Products shall be located in the
sideways direction to the
(Poor example)
b.
(Good example)
mechanical stress.
Products location on PCB separation.
C
Separation
B
Product shall be located carefully because they may be
subjected to the mechanical stress in order of A>C=B>D.
A
D
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Wire Wound Chip Ceramic Inductor
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When splitting the PCB board, or insert (remove) connector, or fasten thread after mounting components, care is required so as not to
give any stress of deflection or twisting to the board. Because mechanical force may cause deterioration of the bonding strength of
electrode and solder, even crack of product body. Board separation should not be done manually, but by using appropriate devices.
7.3 Recommended PCB Design for SMT Land-Patterns
When chips are mounted on a PCB, the amount of solder used (size of fillet) and the size of PCB Land-Patterns can directly affect chip
performance (such as Q). And they can also cause other soldering question (such as offset and side lap). Therefore, the following items
must be carefully considered in the design of solder land patterns.
a. Please use the PCB pad and solder paste we recommend, and contact us in advance if they need to be changed.
b. Please use flux contained with resin since the highly acidic (Chlorine content more than 0.2 wt%) or water-soluble one could damage
the insulation film of wires, then causing short circuit of parts.
c. The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking.
Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form the fillets.
d. When more than one part is jointly soldered onto the same land or pad, the pad must be designed that each component’s soldering
point is separated by solder-resist.
Recommended land dimensions please refer to product specification.
8.
Recommended Soldering Technologies
This product is only for reflow soldering and iron soldering.
8.1 Re-flowing Profile
△ Preheat condition: 150~200℃/60~120sec.
△ Allowed time above 217C: 60~90sec.
△ Max temp: 260℃
△ Max time at max temp: 10sec.
△ Solder paste: Sn/3.0Ag/0.5Cu
△ Allowed Reflow time: 2 times max.
Peak 260℃max
260℃
Max Ramp Up Rate=3℃/sec.
217℃
Max Ramp Down Rate =6℃/sec.
60～90sec.
200℃
150℃
60～120sec.
25℃
Time 25℃ to Peak= 8 min Max
[Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board
assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters
as the Reflow profile shows.]
8.2
△
△
△
△
△
△
Iron Soldering Profile
Iron soldering power: 30W Max.
Preheat condition: 150℃/60sec.
Soldering tip temperature: 350℃ Max.
Soldering time: 3sec. Max.
Solder paste: Sn/3.0Ag/0.5Cu
Iron Soldering time: 1 time max.
3sec. Max.
350℃
Soldering Iron Power：
Max.30W
Diameter of Soldering：
Iron 1.0mm max.
Tc ℃
[Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.]
8.3
△
△
△
9.
Maintenance of heat gun (for your reference)
Power output: 30W
Temperature: 350℃ Max
Heat time: More than 5 seconds heating may cause short circuit of parts.
Solder Volume
Solder shall be used not to exceed as shown below.
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a.
b.
c.
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Wire Wound Chip Ceramic Inductor
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Accordingly increasing the solder volume, the mechanical stress to chip is also increased.Exceeding solder volume may cause the
failure of mechanical or electrical performance.
Before soldering, please ensure that the solder should not adhere to the wire part of chip.
Please pay particular attention to whether there is flux remaining on surface of the wire part of chip after subjected to reflow soldering
since this may causing short circuit of parts.
10. Cleaning
Products shall be cleaned on the following conditions:
a. Cleaning temperature shall be limited to 60℃ Max. (40℃ Max. for fluoride and alcohol type cleaner.)
b. Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and
PCB.
Power: 20W/l Max.
Frequency: 28 KHz to 40 KHz
Time: 5 minutes Max
c. Cleaner
i.
Alternative cleaner
Isopropyl alcohol (IPA)
HCFC-225
ii.
Aqueous agent
Surface Active Agent Type (Clean through-750H)
Hydrocarbon Type (Techno Cleaner-335)
Higher Alcohol Type (Pine Alpha ST-100S)
Alkali saponifier Type (※ Aqua Cleaner 240)
※ Alkali saponification shall be diluted to 20% volume with de-ionized water.
※ Please contact our technical service department before using other cleaner.
d. There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, product shall be dried
completely after rinse with de-ionized water in order to remove the cleaner.
e. Some products may become slightly whitened. However, product performance or usage is not affected.
f.
Please take care of winding part while cleaning.
g. After cleaning, parts could be subjected to the next reflow soldering till the solvent remaining on surface of parts being volatilized.
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Appendix A: Electrical Characteristics
ⅠSDWL1608C
STFN
Series
Part Number
Inductance
Tolerance
Min.
Quality
Factor
L/Q Test
Freq.
Max. DC
Resistance
Max. Rated
Current
Min.
Self-resonant
Frequency
Units
nH
-
-
MHz
Ω
mA
MHz
Symbol
L
-
Q
Freq.
DCR
Ir
S.R.F
SDWL1608C1N6□STFN01
1.6
S
24
250
0.030
700
12500
SDWL1608C1N8□STFN01
1.8
J, K
16
250
0.045
700
12500
SDWL1608C2N2□STFN01
2.2
J, K
13
250
0.250
100
12500
SDWL1608C2N7□STFN01
2.7
J, K
25
250
0.043
1000
6000
SDWL1608C3N3□STFN01
3.3
J, K
35
250
0.045
700
5900
SDWL1608C3N6□STFN01
3.6
J, K
22
250
0.063
700
5900
SDWL1608C3N9□STFN01
3.9
J, K
22
250
0.080
700
6900
SDWL1608C4N3□STFN01
4.3
J, K
22
250
0.063
700
5900
SDWL1608C4N7□STFN01
4.7
J, K
20
250
0.116
700
5800
SDWL1608C5N1□STFN01
5.1
J, K
20
250
0.140
700
5700
SDWL1608C5N6□STFN01
5.6
J, K
26
250
0.075
700
4760
SDWL1608C6N8□STFN01
6.8
G, J
27
250
0.110
700
5800
SDWL1608C7N5□STFN01
7.5
G, J
28
250
0.106
700
4800
SDWL1608C8N2□STFN01
8.2
G, J
30
250
0.115
700
4200
SDWL1608C8N7□STFN01
8.7
G, J
28
250
0.109
700
4600
SDWL1608C9N5□STFN01
9.5
G, J
28
250
0.135
700
5400
SDWL1608C10N□STFN01
10
G, J
31
250
0.130
700
4800
SDWL1608C11N□STFN01
11
G, J
30
250
0.130
700
4000
SDWL1608C12N□STFN01
12
G, J
35
250
0.130
700
4000
SDWL1608C15N□STFN01
15
G, J
35
250
0.170
700
4000
SDWL1608C16N□STFN01
16
G, J
34
250
0.17
700
3300
SDWL1608C18N□STFN01
18
G, J
35
250
0.170
700
3100
SDWL1608C22N□STFN01
22
G, J
38
250
0.190
700
3000
SDWL1608C23N□STFN01
23
G, J
38
250
0.19
700
2850
SDWL1608C24N□STFN01
24
G, J
36
250
0.190
700
2650
SDWL1608C27N□STFN01
27
G, J
40
250
0.220
600
2800
SDWL1608C30N□STFN01
30
G, J
37
250
0.220
600
2250
SDWL1608C33N□STFN01
33
G, J
40
250
0.220
600
2300
SDWL1608C36N□STFN01
36
G, J
37
250
0.250
600
2080
SDWL1608C39N□STFN01
39
G, J
40
250
0.250
600
2200
SDWL1608C43N□STFN01
43
G, J
38
250
0.280
600
2000
SDWL1608C47N□STFN01
47
G, J
38
200
0.280
600
2000
SDWL1608C51N□STFN01
51
G, J
35
200
0.250
600
1900
SDWL1608C56N□STFN01
56
G, J
38
200
0.310
600
1900
SDWL1608C68N□STFN01
68
G, J
37
200
0.340
600
1700
SDWL1608C72N□STFN01
72
G, J
34
150
0.490
400
1700
SDWL1608C82N□STFN01
82
G, J
34
150
0.540
400
1700
SDWL1608CR10□STFN01
100
G, J
34
150
0.580
400
1400
SDWL1608CR11□STFN01
110
G, J
32
150
0.610
300
1350
SDWL1608CR12□STFN01
120
G, J
32
150
0.650
300
1300
SDWL1608CR15□STFN01
150
G, J
28
150
0.920
280
990
Sunlord
Categories: general confidential
Wire Wound Chip Ceramic Inductor
Page 13 of 14
Part Number
Inductance
Tolerance
Min.
Quality
Factor
L/Q Test
Freq.
Max. DC
Resistance
Max. Rated
Current
Min.
Self-resonant
Frequency
Units
nH
-
-
MHz
Ω
mA
MHz
Symbol
L
-
Q
Freq.
DCR
Ir
S.R.F
SDWL1608CR18□STFN01
180
G, J
25
100
1.250
240
990
SDWL1608CR20□STFN01
200
G, J
25
100
1.980
200
900
SDWL1608CR21□STFN01
210
G, J
27
100
2.060
200
895
SDWL1608CR22□STFN01
220
G, J
25
100
2.100
200
900
SDWL1608CR23□STFN01
230
G, J
25
100
2.120
190
875
SDWL1608CR25□STFN01
250
G, J
25
100
3.550
120
822
SDWL1608CR27□STFN01
270
G, J
26
100
2.160
170
830
SDWL1608CR33□STFN01
330
G, J
25
100
3.890
100
900
SDWL1608CR39□STFN01
390
G, J
25
100
4.350
100
780
II. Typical Electrical Characteristics
Inductance vs. Frequency Characteristics
Q vs. Frequency Characteristics
1000
140
SDWL1005CS3N9
SDWL1608C3N9
□STFN01
SDWL1005CS47N
SDWL1608C47N□STFN01
SDWL1005CSR10
SDWL1608CR10□STFN01
120
100nH
S
S
100
100
3.9nH
47nH
80
47nH
Q
Inductance(nH)
SDWL1005CS3N9
SDWL1608C3N9□STFN01
SDWL1005CS47N
SDWL1608C47N□STFN01
SDWL1608CR10□STFN01
SDWL1005CSR10
60
10
3.9nH
40
100nH
20
0
1
10
100100
10001000
Frequency(MHz)
Frequency (MHz)
10000
10
100
1000
100
1000
Frequency(MHz)
Frequency (MHz)
10000
Sunlord
Categories: general confidential
Wire Wound Chip Ceramic Inductor
Page 14 of 14
Appendix B: Appearance standard
File No:
Applied to Wire Wound Ceramic Inductor Series
Effective date:
No.
Defect Item
Graphic
Item
Schematic Drawing
Rejection identification
Criteria
1
Wire off/
Welding
Spot Off
The solder joint Welding Spot of wire break away from
electrodes, or over the electrodes.
2
Solder
misplace
Solder joints are not at electrode side but at the coating
side or flank.
Coating side(Non-A region): if B≥0.20mm, NG.
B: Resin starved diameter ;
A: electrode region, A=0.48mm
3
Starvation
Flank: uncontrolled.
Coating at flank
4
Coating
misplace
Coating at electrodes side
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